FR2515428A1 - Boitier comportant au moins deux circuits integres - Google Patents

Boitier comportant au moins deux circuits integres Download PDF

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Publication number
FR2515428A1
FR2515428A1 FR8120164A FR8120164A FR2515428A1 FR 2515428 A1 FR2515428 A1 FR 2515428A1 FR 8120164 A FR8120164 A FR 8120164A FR 8120164 A FR8120164 A FR 8120164A FR 2515428 A1 FR2515428 A1 FR 2515428A1
Authority
FR
France
Prior art keywords
integrated circuits
connections
housing according
layer
oblique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8120164A
Other languages
English (en)
French (fr)
Other versions
FR2515428B1 (enExample
Inventor
Pierrick Descure
Jean-Ernest Fraleux
Jean-Philippe Reboul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8120164A priority Critical patent/FR2515428A1/fr
Priority to EP82401898A priority patent/EP0078194A1/fr
Priority to JP57187633A priority patent/JPS5882555A/ja
Publication of FR2515428A1 publication Critical patent/FR2515428A1/fr
Application granted granted Critical
Publication of FR2515428B1 publication Critical patent/FR2515428B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H10W70/05—
    • H10W70/698—
    • H10W90/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06524—Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H10W70/093—
    • H10W70/60—
    • H10W90/22—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR8120164A 1981-10-27 1981-10-27 Boitier comportant au moins deux circuits integres Granted FR2515428A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR8120164A FR2515428A1 (fr) 1981-10-27 1981-10-27 Boitier comportant au moins deux circuits integres
EP82401898A EP0078194A1 (fr) 1981-10-27 1982-10-15 Procédé de fabrication d'un boîtier comportant au moins deux circuits intégrés
JP57187633A JPS5882555A (ja) 1981-10-27 1982-10-27 ２つ以上の集積回路を収納するボツクスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8120164A FR2515428A1 (fr) 1981-10-27 1981-10-27 Boitier comportant au moins deux circuits integres

Publications (2)

Publication Number Publication Date
FR2515428A1 true FR2515428A1 (fr) 1983-04-29
FR2515428B1 FR2515428B1 (enExample) 1985-01-18

Family

ID=9263433

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8120164A Granted FR2515428A1 (fr) 1981-10-27 1981-10-27 Boitier comportant au moins deux circuits integres

Country Status (3)

Country Link
EP (1) EP0078194A1 (enExample)
JP (1) JPS5882555A (enExample)
FR (1) FR2515428A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2153144A (en) * 1984-01-13 1985-08-14 Standard Telephones Cables Ltd Circuit packaging
FR2572849B1 (fr) * 1984-11-06 1987-06-19 Thomson Csf Module monolithique haute densite comportant des composants electroniques interconnectes et son procede de fabrication
JP2566207B2 (ja) * 1986-09-23 1996-12-25 シーメンス、アクチエンゲゼルシヤフト 半導体デバイス
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
US5079835A (en) * 1990-10-12 1992-01-14 Atmel Corporation Method of forming a carrierless surface mounted integrated circuit die
JP4727505B2 (ja) * 2006-06-06 2011-07-20 本田技研工業株式会社 テンショナ装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1567695A (enExample) * 1967-06-06 1969-05-16
GB1250248A (enExample) * 1969-06-12 1971-10-20
GB2047466A (en) * 1979-02-24 1980-11-26 Int Computers Ltd Multi level connection networks
DE2930460A1 (de) * 1979-07-27 1981-01-29 Licentia Gmbh Halbleiterbauelement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1567695A (enExample) * 1967-06-06 1969-05-16
GB1250248A (enExample) * 1969-06-12 1971-10-20
GB2047466A (en) * 1979-02-24 1980-11-26 Int Computers Ltd Multi level connection networks
DE2930460A1 (de) * 1979-07-27 1981-01-29 Licentia Gmbh Halbleiterbauelement

Also Published As

Publication number Publication date
FR2515428B1 (enExample) 1985-01-18
JPS5882555A (ja) 1983-05-18
EP0078194A1 (fr) 1983-05-04

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