FR2479564A1 - Boitier d'encapsulation pour module de puissance en circuit hybride - Google Patents

Boitier d'encapsulation pour module de puissance en circuit hybride Download PDF

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Publication number
FR2479564A1
FR2479564A1 FR8006689A FR8006689A FR2479564A1 FR 2479564 A1 FR2479564 A1 FR 2479564A1 FR 8006689 A FR8006689 A FR 8006689A FR 8006689 A FR8006689 A FR 8006689A FR 2479564 A1 FR2479564 A1 FR 2479564A1
Authority
FR
France
Prior art keywords
substrate
box according
cover
encapsulation box
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8006689A
Other languages
English (en)
French (fr)
Other versions
FR2479564B1 (enExample
Inventor
Didier Pribat
Guy Arnauld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8006689A priority Critical patent/FR2479564A1/fr
Priority to EP81400393A priority patent/EP0037301B1/fr
Priority to DE8181400393T priority patent/DE3163581D1/de
Priority to JP4464081A priority patent/JPS5717156A/ja
Publication of FR2479564A1 publication Critical patent/FR2479564A1/fr
Application granted granted Critical
Publication of FR2479564B1 publication Critical patent/FR2479564B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
FR8006689A 1980-03-26 1980-03-26 Boitier d'encapsulation pour module de puissance en circuit hybride Granted FR2479564A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8006689A FR2479564A1 (fr) 1980-03-26 1980-03-26 Boitier d'encapsulation pour module de puissance en circuit hybride
EP81400393A EP0037301B1 (fr) 1980-03-26 1981-03-13 Boîtier d'encapsulation pour module de puissance en circuit hybride
DE8181400393T DE3163581D1 (en) 1980-03-26 1981-03-13 Encapsulating housing for hybrid circuit power module
JP4464081A JPS5717156A (en) 1980-03-26 1981-03-26 Sealing box for power module of hybrid circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8006689A FR2479564A1 (fr) 1980-03-26 1980-03-26 Boitier d'encapsulation pour module de puissance en circuit hybride

Publications (2)

Publication Number Publication Date
FR2479564A1 true FR2479564A1 (fr) 1981-10-02
FR2479564B1 FR2479564B1 (enExample) 1983-11-04

Family

ID=9240116

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8006689A Granted FR2479564A1 (fr) 1980-03-26 1980-03-26 Boitier d'encapsulation pour module de puissance en circuit hybride

Country Status (4)

Country Link
EP (1) EP0037301B1 (enExample)
JP (1) JPS5717156A (enExample)
DE (1) DE3163581D1 (enExample)
FR (1) FR2479564A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114068429A (zh) * 2021-11-10 2022-02-18 中国电子科技集团公司第四十四研究所 宽温高耐压光电隔离开关封装结构及封装方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
JPS59177951A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 半導体装置
JPS59208736A (ja) * 1983-05-12 1984-11-27 Fuji Electric Co Ltd 半導体装置の組立て方法
DE3505086A1 (de) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
JPS6221253A (ja) * 1985-07-22 1987-01-29 Mitsubishi Electric Corp パワ−モジユ−ル
JPS62127168A (ja) * 1985-11-28 1987-06-09 Nippon Steel Corp 交流矩形波プラズマア−ク溶接方法およびその装置
FR2618629B1 (fr) * 1987-07-23 1993-04-23 Telecommunications Sa Boitier hermetique pour circuit electronique hybride
JPH0729670Y2 (ja) * 1988-10-19 1995-07-05 ティーディーケイ株式会社 電源装置
WO1991011824A1 (en) * 1990-01-24 1991-08-08 Nauchno-Proizvodstvenny Tsentr Elektronnoi Mikrotekhnologii Akademii Nauk Sssr Three-dimensional electronic unit and method of construction
ES2078171B1 (es) * 1993-12-28 1998-01-16 Smartpack Tecnologia S A Procedimiento de fabricacion de modulos de potencia con elementos semiconductores.
FR2754390A1 (fr) * 1996-10-07 1998-04-10 Gec Alsthom Transport Sa Module de puissance a composants electroniques semi-conducteurs de puissance et interrupteur de forte puissance comportant au moins un tel module de puissance
FR2754669B1 (fr) * 1996-10-16 2002-04-12 Alsthom Cge Alkatel Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module
DE102004035746B4 (de) * 2004-07-23 2009-04-16 Infineon Technologies Ag Leistungshalbleitermodul
DE102010062556A1 (de) * 2010-12-07 2012-06-14 Semikron Elektronik Gmbh & Co. Kg Halbleiterschaltungsanordnung
DE102013102829B4 (de) * 2013-03-20 2017-10-19 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul und Anordnung hiermit
RU2688035C1 (ru) * 2018-05-14 2019-05-17 Акционерное общество "Научно-производственное предприятие "Пульсар" Металлокерамический корпус силового полупроводникового модуля на основе высокотеплопроводной керамики и способ его изготовления
DE102019205411A1 (de) * 2019-04-15 2020-10-15 Volkswagen Aktiengesellschaft Halbleiteranordnung
CN115955802A (zh) * 2022-12-26 2023-04-11 深圳市振华微电子有限公司 一种一体化多层全密封外壳
CN119517865B (zh) * 2025-01-14 2025-04-11 大连宗益科技发展有限公司 一种SiC功率器件散热型陶瓷封装结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1085094A (en) * 1964-04-28 1967-09-27 Lucas Industries Ltd Alternators
FR1535282A (fr) * 1966-08-29 1968-08-02 C K D Praha Op Corps de refroidissement pour éléments de construction semi-conducteurs
FR2306530A1 (fr) * 1975-03-31 1976-10-29 Ibm Boitier pour pastille semiconductrice a refroidissement par air
FR2402998A1 (fr) * 1977-09-07 1979-04-06 Gen Electric Disposition perfectionnee pour le transfert de chaleur entre un dispositif electrique de puissance et un radiateur de chaleur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1085094A (en) * 1964-04-28 1967-09-27 Lucas Industries Ltd Alternators
FR1535282A (fr) * 1966-08-29 1968-08-02 C K D Praha Op Corps de refroidissement pour éléments de construction semi-conducteurs
FR2306530A1 (fr) * 1975-03-31 1976-10-29 Ibm Boitier pour pastille semiconductrice a refroidissement par air
FR2402998A1 (fr) * 1977-09-07 1979-04-06 Gen Electric Disposition perfectionnee pour le transfert de chaleur entre un dispositif electrique de puissance et un radiateur de chaleur

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *
EXBK/70 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114068429A (zh) * 2021-11-10 2022-02-18 中国电子科技集团公司第四十四研究所 宽温高耐压光电隔离开关封装结构及封装方法

Also Published As

Publication number Publication date
EP0037301A2 (fr) 1981-10-07
EP0037301B1 (fr) 1984-05-16
FR2479564B1 (enExample) 1983-11-04
JPS5717156A (en) 1982-01-28
EP0037301A3 (en) 1981-10-14
DE3163581D1 (en) 1984-06-20

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