FR2680277B1 - Procede et dispositif de support d'une plaquette semi-conductrice. - Google Patents

Procede et dispositif de support d'une plaquette semi-conductrice.

Info

Publication number
FR2680277B1
FR2680277B1 FR9115928A FR9115928A FR2680277B1 FR 2680277 B1 FR2680277 B1 FR 2680277B1 FR 9115928 A FR9115928 A FR 9115928A FR 9115928 A FR9115928 A FR 9115928A FR 2680277 B1 FR2680277 B1 FR 2680277B1
Authority
FR
France
Prior art keywords
supporting
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9115928A
Other languages
English (en)
Other versions
FR2680277A1 (fr
Inventor
Lee Masahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teikoku Seiki KK
Original Assignee
Teikoku Seiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teikoku Seiki KK filed Critical Teikoku Seiki KK
Publication of FR2680277A1 publication Critical patent/FR2680277A1/fr
Application granted granted Critical
Publication of FR2680277B1 publication Critical patent/FR2680277B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1734—Means bringing articles into association with web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
FR9115928A 1991-08-09 1991-12-20 Procede et dispositif de support d'une plaquette semi-conductrice. Expired - Fee Related FR2680277B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22515691A JPH05121543A (ja) 1991-08-09 1991-08-09 ウエハーマウンタのウエハー支持方法、その装置及びその装置を備えるウエハーマウンタ

Publications (2)

Publication Number Publication Date
FR2680277A1 FR2680277A1 (fr) 1993-02-12
FR2680277B1 true FR2680277B1 (fr) 1994-03-11

Family

ID=16824826

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9115928A Expired - Fee Related FR2680277B1 (fr) 1991-08-09 1991-12-20 Procede et dispositif de support d'une plaquette semi-conductrice.

Country Status (5)

Country Link
US (1) US5281297A (fr)
JP (1) JPH05121543A (fr)
DE (1) DE4142272C2 (fr)
FR (1) FR2680277B1 (fr)
GB (1) GB2259404B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168018B2 (ja) * 1991-03-22 2001-05-21 キヤノン株式会社 基板吸着保持方法
US6099215A (en) * 1994-06-02 2000-08-08 Quickmill Inc. Clamping device
US5743685A (en) * 1994-06-02 1998-04-28 Quickmill, Inc. Clamping device for a workpiece processing machine
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer
JPH1174164A (ja) 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
JP2002351082A (ja) * 2001-05-24 2002-12-04 Adtec Engineeng Co Ltd 露光装置用基板ステージ
AT502233B1 (de) * 2001-06-07 2007-04-15 Thallner Erich Vorrichtung zum lösen eines trägers von einer halbleiterscheibe
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE256952C (fr) *
US3955163A (en) * 1974-06-24 1976-05-04 The Computervision Corporation Method of positioning a semiconductor wafer for contact printing
JPS6060800A (ja) * 1983-09-13 1985-04-08 日東電工株式会社 リングと薄板の貼着装置
JPS60100450A (ja) * 1983-11-07 1985-06-04 Disco Abrasive Sys Ltd 半導体ウエーハ装着及び切断装置
US4603466A (en) * 1984-02-17 1986-08-05 Gca Corporation Wafer chuck
JPS62287639A (ja) * 1986-06-05 1987-12-14 Nitto Electric Ind Co Ltd 薄板回路基板における感圧性粘着テ−プの貼着方法
JPH0725463B2 (ja) * 1986-07-02 1995-03-22 富士通株式会社 半導体装置の製造方法
EP0252739B1 (fr) * 1986-07-09 1993-10-06 LINTEC Corporation Feuilles adhésives pour fixer des plaquettes
JPS63166243A (ja) * 1986-12-27 1988-07-09 Mitsubishi Electric Corp 半導体ウエハのテ−プ貼付装置
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
FR2631010B1 (fr) * 1988-05-06 1991-03-22 Sagem Dispositif de support et de regulation thermique d'une piece et appareillage de test de plaques de circuits semi-conducteurs incluant un tel dispositif
DE3943478C2 (de) * 1989-05-08 1995-11-16 Philips Electronics Nv Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage
JP2911997B2 (ja) * 1989-10-20 1999-06-28 日本電気株式会社 半導体ウェハーへのテープ貼付装置

Also Published As

Publication number Publication date
GB2259404A (en) 1993-03-10
FR2680277A1 (fr) 1993-02-12
JPH05121543A (ja) 1993-05-18
GB2259404B (en) 1995-03-08
DE4142272A1 (de) 1993-02-11
US5281297A (en) 1994-01-25
GB9124525D0 (en) 1992-01-08
DE4142272C2 (de) 1995-06-29

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Legal Events

Date Code Title Description
ST Notification of lapse