FR2681728B1 - Structure combinee de radiateur et de bornes de connexion pour un circuit integre hybride, et procede de fabrication de ce circuit. - Google Patents
Structure combinee de radiateur et de bornes de connexion pour un circuit integre hybride, et procede de fabrication de ce circuit.Info
- Publication number
- FR2681728B1 FR2681728B1 FR9211322A FR9211322A FR2681728B1 FR 2681728 B1 FR2681728 B1 FR 2681728B1 FR 9211322 A FR9211322 A FR 9211322A FR 9211322 A FR9211322 A FR 9211322A FR 2681728 B1 FR2681728 B1 FR 2681728B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- hybrid integrated
- substrate
- same
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Une structure combinée de radiateur et de bornes de connexion pour un circuit intégré hybride comprend une plaque de dissipation de chaleur (2) devant être fixée par un adhésif sur un substrat (1) du circuit intégré hybride, et des bornes (4) à connecter au substrat. La plaque de dissipation de chaleur et les bornes sont formées en une seule pièce avec un cadre commun (5), dans une relation de position mutuelle prédéterminée qui est la même que celle qu'elles prendront par rapport au substrat lorsqu'elles seront connectées à ce dernier. Lorsqu'on utilise cette structure dans la fabrication d'un circuit intégré hybride, on commence par faire adhérer la plaque de dissipation de chaleur (2) au substrat (1), et on connecte ensuite les bornes (4) au substrat (1).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3242990A JPH0582685A (ja) | 1991-09-24 | 1991-09-24 | 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2681728A1 FR2681728A1 (fr) | 1993-03-26 |
FR2681728B1 true FR2681728B1 (fr) | 1994-07-22 |
Family
ID=17097258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9211322A Expired - Fee Related FR2681728B1 (fr) | 1991-09-24 | 1992-09-23 | Structure combinee de radiateur et de bornes de connexion pour un circuit integre hybride, et procede de fabrication de ce circuit. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5291372A (fr) |
JP (1) | JPH0582685A (fr) |
DE (1) | DE4231869C2 (fr) |
FR (1) | FR2681728B1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5561322A (en) * | 1994-11-09 | 1996-10-01 | International Business Machines Corporation | Semiconductor chip package with enhanced thermal conductivity |
KR0156622B1 (ko) * | 1995-04-27 | 1998-10-15 | 문정환 | 반도체 패키지,리드프레임 및 제조방법 |
US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
US5960535A (en) * | 1997-10-28 | 1999-10-05 | Hewlett-Packard Company | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
US6971160B1 (en) | 2002-01-03 | 2005-12-06 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid electrical circuit method with mated substrate carrier method |
EP1472728B1 (fr) * | 2002-02-06 | 2008-09-24 | Parker Hannifin Corporation | Materiaux de gestion thermique presentant une dispersion au changement de phase |
US6946190B2 (en) * | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
US9054530B2 (en) | 2013-04-25 | 2015-06-09 | General Atomics | Pulsed interrupter and method of operation |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
US3836825A (en) * | 1972-10-06 | 1974-09-17 | Rca Corp | Heat dissipation for power integrated circuit devices |
EP0086724A3 (fr) * | 1982-02-16 | 1985-04-24 | FAIRCHILD CAMERA & INSTRUMENT CORPORATION | Cadre de convexion pour circuit intégré comprenant une dissipation de puissance améliorée |
US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
JPS6054341A (ja) * | 1983-09-05 | 1985-03-28 | Chisso Corp | 液晶性炭酸エステル類 |
FR2625040B1 (fr) * | 1987-12-22 | 1991-01-04 | Cit Alcatel | Plot de report de connexion pour la fixation d'une broche a griffes sur la tranche d'un substrat de circuit hybride |
JPH064595Y2 (ja) * | 1988-02-24 | 1994-02-02 | 日本電気株式会社 | ハイブリッドic |
JPH01293551A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 半導体装置 |
US4994895A (en) * | 1988-07-11 | 1991-02-19 | Fujitsu Limited | Hybrid integrated circuit package structure |
JPH0240938A (ja) * | 1988-07-29 | 1990-02-09 | Ibiden Co Ltd | 混成集積回路装置 |
JPH0691174B2 (ja) * | 1988-08-15 | 1994-11-14 | 株式会社日立製作所 | 半導体装置 |
JPH0732215B2 (ja) * | 1988-10-25 | 1995-04-10 | 三菱電機株式会社 | 半導体装置 |
DD282328A5 (de) * | 1989-03-30 | 1990-09-05 | Halbleiterwerk Veb | Traegerstreifen mit integriertem waermeleitelement fuer aufsetzbare halbleitergehaeuse zur abfuehrung mittlerer verlustleistungen |
US5065281A (en) * | 1990-02-12 | 1991-11-12 | Rogers Corporation | Molded integrated circuit package incorporating heat sink |
IT1239644B (it) * | 1990-02-22 | 1993-11-11 | Sgs Thomson Microelectronics | Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza |
JPH0654341A (ja) * | 1992-07-28 | 1994-02-25 | Aiwa Co Ltd | ビデオ信号処理回路 |
-
1991
- 1991-09-24 JP JP3242990A patent/JPH0582685A/ja active Pending
-
1992
- 1992-09-23 DE DE4231869A patent/DE4231869C2/de not_active Expired - Fee Related
- 1992-09-23 US US07/949,144 patent/US5291372A/en not_active Expired - Fee Related
- 1992-09-23 FR FR9211322A patent/FR2681728B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2681728A1 (fr) | 1993-03-26 |
JPH0582685A (ja) | 1993-04-02 |
DE4231869C2 (de) | 1998-05-14 |
DE4231869A1 (de) | 1993-04-01 |
US5291372A (en) | 1994-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7217594B2 (en) | Alternative flip chip in leaded molded package design and method for manufacture | |
US8981464B2 (en) | Wafer level chip scale package and process of manufacture | |
US9425132B2 (en) | Stacked synchronous buck converter having chip embedded in outside recess of leadframe | |
EP1628345A3 (fr) | Boitier micro-électronique encapsulé refroidi par un fluide | |
US20080211104A1 (en) | High Temperature, Stable SiC Device Interconnects and Packages Having Low Thermal Resistance | |
EP0853358A3 (fr) | Module laser à semiconducteur avec une substrate améliorée métallique sur une élement du type peltier | |
EP1359627A3 (fr) | Module lumineux | |
TWI223881B (en) | Plural semiconductor devices in monolithic flip chip | |
EP0767495A3 (fr) | Empaquetage semi-conducteur du type pour montage en surface | |
KR980005941A (ko) | 분리가능하고 교환가능한 다이부착패들을 갖는 리드프레임 | |
TW200913198A (en) | Pre-molded clip structure | |
EP1326289A3 (fr) | Circuit intégré à semi-conducteuret procédé pour sa fabrication | |
TWI266428B (en) | Semiconductor chip package and application device thereof | |
FR2681728B1 (fr) | Structure combinee de radiateur et de bornes de connexion pour un circuit integre hybride, et procede de fabrication de ce circuit. | |
MY124877A (en) | Semiconductor integrated circuit device and method of manufacturing the same | |
TW201415596A (zh) | 無線模組 | |
JP2010524260A (ja) | 光カプラ・パッケージ | |
EP1686617A3 (fr) | Capteur d'image à l'état solide et son procédé de fabrication | |
US6376910B1 (en) | Solder-on back metal for semiconductor die | |
EP1199746A3 (fr) | Dispositif semi-conducteur en résine moulée avec des électrodes thermoconductrices | |
CN106449435A (zh) | 热沉极薄四方扁平无引线(hvqfn)封装 | |
US6770513B1 (en) | Thermally enhanced flip chip packaging arrangement | |
KR940027146A (ko) | 반도체 칩 모듈 | |
EP1113495A3 (fr) | Transistor de puissance monté en surface avec dissipateur thermique | |
JP2002141453A (ja) | リードフレーム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
D6 | Patent endorsed licences of rights | ||
ST | Notification of lapse |