FR2625067B1 - - Google Patents

Info

Publication number
FR2625067B1
FR2625067B1 FR8717900A FR8717900A FR2625067B1 FR 2625067 B1 FR2625067 B1 FR 2625067B1 FR 8717900 A FR8717900 A FR 8717900A FR 8717900 A FR8717900 A FR 8717900A FR 2625067 B1 FR2625067 B1 FR 2625067B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8717900A
Other languages
French (fr)
Other versions
FR2625067A1 (fr
Inventor
Gloton Jean-Pierre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Priority to FR8717900A priority Critical patent/FR2625067A1/fr
Priority to EP88403141A priority patent/EP0323295B1/fr
Priority to DE8888403141T priority patent/DE3877550T2/de
Priority to US07/283,305 priority patent/US4941257A/en
Priority to KR1019880017186A priority patent/KR890011511A/ko
Priority to JP63324766A priority patent/JP2931864B2/ja
Publication of FR2625067A1 publication Critical patent/FR2625067A1/fr
Application granted granted Critical
Publication of FR2625067B1 publication Critical patent/FR2625067B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H10W70/699—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W72/5449—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
FR8717900A 1987-12-22 1987-12-22 Procede pour fixer sur un support un composant electronique et ses contacts Granted FR2625067A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR8717900A FR2625067A1 (fr) 1987-12-22 1987-12-22 Procede pour fixer sur un support un composant electronique et ses contacts
EP88403141A EP0323295B1 (fr) 1987-12-22 1988-12-09 Procédé pour fixer sur un support un composant électronique et ses contacts
DE8888403141T DE3877550T2 (de) 1987-12-22 1988-12-09 Verfahren zum befestigen eines elektronischen bausteins und seiner kontakte auf einen traeger.
US07/283,305 US4941257A (en) 1987-12-22 1988-12-12 Method for fixing an electronic component and its contacts to a support
KR1019880017186A KR890011511A (ko) 1987-12-22 1988-12-20 지지부상에 전자부품 및 그 컨택(Contact)을 고정시키는 방법
JP63324766A JP2931864B2 (ja) 1987-12-22 1988-12-22 電子素子とそのコンタクトを基板上に固定する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8717900A FR2625067A1 (fr) 1987-12-22 1987-12-22 Procede pour fixer sur un support un composant electronique et ses contacts

Publications (2)

Publication Number Publication Date
FR2625067A1 FR2625067A1 (fr) 1989-06-23
FR2625067B1 true FR2625067B1 (cg-RX-API-DMAC10.html) 1995-05-19

Family

ID=9358142

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8717900A Granted FR2625067A1 (fr) 1987-12-22 1987-12-22 Procede pour fixer sur un support un composant electronique et ses contacts

Country Status (6)

Country Link
US (1) US4941257A (cg-RX-API-DMAC10.html)
EP (1) EP0323295B1 (cg-RX-API-DMAC10.html)
JP (1) JP2931864B2 (cg-RX-API-DMAC10.html)
KR (1) KR890011511A (cg-RX-API-DMAC10.html)
DE (1) DE3877550T2 (cg-RX-API-DMAC10.html)
FR (1) FR2625067A1 (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1002529A6 (nl) * 1988-09-27 1991-03-12 Bell Telephone Mfg Methode om een elektronische component te monteren en geheugen kaart waarin deze wordt toegepast.
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
FR2664721B1 (fr) * 1990-07-10 1992-09-25 Gemplus Card Int Carte a puce renforcee.
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
FR2724477B1 (fr) * 1994-09-13 1997-01-10 Gemplus Card Int Procede de fabrication de cartes sans contact
DE19632113C1 (de) 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
DE19708617C2 (de) 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
AU2006265765B2 (en) * 2005-07-04 2009-08-27 Griffith University Fabrication of electronic components in plastic
KR100651563B1 (ko) * 2005-07-07 2006-11-29 삼성전기주식회사 전자부품이 내장된 배선기판의 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1483570A (cg-RX-API-DMAC10.html) * 1965-06-23 1967-09-06
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3998377A (en) * 1974-12-09 1976-12-21 Teletype Corporation Method of and apparatus for bonding workpieces
FR2470414A1 (fr) * 1979-11-27 1981-05-29 Flonic Sa Systeme de connexion electrique et carte a memoire faisant application de ce systeme
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
DE3686990T2 (de) * 1985-08-23 1993-04-22 Nippon Electric Co Verfahren zum herstellen einer halbleiteranordnung wobei ein filmtraegerband angewendet wird.
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
FR2599165A1 (fr) * 1986-05-21 1987-11-27 Michot Gerard Objet associe a un element electronique et procede d'obtention

Also Published As

Publication number Publication date
US4941257A (en) 1990-07-17
JPH01198351A (ja) 1989-08-09
KR890011511A (ko) 1989-08-14
EP0323295B1 (fr) 1993-01-13
FR2625067A1 (fr) 1989-06-23
EP0323295A1 (fr) 1989-07-05
DE3877550D1 (de) 1993-02-25
JP2931864B2 (ja) 1999-08-09
DE3877550T2 (de) 1993-05-13

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Legal Events

Date Code Title Description
ST Notification of lapse