FR2548452B1 - Dispositif a couche mince, notamment transistor - Google Patents

Dispositif a couche mince, notamment transistor

Info

Publication number
FR2548452B1
FR2548452B1 FR8409381A FR8409381A FR2548452B1 FR 2548452 B1 FR2548452 B1 FR 2548452B1 FR 8409381 A FR8409381 A FR 8409381A FR 8409381 A FR8409381 A FR 8409381A FR 2548452 B1 FR2548452 B1 FR 2548452B1
Authority
FR
France
Prior art keywords
thin film
film device
especially transistor
transistor
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8409381A
Other languages
English (en)
Other versions
FR2548452A1 (fr
Inventor
Akira Sasano
Kouichi Seki
Hideaki Yamamoto
Toru Baji
Toshihisa Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2548452A1 publication Critical patent/FR2548452A1/fr
Application granted granted Critical
Publication of FR2548452B1 publication Critical patent/FR2548452B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20Resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon
    • H01L29/458Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
FR8409381A 1983-06-16 1984-06-15 Dispositif a couche mince, notamment transistor Expired FR2548452B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58106798A JPS59232456A (ja) 1983-06-16 1983-06-16 薄膜回路素子

Publications (2)

Publication Number Publication Date
FR2548452A1 FR2548452A1 (fr) 1985-01-04
FR2548452B1 true FR2548452B1 (fr) 1986-05-30

Family

ID=14442895

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8409381A Expired FR2548452B1 (fr) 1983-06-16 1984-06-15 Dispositif a couche mince, notamment transistor

Country Status (3)

Country Link
US (1) US4618873A (fr)
JP (1) JPS59232456A (fr)
FR (1) FR2548452B1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170254A (ja) * 1984-02-15 1985-09-03 Fuji Xerox Co Ltd 原稿読取装置
US5166086A (en) * 1985-03-29 1992-11-24 Matsushita Electric Industrial Co., Ltd. Thin film transistor array and method of manufacturing same
DE3680806D1 (de) * 1985-03-29 1991-09-19 Matsushita Electric Ind Co Ltd Duennschicht-transistorenanordnung und methode zu deren herstellung.
US4855806A (en) * 1985-08-02 1989-08-08 General Electric Company Thin film transistor with aluminum contacts and nonaluminum metallization
JPH0746729B2 (ja) * 1985-12-26 1995-05-17 キヤノン株式会社 薄膜トランジスタの製造方法
JPH0656883B2 (ja) * 1986-03-03 1994-07-27 鐘淵化学工業株式会社 半導体装置
US4704783A (en) * 1986-05-05 1987-11-10 General Electric Company Method for passivating the back channel of amorphous silicon field effect transistors
US4803536A (en) * 1986-10-24 1989-02-07 Xerox Corporation Electrostatic discharge protection network for large area transducer arrays
US4774207A (en) * 1987-04-20 1988-09-27 General Electric Company Method for producing high yield electrical contacts to N+ amorphous silicon
FR2614726A1 (fr) * 1987-04-30 1988-11-04 Seiko Instr Inc Resistance a couche mince et procede de fabrication
US5210438A (en) * 1989-05-18 1993-05-11 Fujitsu Limited Semiconductor resistance element and process for fabricating same
JPH02303154A (ja) * 1989-05-18 1990-12-17 Fujitsu Ltd 半導体装置の製造方法
JP2558351B2 (ja) * 1989-06-29 1996-11-27 沖電気工業株式会社 アクティブマトリクス表示パネル
US5225364A (en) * 1989-06-26 1993-07-06 Oki Electric Industry Co., Ltd. Method of fabricating a thin-film transistor matrix for an active matrix display panel
JPH07112053B2 (ja) * 1990-04-13 1995-11-29 富士ゼロックス株式会社 薄膜スイッチング素子アレイ
KR940008883B1 (ko) * 1992-04-08 1994-09-28 삼성전자 주식회사 박막저항의 제조방법
JP2887032B2 (ja) * 1992-10-30 1999-04-26 シャープ株式会社 薄膜トランジスタ回路およびその製造方法
US5539219A (en) * 1995-05-19 1996-07-23 Ois Optical Imaging Systems, Inc. Thin film transistor with reduced channel length for liquid crystal displays
US5532180A (en) * 1995-06-02 1996-07-02 Ois Optical Imaging Systems, Inc. Method of fabricating a TFT with reduced channel length
US5650358A (en) * 1995-08-28 1997-07-22 Ois Optical Imaging Systems, Inc. Method of making a TFT having a reduced channel length
JP6578676B2 (ja) * 2015-03-03 2019-09-25 セイコーエプソン株式会社 画像読取装置および半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4181913A (en) * 1977-05-31 1980-01-01 Xerox Corporation Resistive electrode amorphous semiconductor negative resistance device
US4128670A (en) * 1977-11-11 1978-12-05 International Business Machines Corporation Fabrication method for integrated circuits with polysilicon lines having low sheet resistance
US4297721A (en) * 1978-11-03 1981-10-27 Mostek Corporation Extremely low current load device for integrated circuit
US4369372A (en) * 1979-06-18 1983-01-18 Canon Kabushiki Kaisha Photo electro transducer device
JPS57141962A (en) * 1981-02-27 1982-09-02 Hitachi Ltd Semiconductor integrated circuit device
JPS5858753A (ja) * 1981-10-02 1983-04-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
FR2515427A1 (fr) * 1981-10-27 1983-04-29 Efcis Procede de fabrication de resistances de forte valeur pour circuits integres

Also Published As

Publication number Publication date
US4618873A (en) 1986-10-21
JPS59232456A (ja) 1984-12-27
FR2548452A1 (fr) 1985-01-04
JPH0454980B2 (fr) 1992-09-01

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Legal Events

Date Code Title Description
ST Notification of lapse
ST Notification of lapse