FR2754669B1 - Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module - Google Patents

Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module

Info

Publication number
FR2754669B1
FR2754669B1 FR9612613A FR9612613A FR2754669B1 FR 2754669 B1 FR2754669 B1 FR 2754669B1 FR 9612613 A FR9612613 A FR 9612613A FR 9612613 A FR9612613 A FR 9612613A FR 2754669 B1 FR2754669 B1 FR 2754669B1
Authority
FR
France
Prior art keywords
electronic power
module
components
pct
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9612613A
Other languages
English (en)
Other versions
FR2754669A1 (fr
Inventor
Eric Ranchy
Alain Petitbon
Nadia Broqua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Alsthom Compagnie Generale dElectricite
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9612613A priority Critical patent/FR2754669B1/fr
Application filed by Alcatel Alsthom Compagnie Generale dElectricite filed Critical Alcatel Alsthom Compagnie Generale dElectricite
Priority to CA002239252A priority patent/CA2239252A1/fr
Priority to KR1019980704534A priority patent/KR19990072177A/ko
Priority to PCT/FR1997/001854 priority patent/WO1998016952A1/fr
Priority to EP97911279A priority patent/EP0885459A1/fr
Priority to US09/077,806 priority patent/US6166903A/en
Priority to JP10518075A priority patent/JP2000502515A/ja
Priority to CN97191739A priority patent/CN1208501A/zh
Publication of FR2754669A1 publication Critical patent/FR2754669A1/fr
Application granted granted Critical
Publication of FR2754669B1 publication Critical patent/FR2754669B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9612613A 1996-10-16 1996-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module Expired - Fee Related FR2754669B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR9612613A FR2754669B1 (fr) 1996-10-16 1996-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module
KR1019980704534A KR19990072177A (ko) 1996-10-16 1997-10-16 전자전력모듈및다수의상기모듈들을포함하는전자전력시스템
PCT/FR1997/001854 WO1998016952A1 (fr) 1996-10-16 1997-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module
EP97911279A EP0885459A1 (fr) 1996-10-16 1997-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module
CA002239252A CA2239252A1 (fr) 1996-10-16 1997-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module
US09/077,806 US6166903A (en) 1996-10-16 1997-10-16 Electronic power module, and electronic power system comprising a plurality of said modules
JP10518075A JP2000502515A (ja) 1996-10-16 1997-10-16 電力モジュールおよび複数の前記モジュールを含む電力システム
CN97191739A CN1208501A (zh) 1996-10-16 1997-10-16 电子功率模块和包括多个所述模块的电子功率系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9612613A FR2754669B1 (fr) 1996-10-16 1996-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module

Publications (2)

Publication Number Publication Date
FR2754669A1 FR2754669A1 (fr) 1998-04-17
FR2754669B1 true FR2754669B1 (fr) 2002-04-12

Family

ID=9496716

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9612613A Expired - Fee Related FR2754669B1 (fr) 1996-10-16 1996-10-16 Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module

Country Status (8)

Country Link
US (1) US6166903A (fr)
EP (1) EP0885459A1 (fr)
JP (1) JP2000502515A (fr)
KR (1) KR19990072177A (fr)
CN (1) CN1208501A (fr)
CA (1) CA2239252A1 (fr)
FR (1) FR2754669B1 (fr)
WO (1) WO1998016952A1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963813A1 (de) * 1999-12-30 2001-07-19 Infineon Technologies Ag Schaltungsanordnung zur Regelung des Leistungsverbrauchs eines integrierten Schaltkreises
US6422877B1 (en) * 2000-10-05 2002-07-23 Motorola, Inc. Apparatus for coupling power to an electronics module
JP2003037231A (ja) * 2001-07-23 2003-02-07 Ibiden Co Ltd モジュール用基板
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US6909607B2 (en) 2002-01-16 2005-06-21 Rockwell Automation Technologies, Inc. Thermally matched fluid cooled power converter
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US7187568B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
US7032695B2 (en) 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7061775B2 (en) 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US7187548B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US6982873B2 (en) * 2002-01-16 2006-01-03 Rockwell Automation Technologies, Inc. Compact vehicle drive module having improved thermal control
US6898072B2 (en) 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US7142434B2 (en) * 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
DE102004026061B4 (de) * 2004-05-25 2009-09-10 Danfoss Silicon Power Gmbh Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls
JP5106822B2 (ja) * 2006-10-27 2012-12-26 三菱重工業株式会社 半導体装置、検査装置及び半導体装置の製造方法
JP4719187B2 (ja) * 2007-06-15 2011-07-06 トヨタ自動車株式会社 半導体素子の冷却構造
DE102008063724B4 (de) * 2007-12-19 2012-08-23 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Sammelschienenanordnung mit eingebauter Kühlung, Fahrzeugwechselrichtermodul und Verfahren zum Kühlen eines Wechselrichtermoduls
US8724325B2 (en) * 2009-05-19 2014-05-13 Hamilton Sundstrand Corporation Solid state switch arrangement
JP4920071B2 (ja) * 2009-11-12 2012-04-18 株式会社日本自動車部品総合研究所 半導体素子の冷却装置
DE102011076325B4 (de) * 2011-05-24 2016-05-04 Semikron Elektronik Gmbh & Co. Kg Kühlanordnung für eine leistungselektronische Komponente mit Subsystemen und einer Kühleinrichtung
DE112016001711T5 (de) 2015-04-13 2018-01-04 Abb Schweiz Ag Leistungselektronikmodul
FR3042078B1 (fr) * 2015-10-05 2019-03-22 Valeo Equipements Electriques Moteur Module electronique de puissance
US10619845B2 (en) * 2016-08-18 2020-04-14 Clearsign Combustion Corporation Cooled ceramic electrode supports
FR3060941B1 (fr) * 2016-12-19 2019-07-05 Safran Module de puissance refroidi par caloduc et procede de fabrication d'un tel module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2146558C3 (de) * 1971-09-17 1979-09-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung der Stromschienen in einer Gleichrichteranlage
US5111280A (en) * 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
JP2859927B2 (ja) * 1990-05-16 1999-02-24 株式会社東芝 冷却装置および温度制御装置
JP2529628B2 (ja) * 1991-08-29 1996-08-28 大阪電気株式会社 半導体スタック装置
DE4338277C2 (de) * 1993-07-17 1997-03-13 Abb Patent Gmbh Flüssigkeitsgekühltes Stromrichtermodul mit Beschaltungsbauelementen für abschaltbare Leistungshalbleiter
DE4401607C2 (de) * 1994-01-20 1997-04-10 Siemens Ag Kühleinheit für Leistungshalbleiter

Also Published As

Publication number Publication date
WO1998016952A1 (fr) 1998-04-23
EP0885459A1 (fr) 1998-12-23
US6166903A (en) 2000-12-26
CA2239252A1 (fr) 1998-04-23
JP2000502515A (ja) 2000-02-29
KR19990072177A (ko) 1999-09-27
FR2754669A1 (fr) 1998-04-17
CN1208501A (zh) 1999-02-17

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