FR2614133B1 - Procede de production de contacts electriques a haut rendement avec du silicium amorphe n+ - Google Patents

Procede de production de contacts electriques a haut rendement avec du silicium amorphe n+

Info

Publication number
FR2614133B1
FR2614133B1 FR888805093A FR8805093A FR2614133B1 FR 2614133 B1 FR2614133 B1 FR 2614133B1 FR 888805093 A FR888805093 A FR 888805093A FR 8805093 A FR8805093 A FR 8805093A FR 2614133 B1 FR2614133 B1 FR 2614133B1
Authority
FR
France
Prior art keywords
high efficiency
amorphous silicon
electrical contacts
producing high
efficiency electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR888805093A
Other languages
English (en)
Other versions
FR2614133A1 (fr
Inventor
George Edward Possin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2614133A1 publication Critical patent/FR2614133A1/fr
Application granted granted Critical
Publication of FR2614133B1 publication Critical patent/FR2614133B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/974—Substrate surface preparation
FR888805093A 1987-04-20 1988-04-18 Procede de production de contacts electriques a haut rendement avec du silicium amorphe n+ Expired - Lifetime FR2614133B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/039,854 US4774207A (en) 1987-04-20 1987-04-20 Method for producing high yield electrical contacts to N+ amorphous silicon

Publications (2)

Publication Number Publication Date
FR2614133A1 FR2614133A1 (fr) 1988-10-21
FR2614133B1 true FR2614133B1 (fr) 1991-12-27

Family

ID=21907678

Family Applications (1)

Application Number Title Priority Date Filing Date
FR888805093A Expired - Lifetime FR2614133B1 (fr) 1987-04-20 1988-04-18 Procede de production de contacts electriques a haut rendement avec du silicium amorphe n+

Country Status (6)

Country Link
US (1) US4774207A (fr)
JP (1) JP2556550B2 (fr)
CA (1) CA1305398C (fr)
DE (1) DE3812135B4 (fr)
FR (1) FR2614133B1 (fr)
GB (1) GB2216144B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0283941A (ja) * 1988-09-21 1990-03-26 Fuji Xerox Co Ltd 薄膜トランジスタの製造方法
US6362028B1 (en) * 1999-08-19 2002-03-26 Industrial Technology Research Institute Method for fabricating TFT array and devices formed
KR101112538B1 (ko) * 2004-07-27 2012-03-13 삼성전자주식회사 박막 트랜지스터 표시판 및 그 제조 방법
TWI249251B (en) * 2004-11-22 2006-02-11 Au Optronics Corp Fabrication method of thin film transistor

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276688A (en) * 1980-01-21 1981-07-07 Rca Corporation Method for forming buried contact complementary MOS devices
JPS5846193B2 (ja) * 1980-07-15 1983-10-14 株式会社東芝 半導体装置
JPS5780739A (en) * 1980-11-07 1982-05-20 Hitachi Ltd Semiconductor integrated circuit device and manufacture thereof
JPS584924A (ja) * 1981-07-01 1983-01-12 Hitachi Ltd 半導体装置の電極形成方法
JPS59110179A (ja) * 1982-12-16 1984-06-26 Hitachi Ltd 半導体装置およびその製造法
JPS59138379A (ja) * 1983-01-27 1984-08-08 Toshiba Corp 半導体装置の製造方法
JPS59181070A (ja) * 1983-03-31 1984-10-15 Toshiba Corp 光起電力装置
JPS59232456A (ja) * 1983-06-16 1984-12-27 Hitachi Ltd 薄膜回路素子
JPS60180115A (ja) * 1984-02-27 1985-09-13 Matsushita Electric Ind Co Ltd 光起電力素子の製造方法
JPS60206073A (ja) * 1984-03-30 1985-10-17 Hitachi Ltd 薄膜トランジスタ
US4933296A (en) * 1985-08-02 1990-06-12 General Electric Company N+ amorphous silicon thin film transistors for matrix addressed liquid crystal displays
EP0211402B1 (fr) * 1985-08-02 1991-05-08 General Electric Company Procédé et structure pour une matrice à transistors à film mince adressant des dispositifs d'affichage à cristaux liquides
JPH06132577A (ja) * 1992-10-21 1994-05-13 Nippon Telegr & Teleph Corp <Ntt> 酸化物超伝導ジョセフソン素子の作製方法
JPH06267872A (ja) * 1993-03-11 1994-09-22 Nippon Steel Corp 化学気相成長装置

Also Published As

Publication number Publication date
DE3812135A1 (de) 1988-11-10
GB2216144A (en) 1989-10-04
GB8809190D0 (en) 1988-05-25
DE3812135B4 (de) 2005-09-29
JP2556550B2 (ja) 1996-11-20
GB2216144B (en) 1991-07-10
JPS63289946A (ja) 1988-11-28
CA1305398C (fr) 1992-07-21
US4774207A (en) 1988-09-27
FR2614133A1 (fr) 1988-10-21

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Legal Events

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TP Transmission of property