FR2498813A1 - Installation de traitement de materiaux pour la production de semi-conducteurs - Google Patents

Installation de traitement de materiaux pour la production de semi-conducteurs Download PDF

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Publication number
FR2498813A1
FR2498813A1 FR8101486A FR8101486A FR2498813A1 FR 2498813 A1 FR2498813 A1 FR 2498813A1 FR 8101486 A FR8101486 A FR 8101486A FR 8101486 A FR8101486 A FR 8101486A FR 2498813 A1 FR2498813 A1 FR 2498813A1
Authority
FR
France
Prior art keywords
module
cassette
slices
rail
cassettes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8101486A
Other languages
English (en)
French (fr)
Other versions
FR2498813B1 (enExample
Inventor
Pierre Bouchaib
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horiba Jobin Yvon SAS
Original Assignee
Horiba Jobin Yvon SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Jobin Yvon SAS filed Critical Horiba Jobin Yvon SAS
Priority to FR8101486A priority Critical patent/FR2498813A1/fr
Priority to JP57011460A priority patent/JPS57145312A/ja
Priority to EP82400148A priority patent/EP0060151B1/fr
Priority to DE8282400148T priority patent/DE3260336D1/de
Publication of FR2498813A1 publication Critical patent/FR2498813A1/fr
Application granted granted Critical
Publication of FR2498813B1 publication Critical patent/FR2498813B1/fr
Priority to US06/547,463 priority patent/US4498416A/en
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
    • C30B35/005—Transport systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
FR8101486A 1981-01-27 1981-01-27 Installation de traitement de materiaux pour la production de semi-conducteurs Granted FR2498813A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8101486A FR2498813A1 (fr) 1981-01-27 1981-01-27 Installation de traitement de materiaux pour la production de semi-conducteurs
JP57011460A JPS57145312A (en) 1981-01-27 1982-01-27 Semiconductor producing material treating facility
EP82400148A EP0060151B1 (fr) 1981-01-27 1982-01-27 Installation de traitement de matériaux pour la production de semi-conducteurs
DE8282400148T DE3260336D1 (en) 1981-01-27 1982-01-27 Material treatment apparatus for producing semiconductors
US06/547,463 US4498416A (en) 1981-01-27 1983-11-02 Installation for treatment of materials for the production of semi-conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8101486A FR2498813A1 (fr) 1981-01-27 1981-01-27 Installation de traitement de materiaux pour la production de semi-conducteurs

Publications (2)

Publication Number Publication Date
FR2498813A1 true FR2498813A1 (fr) 1982-07-30
FR2498813B1 FR2498813B1 (enExample) 1983-03-04

Family

ID=9254553

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8101486A Granted FR2498813A1 (fr) 1981-01-27 1981-01-27 Installation de traitement de materiaux pour la production de semi-conducteurs

Country Status (5)

Country Link
US (1) US4498416A (enExample)
EP (1) EP0060151B1 (enExample)
JP (1) JPS57145312A (enExample)
DE (1) DE3260336D1 (enExample)
FR (1) FR2498813A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0178162A1 (en) * 1984-10-12 1986-04-16 South London Electrical Equipment Company Limited Apparatus for feeding components through a work station
EP0145285A3 (en) * 1983-11-10 1987-09-23 Texas Instruments Incorporated Solderless mbe system

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JPS59123226A (ja) * 1982-12-28 1984-07-17 Fujitsu Ltd 半導体装置の製造装置
EP0208851B1 (en) * 1982-12-16 1990-03-07 Fujitsu Limited Fabricating a semiconductor device by means of molecular beam epitaxy
JPS605509A (ja) * 1983-06-24 1985-01-12 Hitachi Ltd 分子線エピタキシ装置
JPS6086819A (ja) * 1983-10-19 1985-05-16 Hitachi Ltd 分子線エピタキシ装置
JPS60117615A (ja) * 1983-11-30 1985-06-25 Hitachi Ltd 分子線エピタキシ装置
GB8332394D0 (en) * 1983-12-05 1984-01-11 Pilkington Brothers Plc Coating apparatus
JPS60167314A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 分子線エピタキシヤル装置
JPS60254627A (ja) * 1984-05-30 1985-12-16 Hitachi Ltd 半導体基板搬送機構
JPS61107720A (ja) * 1984-10-31 1986-05-26 Hitachi Ltd 分子線エピタキシ装置
EP0211634B1 (en) * 1985-08-02 1994-03-23 Sel Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for manufacturing semiconductor devices
US5753542A (en) 1985-08-02 1998-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for crystallizing semiconductor material without exposing it to air
US5296405A (en) * 1985-08-02 1994-03-22 Semiconductor Energy Laboratory Co.., Ltd. Method for photo annealing non-single crystalline semiconductor films
JPS6235513A (ja) * 1985-08-09 1987-02-16 Hitachi Ltd 分子線エピタキシ装置
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4909695A (en) * 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
EP0246453A3 (en) * 1986-04-18 1989-09-06 General Signal Corporation Novel multiple-processing and contamination-free plasma etching system
US5013385A (en) * 1986-04-18 1991-05-07 General Signal Corporation Quad processor
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US4722298A (en) * 1986-05-19 1988-02-02 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US5327624A (en) * 1986-07-16 1994-07-12 Mitsubishi Denki Kabushiki Kaisha Method for forming a thin film on a semiconductor device using an apparatus having a load lock
US5110249A (en) * 1986-10-23 1992-05-05 Innotec Group, Inc. Transport system for inline vacuum processing
JPS63128710A (ja) * 1986-11-19 1988-06-01 Mitsubishi Electric Corp 反応炉
US4763602A (en) * 1987-02-25 1988-08-16 Glasstech Solar, Inc. Thin film deposition apparatus including a vacuum transport mechanism
US4786616A (en) * 1987-06-12 1988-11-22 American Telephone And Telegraph Company Method for heteroepitaxial growth using multiple MBE chambers
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5067218A (en) * 1990-05-21 1991-11-26 Motorola, Inc. Vacuum wafer transport and processing system and method using a plurality of wafer transport arms
JP3351802B2 (ja) * 1991-01-01 2002-12-03 忠弘 大見 薄膜形成装置
US5286296A (en) * 1991-01-10 1994-02-15 Sony Corporation Multi-chamber wafer process equipment having plural, physically communicating transfer means
US5578520A (en) 1991-05-28 1996-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for annealing a semiconductor
US5766344A (en) * 1991-09-21 1998-06-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming a semiconductor
US5766360A (en) * 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
US7097712B1 (en) 1992-12-04 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Apparatus for processing a semiconductor
CN100367461C (zh) 1993-11-05 2008-02-06 株式会社半导体能源研究所 一种制造薄膜晶体管和电子器件的方法
US6897100B2 (en) 1993-11-05 2005-05-24 Semiconductor Energy Laboratory Co., Ltd. Method for processing semiconductor device apparatus for processing a semiconductor and apparatus for processing semiconductor device
US5624704A (en) * 1995-04-24 1997-04-29 Baylor College Of Medicine Antimicrobial impregnated catheters and other medical implants and method for impregnating catheters and other medical implants with an antimicrobial agent
US6312525B1 (en) 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
JP4947834B2 (ja) * 1997-11-26 2012-06-06 アプライド マテリアルズ インコーポレイテッド ダメージフリー被覆刻設堆積法
US20050272254A1 (en) * 1997-11-26 2005-12-08 Applied Materials, Inc. Method of depositing low resistivity barrier layers for copper interconnects
US7253109B2 (en) * 1997-11-26 2007-08-07 Applied Materials, Inc. Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
US6013134A (en) * 1998-02-18 2000-01-11 International Business Machines Corporation Advance integrated chemical vapor deposition (AICVD) for semiconductor devices
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
USD436609S1 (en) 1999-11-30 2001-01-23 Applied Materials, Inc. Transfer chamber
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
USD437333S1 (en) 1999-11-30 2001-02-06 Applied Materials, Inc. Process chamber tray
USD446506S1 (en) 1999-11-30 2001-08-14 Applied Materials, Inc. Monolith processing system platform
USD441348S1 (en) 1999-11-30 2001-05-01 Applied Materials, Inc. Process chamber lid
US6582178B2 (en) * 2000-08-14 2003-06-24 Daniel G. Petruccelli Mini-modual manufacturing environmental
US6558750B2 (en) 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
US6524463B2 (en) 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
US20070196011A1 (en) * 2004-11-22 2007-08-23 Cox Damon K Integrated vacuum metrology for cluster tool
US20070134821A1 (en) * 2004-11-22 2007-06-14 Randhir Thakur Cluster tool for advanced front-end processing
US7918940B2 (en) * 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1597032A (enExample) * 1968-06-05 1970-06-22
US4141458A (en) * 1975-05-23 1979-02-27 Pass-Port Systems Corporation Wafer transport system

Family Cites Families (6)

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US3404661A (en) * 1965-08-26 1968-10-08 Sperry Rand Corp Evaporation system
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
JPS5910574B2 (ja) * 1977-04-22 1984-03-09 富士通株式会社 分子線エピタキシャル成長装置
JPS5487477A (en) * 1977-12-23 1979-07-11 Kokusai Electric Co Ltd Device for etching and stripping semiconductor wafer
US4433951A (en) * 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
US4412771A (en) * 1981-07-30 1983-11-01 The Perkin-Elmer Corporation Sample transport system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1597032A (enExample) * 1968-06-05 1970-06-22
US4141458A (en) * 1975-05-23 1979-02-27 Pass-Port Systems Corporation Wafer transport system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/75 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0145285A3 (en) * 1983-11-10 1987-09-23 Texas Instruments Incorporated Solderless mbe system
EP0178162A1 (en) * 1984-10-12 1986-04-16 South London Electrical Equipment Company Limited Apparatus for feeding components through a work station

Also Published As

Publication number Publication date
DE3260336D1 (en) 1984-08-16
FR2498813B1 (enExample) 1983-03-04
EP0060151B1 (fr) 1984-07-11
JPS57145312A (en) 1982-09-08
US4498416A (en) 1985-02-12
EP0060151A1 (fr) 1982-09-15

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