FR2670985B1 - Planche de cablage imprime, carte de circuit imprime et appareil electronique. - Google Patents

Planche de cablage imprime, carte de circuit imprime et appareil electronique.

Info

Publication number
FR2670985B1
FR2670985B1 FR9114010A FR9114010A FR2670985B1 FR 2670985 B1 FR2670985 B1 FR 2670985B1 FR 9114010 A FR9114010 A FR 9114010A FR 9114010 A FR9114010 A FR 9114010A FR 2670985 B1 FR2670985 B1 FR 2670985B1
Authority
FR
France
Prior art keywords
electronic apparatus
circuit board
printed circuit
wiring board
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9114010A
Other languages
English (en)
Other versions
FR2670985A1 (fr
Inventor
Takashi Ueki
Katsuhito Sakai
Koichi Kanda
Hideo Kamiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Gas Co Ltd
Aichi Tokei Denki Co Ltd
Original Assignee
Tokyo Gas Co Ltd
Aichi Tokei Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12019990U external-priority patent/JPH0476078U/ja
Priority claimed from JP2310701A external-priority patent/JP2721036B2/ja
Priority claimed from JP12963290U external-priority patent/JPH0485661U/ja
Application filed by Tokyo Gas Co Ltd, Aichi Tokei Denki Co Ltd filed Critical Tokyo Gas Co Ltd
Publication of FR2670985A1 publication Critical patent/FR2670985A1/fr
Application granted granted Critical
Publication of FR2670985B1 publication Critical patent/FR2670985B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F7/00—Volume-flow measuring devices with two or more measuring ranges; Compound meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/20—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow
    • G01F1/32—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow using swirl flowmeters
    • G01F1/3227—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow using swirl flowmeters using fluidic oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10863—Adaptations of leads or holes for facilitating insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Volume Flow (AREA)
FR9114010A 1990-11-15 1991-11-14 Planche de cablage imprime, carte de circuit imprime et appareil electronique. Expired - Fee Related FR2670985B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP12019990U JPH0476078U (fr) 1990-11-15 1990-11-15
JP2310701A JP2721036B2 (ja) 1990-11-15 1990-11-15 フルイディックガスメータ
JP31070290 1990-11-15
JP12963290U JPH0485661U (fr) 1990-11-30 1990-11-30

Publications (2)

Publication Number Publication Date
FR2670985A1 FR2670985A1 (fr) 1992-06-26
FR2670985B1 true FR2670985B1 (fr) 1994-05-27

Family

ID=27470663

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9114010A Expired - Fee Related FR2670985B1 (fr) 1990-11-15 1991-11-14 Planche de cablage imprime, carte de circuit imprime et appareil electronique.

Country Status (4)

Country Link
US (1) US5335553A (fr)
DE (1) DE4137690A1 (fr)
FR (1) FR2670985B1 (fr)
GB (1) GB2251129B (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5426381A (en) * 1994-05-23 1995-06-20 Motorola Inc. Latching ECL to CMOS input buffer circuit
WO1995033979A1 (fr) * 1994-06-03 1995-12-14 Tokyo Gas Co., Ltd. Debitmetre
JPH0969983A (ja) * 1995-08-30 1997-03-11 Matsushita Electric Ind Co Ltd 固体撮像装置
DE29514440U1 (de) * 1995-09-08 1995-11-09 Hella Kg Hueck & Co, 59557 Lippstadt Leiterplatte für ein elektrisches oder elektronisches Gerät
US6076392A (en) * 1997-08-18 2000-06-20 Metasensors, Inc. Method and apparatus for real time gas analysis
JP2002538431A (ja) 1999-02-25 2002-11-12 メタセンサーズ インコーポレイテッド リアルタイム流体解析装置及び方法
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
US6477900B2 (en) 2001-01-08 2002-11-12 Jet Sensor Ltd. Fluidic gas metering system
JP4877001B2 (ja) * 2007-03-26 2012-02-15 船井電機株式会社 コネクタ基板及びこれを用いたスピーカの入力端子の接続構造
CL2008002963A1 (es) 2007-10-04 2010-01-22 Nestec Sa Dispositivo calentador para una maquina para la preparacion de alimento liquido o bebida, que comprende una unidad termica con una masa metalica, a traves de la cual circula el liquido, y acumula calor y lo suministra al liquido, y tiene uno o mas componentes electricos asegurados en forma rigida a la unidad termica; y maquina.
AT517608B1 (de) * 2016-01-21 2017-03-15 Avl List Gmbh Elektronikeinheit für ein Durchflussmessgerät
US20190101411A1 (en) * 2017-09-26 2019-04-04 Pacific Gas And Electric Company Resource meter system and method
NL2026167B1 (en) 2020-07-30 2022-04-08 Berkin Bv Thermal-type flow sensor with a thermally conductive frame element in the form of a printed circuit board (PCB)
CN112525689B (zh) * 2020-11-27 2023-08-25 益阳市明正宏电子有限公司 一种线路板生产用强度检测装置
US20230041634A1 (en) * 2021-08-05 2023-02-09 Itron Global Sarl Cost Effective Pressure Sensors for Gas Meters

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板
US4610084A (en) * 1984-05-21 1986-09-09 At&T Technologies, Inc. Method and apparatus for inserting leads into holes in substrates
GB2172996B (en) * 1984-06-27 1987-07-15 Osaka Gas Co Ltd Fluidic flowmeter
US4550614A (en) * 1985-01-14 1985-11-05 Fischer & Porter Company Oscillatory flowmeter
JPS6319900A (ja) * 1986-07-09 1988-01-27 スア−マロイ、インコ−パレイテイド 電子部品用アラインメント装置
GB8720357D0 (en) * 1987-08-28 1987-10-07 Thorn Emi Flow Measurement Ltd Fluid metering system
DK160059C (da) * 1987-11-13 1991-06-10 Torben Bruno Rasmussen Flowmaaler for gas til husstandsbrug
DE3828910A1 (de) * 1988-08-26 1990-03-01 Vdo Schindling Anzeigeinstrument
JP2612615B2 (ja) * 1988-09-02 1997-05-21 富士写真フイルム株式会社 画像読取装置
US4932873A (en) * 1989-02-06 1990-06-12 Amphenol Interconnect Products Corporation Terminator assembly
JP2781063B2 (ja) * 1990-06-27 1998-07-30 東京瓦斯株式会社 フルイディック流量計

Also Published As

Publication number Publication date
US5335553A (en) 1994-08-09
GB2251129B (en) 1994-12-14
GB9124234D0 (en) 1992-01-08
GB2251129A (en) 1992-06-24
DE4137690A1 (de) 1992-10-08
FR2670985A1 (fr) 1992-06-26

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Legal Events

Date Code Title Description
ST Notification of lapse