FR2566386A1 - Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique - Google Patents

Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique Download PDF

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Publication number
FR2566386A1
FR2566386A1 FR8409809A FR8409809A FR2566386A1 FR 2566386 A1 FR2566386 A1 FR 2566386A1 FR 8409809 A FR8409809 A FR 8409809A FR 8409809 A FR8409809 A FR 8409809A FR 2566386 A1 FR2566386 A1 FR 2566386A1
Authority
FR
France
Prior art keywords
lead
mixture
ink
oxides
equal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR8409809A
Other languages
English (en)
French (fr)
Inventor
Hugues Baudry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laboratoires dElectronique Philips SAS
Original Assignee
Laboratoires dElectronique et de Physique Appliquee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoires dElectronique et de Physique Appliquee filed Critical Laboratoires dElectronique et de Physique Appliquee
Priority to FR8409809A priority Critical patent/FR2566386A1/fr
Priority to US06/745,734 priority patent/US4684543A/en
Priority to DE8585200960T priority patent/DE3565392D1/de
Priority to EP85200960A priority patent/EP0167198B1/fr
Priority to JP60134401A priority patent/JPS6113502A/ja
Publication of FR2566386A1 publication Critical patent/FR2566386A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Inorganic Insulating Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
FR8409809A 1984-06-22 1984-06-22 Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique Withdrawn FR2566386A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8409809A FR2566386A1 (fr) 1984-06-22 1984-06-22 Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique
US06/745,734 US4684543A (en) 1984-06-22 1985-06-17 Starting mixture for an insulating composition comprising a lead glass, silk-screening ink comprising such a mixture, and the use of said ink for the protection of hybrid microcircuits on ceramic substrates
DE8585200960T DE3565392D1 (en) 1984-06-22 1985-06-18 Starting mixture for an isolating composition containing a lead glass, screen printing ink comprising such a mixture, and use of this ink for protecting hybrid microcircuits on ceramic substrates
EP85200960A EP0167198B1 (fr) 1984-06-22 1985-06-18 Mélange de départ pour une composition isolante comprenant un verre au plomb, encre sérigraphiable comportant un tel mélange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat céramique
JP60134401A JPS6113502A (ja) 1984-06-22 1985-06-21 絶縁性組成物用の出発混合物並びにそれを用いたシルク・スクリーン印刷用インク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8409809A FR2566386A1 (fr) 1984-06-22 1984-06-22 Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique

Publications (1)

Publication Number Publication Date
FR2566386A1 true FR2566386A1 (fr) 1985-12-27

Family

ID=9305307

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8409809A Withdrawn FR2566386A1 (fr) 1984-06-22 1984-06-22 Melange de depart pour une composition isolante comprenant un verre au plomb, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la protection de microcircuits hybrides sur substrat ceramique

Country Status (5)

Country Link
US (1) US4684543A (enExample)
EP (1) EP0167198B1 (enExample)
JP (1) JPS6113502A (enExample)
DE (1) DE3565392D1 (enExample)
FR (1) FR2566386A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4725480A (en) * 1985-09-24 1988-02-16 John Fluke Mfg. Co., Inc. Hermetically sealed electronic component
JPS62146704A (ja) * 1985-12-23 1987-06-30 Yokohama Rubber Co Ltd:The 空気入りタイヤ
US4866411A (en) * 1988-03-25 1989-09-12 Caddock Richard E Film-type cylindrical resistor, and method of making it
US5116641A (en) * 1990-08-20 1992-05-26 Ford Motor Company Method for laser scribing substrates
JP2757574B2 (ja) * 1991-03-14 1998-05-25 日本電気株式会社 低誘電率ハイブリッド多層セラミック配線基板の製造方法
JP2627488B2 (ja) * 1994-06-15 1997-07-09 ヒカリ電工株式会社 装飾模様を有するガラス製品の製造方法
US6437507B2 (en) * 1997-11-07 2002-08-20 Lg Electronics Inc. Hollow cathode type color PDP

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0068565A1 (fr) * 1981-06-19 1983-01-05 Laboratoires D'electronique Et De Physique Appliquee L.E.P. Mélange de départ pour une encre sérigraphiable contenant un verre au plomb à cuire en atmosphère non oxydante et encre sérigraphiable obtenue
EP0084936A1 (en) * 1982-01-21 1983-08-03 Kabushiki Kaisha Toshiba Glass composition for covering semiconductor elements

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2305478A1 (fr) * 1975-03-25 1976-10-22 Labo Electronique Physique Pate serigraphiable pour conducteurs en couches epaisses a deposer sur un substrat ceramique et procede de preparation de couches conductrices utilisant une telle pate
US4108786A (en) * 1975-12-16 1978-08-22 Mita Industrial Company Ltd. Magnetic dry developer for electrostatic photography and process for preparation thereof
FR2388381A1 (fr) * 1976-12-27 1978-11-17 Labo Electronique Physique Composition dielectrique, pate serigraphiable comportant une telle composition et produits obtenus
FR2490210A1 (fr) * 1980-09-15 1982-03-19 Labo Electronique Physique Melange de depart pour une composition fortement resistante, encre serigraphiable constituee avec et circuits electriques ainsi realises
US4369254A (en) * 1980-10-17 1983-01-18 Rca Corporation Crossover dielectric inks
US4388347A (en) * 1980-11-11 1983-06-14 Uop Inc. Conductive pigment-coated surfaces
JPS57122592A (en) * 1981-01-23 1982-07-30 Tokyo Shibaura Electric Co Method of producing hybrid integrated circuit
US4431451A (en) * 1981-02-24 1984-02-14 American Dental Association Health Foundation Dental material
US4415624A (en) * 1981-07-06 1983-11-15 Rca Corporation Air-fireable thick film inks
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
US4604298A (en) * 1985-02-12 1986-08-05 Gulton Industries, Inc. Finger line screen printing method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0068565A1 (fr) * 1981-06-19 1983-01-05 Laboratoires D'electronique Et De Physique Appliquee L.E.P. Mélange de départ pour une encre sérigraphiable contenant un verre au plomb à cuire en atmosphère non oxydante et encre sérigraphiable obtenue
EP0084936A1 (en) * 1982-01-21 1983-08-03 Kabushiki Kaisha Toshiba Glass composition for covering semiconductor elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 91, 1979, page 247, réf. no. 144797s, Columbus Ohio, US; G.I. ARTAMONOVA et al.: "Use of insulating glass in hybrid integrated circuits with an aluminum plating system". & STEKLO 1978, (2), 78-81 *

Also Published As

Publication number Publication date
DE3565392D1 (en) 1988-11-10
JPH0531512B2 (enExample) 1993-05-12
EP0167198B1 (fr) 1988-10-05
EP0167198A1 (fr) 1986-01-08
US4684543A (en) 1987-08-04
JPS6113502A (ja) 1986-01-21

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