FR2506075A1 - Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection - Google Patents

Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Info

Publication number
FR2506075A1
FR2506075A1 FR8109817A FR8109817A FR2506075A1 FR 2506075 A1 FR2506075 A1 FR 2506075A1 FR 8109817 A FR8109817 A FR 8109817A FR 8109817 A FR8109817 A FR 8109817A FR 2506075 A1 FR2506075 A1 FR 2506075A1
Authority
FR
France
Prior art keywords
semiconductor device
frame
assembling
protective housing
slab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8109817A
Other languages
English (en)
French (fr)
Other versions
FR2506075B1 (enExample
Inventor
Francis Pierre Roche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8109817A priority Critical patent/FR2506075A1/fr
Priority to DE19823217345 priority patent/DE3217345A1/de
Priority to NLAANVRAGE8202010,A priority patent/NL186206C/xx
Priority to GB8214182A priority patent/GB2098801B/en
Priority to IT21289/82A priority patent/IT1152406B/it
Priority to KR8202125A priority patent/KR900002119B1/ko
Priority to JP57080878A priority patent/JPS57196549A/ja
Publication of FR2506075A1 publication Critical patent/FR2506075A1/fr
Application granted granted Critical
Publication of FR2506075B1 publication Critical patent/FR2506075B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8109817A 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection Granted FR2506075A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
DE19823217345 DE3217345A1 (de) 1981-05-18 1982-05-08 Verfahren zum zusammenbauen einer halbleiteranordnung und des schutzgehaeuses derselben
NLAANVRAGE8202010,A NL186206C (nl) 1981-05-18 1982-05-14 Werkwijze voor het assembleren van een halfgeleiderinrichting en het beschermingshuis ervan.
GB8214182A GB2098801B (en) 1981-05-18 1982-05-14 Method of assembling a semiconductor package
IT21289/82A IT1152406B (it) 1981-05-18 1982-05-14 Metodo di assemblaggio di un dispositivo semiconduttore e del proprio contenitore protettivo
KR8202125A KR900002119B1 (ko) 1981-05-18 1982-05-15 반도체 장치 및 그 보호외피의 조립방법
JP57080878A JPS57196549A (en) 1981-05-18 1982-05-15 Method of assembling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8109817A FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Publications (2)

Publication Number Publication Date
FR2506075A1 true FR2506075A1 (fr) 1982-11-19
FR2506075B1 FR2506075B1 (enExample) 1984-10-19

Family

ID=9258561

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8109817A Granted FR2506075A1 (fr) 1981-05-18 1981-05-18 Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection

Country Status (7)

Country Link
JP (1) JPS57196549A (enExample)
KR (1) KR900002119B1 (enExample)
DE (1) DE3217345A1 (enExample)
FR (1) FR2506075A1 (enExample)
GB (1) GB2098801B (enExample)
IT (1) IT1152406B (enExample)
NL (1) NL186206C (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617647A (ja) * 1984-06-21 1986-01-14 Toshiba Corp 回路基板
JPS61218151A (ja) * 1985-03-23 1986-09-27 Hitachi Ltd 半導体装置
JP2712461B2 (ja) * 1988-12-27 1998-02-10 日本電気株式会社 半導体装置の容器
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
DE4201931C1 (enExample) * 1992-01-24 1993-05-27 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh + Co.Kg, 4788 Warstein, De

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
DE1564308A1 (de) * 1965-02-17 1969-09-25 Motorola Inc Transistorhalterung
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US4067040A (en) * 1975-12-12 1978-01-03 Nippon Electric Company, Ltd. Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
DE1564815A1 (de) * 1966-08-27 1970-02-26 Standard Elek K Lorenz Ag Verfahren zum Einbau von Halbleiteranordnungen in miniaturisierte Schaltungen
JPS5116258B2 (enExample) * 1971-10-30 1976-05-22
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1468122A (fr) * 1965-02-17 1967-02-03 Motorola Inc Boîtier pour semi-conducteurs
DE1564308A1 (de) * 1965-02-17 1969-09-25 Motorola Inc Transistorhalterung
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US4067040A (en) * 1975-12-12 1978-01-03 Nippon Electric Company, Ltd. Semiconductor device

Also Published As

Publication number Publication date
IT8221289A0 (it) 1982-05-14
NL186206B (nl) 1990-05-01
GB2098801B (en) 1985-01-03
JPH0119269B2 (enExample) 1989-04-11
JPS57196549A (en) 1982-12-02
GB2098801A (en) 1982-11-24
FR2506075B1 (enExample) 1984-10-19
KR900002119B1 (ko) 1990-04-02
DE3217345A1 (de) 1982-12-02
DE3217345C2 (enExample) 1987-07-02
NL186206C (nl) 1990-10-01
IT1152406B (it) 1986-12-31
NL8202010A (nl) 1982-12-16
KR840000076A (ko) 1984-01-30

Similar Documents

Publication Publication Date Title
FR2502869B1 (fr) Moniteur de surveillance de perturbations des parametres de fonctionnement d'une ligne electrique et procede pour sa mise en oeuvre
NO870893D0 (no) Apparat for behandling av smeltet metall.
KR850001926A (ko) 내연화 고전도성 구리합금
FR2440627A1 (fr) Dispositif a guide d'ondes a ruban soutenu pour la propagation d'un mode d'onde impair
FR2357147A1 (fr) Monture pour la reception d'elements de connexion electriques
JPS57103284A (en) Method and device for mounting terminal and connector at plural wires
JPS57107071A (en) Method of forming conductor connected via self-aligning contact at part of device
FR2506075A1 (fr) Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
FR2437089A1 (fr) Procede d'encapsulation
SE8008579L (sv) Legering och amalgam derav
DE69110435D1 (de) Kupferlegierungen und daraus hergestellte Leitergitter.
GB2103420B (en) Gold-plated package for semiconductor devices
BE889259A (fr) Ensemble deflecteur pour poele et son procede de demontage, poele et son procede de montage
FR2533653B1 (fr) Boite de transmission pour motoculteurs, procede d'assemblage et appareil de montage
FR2518796B1 (fr) Materiau conducteur de l'electricite, notamment pour elements metalliques anti-radar
IT1256356B (it) Dispositivo per l'alimentazione di campioni ad apparecchiature di analisi elementare
DK544785A (da) Elektrisk partikeldetektor til brandalarmering
FR2543355B1 (fr) Procede et installation pour reunir des cables electriques multipolaires
IT1150071B (it) Procedimento e dispositivo per fondere metalli, specialmente metalli leggeri,pesanti e nobili,nonche' loro leghe
FR2531268B1 (fr) Dispositif pour former les fils de raccordement de composants electriques
FR2502909B1 (fr) Procede pour l'extraction du jus de tubercules, en particulier de topinambours et installation mettant en oeuvre le procede
JPS54104597A (en) Copper alloy for lead frame
FR2411475A1 (fr) Cable electrique resistant a la propagation de l'incendie, et procede de fabrication d'un tel cable
JPS5769764A (en) Connecting structure of fet
FR2481565B1 (fr) Procede de scellement d'un composant electrique encapsule, par masquage des broches et trempage dans le materiau de scellement liquide

Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse