FR2517503B1 - Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base - Google Patents

Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base

Info

Publication number
FR2517503B1
FR2517503B1 FR8219980A FR8219980A FR2517503B1 FR 2517503 B1 FR2517503 B1 FR 2517503B1 FR 8219980 A FR8219980 A FR 8219980A FR 8219980 A FR8219980 A FR 8219980A FR 2517503 B1 FR2517503 B1 FR 2517503B1
Authority
FR
France
Prior art keywords
noble
pattern
metal
base
oxides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8219980A
Other languages
English (en)
Other versions
FR2517503A1 (fr
Inventor
Akihiro Dohya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19051881A external-priority patent/JPS5893297A/ja
Priority claimed from JP8291782A external-priority patent/JPS58199589A/ja
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of FR2517503A1 publication Critical patent/FR2517503A1/fr
Application granted granted Critical
Publication of FR2517503B1 publication Critical patent/FR2517503B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR8219980A 1981-11-30 1982-11-29 Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base Expired FR2517503B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19051881A JPS5893297A (ja) 1981-11-30 1981-11-30 導体回路の形成方法
JP8291782A JPS58199589A (ja) 1982-05-17 1982-05-17 配線基板

Publications (2)

Publication Number Publication Date
FR2517503A1 FR2517503A1 (fr) 1983-06-03
FR2517503B1 true FR2517503B1 (fr) 1986-02-07

Family

ID=26423947

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8219980A Expired FR2517503B1 (fr) 1981-11-30 1982-11-29 Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base

Country Status (2)

Country Link
US (2) US4628149A (fr)
FR (1) FR2517503B1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628149A (en) * 1981-11-30 1986-12-09 Nippon Electric Co., Ltd. Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
DE3675321D1 (de) * 1985-08-16 1990-12-06 Dai Ichi Seiko Co Ltd Halbleiteranordnung mit packung vom steckerstifttyp.
CN1003524B (zh) * 1985-10-14 1989-03-08 株式会社日立制作所 无电浸镀金溶液
US4855871A (en) * 1987-03-05 1989-08-08 Optical Materials, Inc. Thin film semiconductor interconnect module
JPS6418246A (en) * 1987-07-14 1989-01-23 Shinko Electric Ind Co Lead frame for semiconductor device
US4931144A (en) * 1987-07-31 1990-06-05 Texas Instruments Incorporated Self-aligned nonnested sloped via
JPH02324A (ja) * 1987-12-18 1990-01-05 Mitsui Mining & Smelting Co Ltd 導電膜回路およびその製造方法
US4910643A (en) * 1988-06-06 1990-03-20 General Electric Company Thick film, multi-layer, ceramic interconnected circuit board
KR920005459B1 (ko) * 1988-08-30 1992-07-04 가부시기가이샤 히다찌세이사꾸쇼 금속의 균질화방법 및 회로기판
US5183973A (en) * 1989-08-14 1993-02-02 Santa Barbara Research Center Flexible cable for interconnecting electronic components
JPH0383398A (ja) * 1989-08-26 1991-04-09 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
US5127998A (en) * 1990-01-02 1992-07-07 General Electric Company Area-selective metallization process
US5230965A (en) * 1990-01-02 1993-07-27 General Electric Company High density interconnect with electroplated conductors
JP3271272B2 (ja) * 1991-11-12 2002-04-02 日本電気株式会社 半導体装置の製造方法
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US6515233B1 (en) * 2000-06-30 2003-02-04 Daniel P. Labzentis Method of producing flex circuit with selectively plated gold
US6761963B2 (en) * 2000-09-21 2004-07-13 Michael D. Casper Integrated thin film capacitor/inductor/interconnect system and method
US6890629B2 (en) * 2001-09-21 2005-05-10 Michael D. Casper Integrated thin film capacitor/inductor/interconnect system and method
DE102006060408A1 (de) * 2006-12-20 2008-06-26 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung korrosionsbeständiger Metalloberflächen und Reflektor mit metallischer Oberfläche
KR101148226B1 (ko) * 2010-05-24 2012-05-22 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US9425090B2 (en) * 2014-09-19 2016-08-23 Infineon Technologies Austria Ag Method of electrodepositing gold on a copper seed layer to form a gold metallization structure

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2780543A (en) * 1955-05-17 1957-02-05 Baker & Co Inc High resistivity alloy
US3386894A (en) * 1964-09-28 1968-06-04 Northern Electric Co Formation of metallic contacts
DE1765945A1 (de) * 1968-08-14 1971-12-02 Ibm Deutschland Verfahren zum Herstellen einer gedruckten Schaltung mit in mehreren Ebenen verlaufenden flaechenhaften Leiterzuegen
GB1287791A (en) * 1968-10-31 1972-09-06 Honeywell Inf Systems A microcircuit and manufacture of same
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3576722A (en) * 1969-03-26 1971-04-27 Bendix Corp Method for metalizing ceramics
US3663279A (en) * 1969-11-19 1972-05-16 Bell Telephone Labor Inc Passivated semiconductor devices
GB1369627A (en) * 1970-12-18 1974-10-09 Hitachi Ltd Method for manufacturing a printed ceramic substrate
US4014689A (en) * 1972-05-10 1977-03-29 Siemens Aktiengesellschaft Method of fabricating a contact material for high-power vacuum circuit breakers
US3808049A (en) * 1972-06-02 1974-04-30 Microsystems Int Ltd Multi-layer thin-film circuits
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
US4153518A (en) * 1977-11-18 1979-05-08 Tektronix, Inc. Method of making a metalized substrate having a thin film barrier layer
JPS54127414A (en) * 1978-03-27 1979-10-03 Tokyo Shibaura Electric Co Metallizing ceramic substrate
JPS5563900A (en) * 1978-11-08 1980-05-14 Fujitsu Ltd Multilyaer ceramic circuit board
JPS55115392A (en) * 1979-02-27 1980-09-05 Tokyo Shibaura Electric Co Method of fabricating hybrid circuit board
JPS5649535A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
FR2476913B1 (fr) * 1980-02-25 1985-09-13 Nippon Electric Co Circuit a plusieurs couches pour integration a grande echelle et procede de fabrication de ce circuit
EP0074605B1 (fr) * 1981-09-11 1990-08-29 Kabushiki Kaisha Toshiba Procédé pour fabriquer un substrat pour circuit multicouches
US4628149A (en) * 1981-11-30 1986-12-09 Nippon Electric Co., Ltd. Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals

Also Published As

Publication number Publication date
US4628149A (en) 1986-12-09
FR2517503A1 (fr) 1983-06-03
US4786523A (en) 1988-11-22

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Legal Events

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ST Notification of lapse