FR2504730A1 - Procede de fabrication de circuits integres mos a plusieurs types d'interconnexions - Google Patents
Procede de fabrication de circuits integres mos a plusieurs types d'interconnexions Download PDFInfo
- Publication number
- FR2504730A1 FR2504730A1 FR8108440A FR8108440A FR2504730A1 FR 2504730 A1 FR2504730 A1 FR 2504730A1 FR 8108440 A FR8108440 A FR 8108440A FR 8108440 A FR8108440 A FR 8108440A FR 2504730 A1 FR2504730 A1 FR 2504730A1
- Authority
- FR
- France
- Prior art keywords
- regions
- substrate
- polycrystalline silicon
- oxide
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8108440A FR2504730A1 (fr) | 1981-04-28 | 1981-04-28 | Procede de fabrication de circuits integres mos a plusieurs types d'interconnexions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8108440A FR2504730A1 (fr) | 1981-04-28 | 1981-04-28 | Procede de fabrication de circuits integres mos a plusieurs types d'interconnexions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2504730A1 true FR2504730A1 (fr) | 1982-10-29 |
| FR2504730B1 FR2504730B1 (enExample) | 1984-10-12 |
Family
ID=9257865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8108440A Granted FR2504730A1 (fr) | 1981-04-28 | 1981-04-28 | Procede de fabrication de circuits integres mos a plusieurs types d'interconnexions |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2504730A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0694846A1 (fr) * | 1994-07-29 | 1996-01-31 | STMicroelectronics S.A. | Procédé de brouillage numérique et application à un circuit programmable |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4080618A (en) * | 1975-09-05 | 1978-03-21 | Tokyo Shibaura Electric Co., Ltd. | Insulated-gate field-effect transistor |
-
1981
- 1981-04-28 FR FR8108440A patent/FR2504730A1/fr active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4080618A (en) * | 1975-09-05 | 1978-03-21 | Tokyo Shibaura Electric Co., Ltd. | Insulated-gate field-effect transistor |
Non-Patent Citations (2)
| Title |
|---|
| EXBK/78 * |
| EXBK/79 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0694846A1 (fr) * | 1994-07-29 | 1996-01-31 | STMicroelectronics S.A. | Procédé de brouillage numérique et application à un circuit programmable |
| US5850452A (en) * | 1994-07-29 | 1998-12-15 | Stmicroelectronics S.A. | Method for numerically scrambling data and its application to a programmable circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2504730B1 (enExample) | 1984-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| D6 | Patent endorsed licences of rights |