FR2479275A1 - Procede pour l'electrodeposition de cuivre - Google Patents

Procede pour l'electrodeposition de cuivre Download PDF

Info

Publication number
FR2479275A1
FR2479275A1 FR8105967A FR8105967A FR2479275A1 FR 2479275 A1 FR2479275 A1 FR 2479275A1 FR 8105967 A FR8105967 A FR 8105967A FR 8105967 A FR8105967 A FR 8105967A FR 2479275 A1 FR2479275 A1 FR 2479275A1
Authority
FR
France
Prior art keywords
copper
anodes
inert
anode
liter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8105967A
Other languages
English (en)
French (fr)
Other versions
FR2479275B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Wolfgang Dahms
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of FR2479275A1 publication Critical patent/FR2479275A1/fr
Application granted granted Critical
Publication of FR2479275B1 publication Critical patent/FR2479275B1/fr
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR8105967A 1980-03-27 1981-03-25 Procede pour l'electrodeposition de cuivre Granted FR2479275A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803012168 DE3012168A1 (de) 1980-03-27 1980-03-27 Verfahren zur galvanischen abscheidung von kupferniederschlaegen

Publications (2)

Publication Number Publication Date
FR2479275A1 true FR2479275A1 (fr) 1981-10-02
FR2479275B1 FR2479275B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1983-05-20

Family

ID=6098700

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8105967A Granted FR2479275A1 (fr) 1980-03-27 1981-03-25 Procede pour l'electrodeposition de cuivre

Country Status (6)

Country Link
US (1) US4419192A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS56150197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3012168A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2479275A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2076855B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1135708B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2538815A1 (fr) * 1983-01-03 1984-07-06 Omi Int Corp Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede
FR2649996A1 (fr) * 1989-07-24 1991-01-25 Omi Int Corp Procede de cuivrage sans cyanure

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3240643A1 (de) * 1982-11-04 1984-05-30 LPW-Chemie GmbH, 4040 Neuss Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten
US4462874A (en) * 1983-11-16 1984-07-31 Omi International Corporation Cyanide-free copper plating process
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
US4652345A (en) * 1983-12-19 1987-03-24 International Business Machines Corporation Method of depositing a metal from an electroless plating solution
JPS63270490A (ja) * 1987-04-27 1988-11-08 Permelec Electrode Ltd クロムメツキ法
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US5344538A (en) * 1993-01-11 1994-09-06 Gould Inc. Thin plate anode
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
ITTO20070704A1 (it) * 2007-10-05 2009-04-06 Create New Technology S R L Sistema e metodo di placcatura di leghe metalliche mediante tecnologia galvanica
CN102605401B (zh) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 一种表面处理槽在线锡回收结构
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
DE102012024758B4 (de) * 2012-12-18 2024-02-01 Maschinenfabrik Niehoff Gmbh & Co Kg Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung
JP5692268B2 (ja) * 2013-03-25 2015-04-01 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
CN105018977B (zh) * 2015-07-17 2017-09-12 深圳市板明科技有限公司 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE473919A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) *
DE2165823A1 (de) * 1971-12-31 1973-07-05 Esser Kg Galvano Titanbau M Vorrichtung zur elektrolytischen abscheidung von metallen
DE2443040A1 (de) * 1974-07-31 1976-02-19 Bbc Brown Boveri & Cie Galvanisierungsverfahren fuer die herstellung galvanischer ueberzuege auf profilierten oberflaechen eines werkstueckes bei verwendung einer formanode und anlage zur durchfuehrung des verfahrens
US3947344A (en) * 1973-04-27 1976-03-30 Nikolai Sergeevich Golikov Inert anode

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1465034A (en) * 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
US2133255A (en) * 1937-05-19 1938-10-11 Percy A E Armstrong Process of electroplating copper
US4052271A (en) * 1965-05-12 1977-10-04 Diamond Shamrock Technologies, S.A. Method of making an electrode having a coating containing a platinum metal oxide thereon
DD112145B1 (de) * 1974-03-22 1986-10-29 Cordt Schmidt Verfahren und vorrichtung zur erzeugung von wischfesten haftbelaegen auf metallfolien, insbesondere auf kupferfolien
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE473919A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) *
DE2165823A1 (de) * 1971-12-31 1973-07-05 Esser Kg Galvano Titanbau M Vorrichtung zur elektrolytischen abscheidung von metallen
US3947344A (en) * 1973-04-27 1976-03-30 Nikolai Sergeevich Golikov Inert anode
DE2443040A1 (de) * 1974-07-31 1976-02-19 Bbc Brown Boveri & Cie Galvanisierungsverfahren fuer die herstellung galvanischer ueberzuege auf profilierten oberflaechen eines werkstueckes bei verwendung einer formanode und anlage zur durchfuehrung des verfahrens

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/75 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2538815A1 (fr) * 1983-01-03 1984-07-06 Omi Int Corp Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede
FR2649996A1 (fr) * 1989-07-24 1991-01-25 Omi Int Corp Procede de cuivrage sans cyanure

Also Published As

Publication number Publication date
FR2479275B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1983-05-20
IT1135708B (it) 1986-08-27
US4419192A (en) 1983-12-06
JPS6411719B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-02-27
IT8120676A0 (it) 1981-03-24
GB2076855A (en) 1981-12-09
DE3012168A1 (de) 1981-10-01
DE3012168C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-12-01
GB2076855B (en) 1983-09-21
JPS56150197A (en) 1981-11-20

Similar Documents

Publication Publication Date Title
FR2479275A1 (fr) Procede pour l'electrodeposition de cuivre
JP2001505955A (ja) 銅層の電解析出方法
JP2011520037A (ja) 改良された銅−錫電解液及び青銅層の析出方法
JP5887381B2 (ja) 有毒金属または半金属を使用することなく電気めっき法により黄色金合金析出物を得る方法
EP1272691B1 (fr) Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
US20060137991A1 (en) Method for bronze galvanic coating
Carlos et al. Effect of tartrate on the morphological characteristics of the copper–tin electrodeposits from a noncyanide acid bath
US4715935A (en) Palladium and palladium alloy plating
FR2649996A1 (fr) Procede de cuivrage sans cyanure
Kim et al. The effects of electroplating parameters on the composition and morphology of Sn-Ag solder
EP1423557B1 (fr) Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
EP3170924A1 (en) Electrolyte and method for electrolytic deposition of gold-copper alloys
EP1268347B1 (fr) Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot du palladium ou d'un de ses alliages
Yang et al. Electrodeposition mechanism and process of a novel cyanide-free gold sulfite bath
KR101297476B1 (ko) 독성 금속을 사용하지 않고 전기주조에 의하여 황색 금 합금 전착물을 수득하는 방법
FR2538815A1 (fr) Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede
Lee et al. Evaluating and monitoring nucleation and growth in copper foil
EP2505691B1 (fr) Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N
EP1103637A1 (en) Method of producing AuCuGa alloy coating using electrolysis, and alloys produced by such a method
EP2607523B1 (en) Method of copper electroplating
CN102471911B (zh) 具有降低的起泡形成倾向的锌压铸件的电解镀铜方法
CH710185B1 (fr) Préparation pour bain galvanique d'alliage d'or et bain galvanique.
JP2010150606A (ja) 電解再生式の無電解スズメッキ方法
HK1033683A (en) Method of producing aucuga alloy coating using electrolysis, and alloys produced by such a method

Legal Events

Date Code Title Description
TP Transmission of property