FR2646557B1 - Procede pour former un film de semiconducteur polycristallin sur un substrat isolant - Google Patents

Procede pour former un film de semiconducteur polycristallin sur un substrat isolant

Info

Publication number
FR2646557B1
FR2646557B1 FR9005447A FR9005447A FR2646557B1 FR 2646557 B1 FR2646557 B1 FR 2646557B1 FR 9005447 A FR9005447 A FR 9005447A FR 9005447 A FR9005447 A FR 9005447A FR 2646557 B1 FR2646557 B1 FR 2646557B1
Authority
FR
France
Prior art keywords
forming
semiconductor film
insulating substrate
polycrystalline semiconductor
polycrystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9005447A
Other languages
English (en)
Other versions
FR2646557A1 (fr
Inventor
Kawakami Soichiro
Kanai Masahiro
Aoki Takeshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10292690A external-priority patent/JP2706995B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of FR2646557A1 publication Critical patent/FR2646557A1/fr
Application granted granted Critical
Publication of FR2646557B1 publication Critical patent/FR2646557B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02422Non-crystalline insulating materials, e.g. glass, polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/0256Selenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
FR9005447A 1989-04-28 1990-04-27 Procede pour former un film de semiconducteur polycristallin sur un substrat isolant Expired - Fee Related FR2646557B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10739289 1989-04-28
JP10739189 1989-04-28
JP10292690A JP2706995B2 (ja) 1989-04-28 1990-04-20 マイクロ波プラズマcvd法による多結晶半導体膜の形成方法

Publications (2)

Publication Number Publication Date
FR2646557A1 FR2646557A1 (fr) 1990-11-02
FR2646557B1 true FR2646557B1 (fr) 1997-07-18

Family

ID=27309839

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9005447A Expired - Fee Related FR2646557B1 (fr) 1989-04-28 1990-04-27 Procede pour former un film de semiconducteur polycristallin sur un substrat isolant

Country Status (2)

Country Link
DE (1) DE4013944C2 (fr)
FR (1) FR2646557B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9930603D0 (en) * 1999-12-24 2000-02-16 Surface Tech Sys Ltd Plasma process and apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371524A1 (fr) * 1976-11-18 1978-06-16 Alsthom Atlantique Procede de depot d'une couche mince par decomposition d'un gaz dans un plasma
US4691662A (en) * 1983-02-28 1987-09-08 Michigan State University Dual plasma microwave apparatus and method for treating a surface
DE3442208C3 (de) * 1984-11-19 1998-06-10 Leybold Ag Verfahren und Vorrichtung zum Herstellen harter Kohlenstoffschichten
KR920002864B1 (ko) * 1987-07-20 1992-04-06 가부시기가이샤 히다찌세이사꾸쇼 플라즈마 처리방법 및 그 장치

Also Published As

Publication number Publication date
DE4013944C2 (de) 1994-06-01
DE4013944A1 (de) 1990-11-08
FR2646557A1 (fr) 1990-11-02

Similar Documents

Publication Publication Date Title
DE3071589D1 (en) Method for forming an insulating film on a semiconductor substrate surface
DE2966093D1 (en) Method for forming an insulating film layer on a semiconductor substrate surface
FR2567684B1 (fr) Module ayant un substrat ceramique multicouche et un circuit multicouche sur ce substrat et procede pour sa fabrication
DE3275884D1 (en) A method for forming monocrystalline semiconductor film on insulating film
EP0451571A3 (en) Sputtering process for forming aluminum layer over stepped semiconductor wafer
IT8020407A0 (it) Substrato vetroceramico a piu'strati per il montaggio di un dispositivo semiconduttore.
FR2457912B1 (fr) Procede d'electro-deposition d'un metal sur un substrat
EP0160248A3 (en) Method of forming thin photoresist lines on the surface of a substrate
FR2494042B1 (fr) Dispositifs a semiconducteurs et procede pour fabriquer ces derniers
BE810777A (fr) Procede pour la fabrication de circuits imprimes sur les deux faces d 'un substrat en matiere ceramique
GB2193976B (en) Process for depositing a polysilicon film on a substrate
ES525658A0 (es) Un metodo para producir un dispositivo semiconductor de pelicula delgada
FR2560436B1 (fr) Procede de fabrication d'un dispositif a semi-conducteur comportant un film monocristallin sur un isolant
EP0415336A3 (en) Method for manufacturing thick film circuit substrate
EP0042175A3 (en) Semiconductor device having a semiconductor layer formed on an insulating substrate and method for making the same
DE3267467D1 (en) Process for manufacturing silicon thin-film transistors on an insulating substrate
FR2630617B1 (fr) Procede de fabrication d'un substrat conducteur multicouche
FR2643192B1 (fr) Procede de fabrication d'un dispositif semi-conducteur comprenant une electrode en metal refractaire sur un substrat semi-isolant
FR2572219B1 (fr) Procede de fabrication de circuits integres sur substrat isolant
BE859202A (fr) Procede pour la formation d'une couche pourvue d'une structure sur un substrat
FR2657490B1 (fr) Procede de mise en boitier scelle d'un substrat muni d'un circuit imprime.
FR2570085B1 (fr) Dispositif de formation de fines pellicules sur des substrats
FR2646557B1 (fr) Procede pour former un film de semiconducteur polycristallin sur un substrat isolant
FR2380636B1 (fr) Procede pour former une couche electriquement isolante sur un substrat
FR2631487B1 (fr) Procede de fabrication pour un dispositif a semi-conducteur comprenant la formation de motifs en metal

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20091231