FR2479275A1 - Procede pour l'electrodeposition de cuivre - Google Patents
Procede pour l'electrodeposition de cuivre Download PDFInfo
- Publication number
- FR2479275A1 FR2479275A1 FR8105967A FR8105967A FR2479275A1 FR 2479275 A1 FR2479275 A1 FR 2479275A1 FR 8105967 A FR8105967 A FR 8105967A FR 8105967 A FR8105967 A FR 8105967A FR 2479275 A1 FR2479275 A1 FR 2479275A1
- Authority
- FR
- France
- Prior art keywords
- copper
- anodes
- inert
- anode
- liter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract description 15
- 238000004070 electrodeposition Methods 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 32
- 229910052802 copper Inorganic materials 0.000 abstract description 32
- 239000010949 copper Substances 0.000 abstract description 32
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052737 gold Inorganic materials 0.000 abstract description 7
- 239000010931 gold Substances 0.000 abstract description 7
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 4
- 229910052741 iridium Inorganic materials 0.000 abstract description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 abstract description 4
- 150000001247 metal acetylides Chemical class 0.000 abstract description 4
- 229910052763 palladium Inorganic materials 0.000 abstract description 4
- 229910052697 platinum Inorganic materials 0.000 abstract description 4
- 229910052702 rhenium Inorganic materials 0.000 abstract description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052703 rhodium Inorganic materials 0.000 abstract description 4
- 239000010948 rhodium Substances 0.000 abstract description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052707 ruthenium Inorganic materials 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 3
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 230000002378 acidificating effect Effects 0.000 description 10
- -1 3-sulfo-3-propyl N, N-diethyl-dithiocarbamate Chemical compound 0.000 description 6
- 229910000510 noble metal Inorganic materials 0.000 description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 239000011593 sulfur Substances 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 150000002898 organic sulfur compounds Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- REJSMTWFWDLMQN-UHFFFAOYSA-N 3-(3-sulfopropylsulfanyl)propane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCSCCCS(O)(=O)=O REJSMTWFWDLMQN-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000011620 noble rat Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229940065287 selenium compound Drugs 0.000 description 1
- 150000003343 selenium compounds Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- NPAWNPCNZAPTKA-UHFFFAOYSA-M sodium;propane-1-sulfonate Chemical compound [Na+].CCCS([O-])(=O)=O NPAWNPCNZAPTKA-UHFFFAOYSA-M 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- NMJKIRUDPFBRHW-UHFFFAOYSA-N titanium Chemical compound [Ti].[Ti] NMJKIRUDPFBRHW-UHFFFAOYSA-N 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19803012168 DE3012168A1 (de) | 1980-03-27 | 1980-03-27 | Verfahren zur galvanischen abscheidung von kupferniederschlaegen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2479275A1 true FR2479275A1 (fr) | 1981-10-02 |
| FR2479275B1 FR2479275B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1983-05-20 |
Family
ID=6098700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8105967A Granted FR2479275A1 (fr) | 1980-03-27 | 1981-03-25 | Procede pour l'electrodeposition de cuivre |
Country Status (6)
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2538815A1 (fr) * | 1983-01-03 | 1984-07-06 | Omi Int Corp | Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede |
| FR2649996A1 (fr) * | 1989-07-24 | 1991-01-25 | Omi Int Corp | Procede de cuivrage sans cyanure |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3240643A1 (de) * | 1982-11-04 | 1984-05-30 | LPW-Chemie GmbH, 4040 Neuss | Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten |
| US4462874A (en) * | 1983-11-16 | 1984-07-31 | Omi International Corporation | Cyanide-free copper plating process |
| US4469569A (en) * | 1983-01-03 | 1984-09-04 | Omi International Corporation | Cyanide-free copper plating process |
| US4652345A (en) * | 1983-12-19 | 1987-03-24 | International Business Machines Corporation | Method of depositing a metal from an electroless plating solution |
| JPS63270490A (ja) * | 1987-04-27 | 1988-11-08 | Permelec Electrode Ltd | クロムメツキ法 |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| US5344538A (en) * | 1993-01-11 | 1994-09-06 | Gould Inc. | Thin plate anode |
| US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| ITTO20070704A1 (it) * | 2007-10-05 | 2009-04-06 | Create New Technology S R L | Sistema e metodo di placcatura di leghe metalliche mediante tecnologia galvanica |
| CN102605401B (zh) * | 2012-03-23 | 2015-11-18 | 如皋市易达电子有限责任公司 | 一种表面处理槽在线锡回收结构 |
| EP2735627A1 (en) * | 2012-11-26 | 2014-05-28 | ATOTECH Deutschland GmbH | Copper plating bath composition |
| DE102012024758B4 (de) * | 2012-12-18 | 2024-02-01 | Maschinenfabrik Niehoff Gmbh & Co Kg | Vorrichtung und Verfahren zum elektrolytischen Beschichten eines Gegenstandes und deren Verwendung |
| JP5692268B2 (ja) * | 2013-03-25 | 2015-04-01 | トヨタ自動車株式会社 | 金属被膜の成膜装置および成膜方法 |
| CN105018977B (zh) * | 2015-07-17 | 2017-09-12 | 深圳市板明科技有限公司 | 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE473919A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | ||||
| DE2165823A1 (de) * | 1971-12-31 | 1973-07-05 | Esser Kg Galvano Titanbau M | Vorrichtung zur elektrolytischen abscheidung von metallen |
| DE2443040A1 (de) * | 1974-07-31 | 1976-02-19 | Bbc Brown Boveri & Cie | Galvanisierungsverfahren fuer die herstellung galvanischer ueberzuege auf profilierten oberflaechen eines werkstueckes bei verwendung einer formanode und anlage zur durchfuehrung des verfahrens |
| US3947344A (en) * | 1973-04-27 | 1976-03-30 | Nikolai Sergeevich Golikov | Inert anode |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1465034A (en) * | 1921-11-03 | 1923-08-14 | Frank L Antisell | Process for the electrolytic deposition of copper |
| US2133255A (en) * | 1937-05-19 | 1938-10-11 | Percy A E Armstrong | Process of electroplating copper |
| US4052271A (en) * | 1965-05-12 | 1977-10-04 | Diamond Shamrock Technologies, S.A. | Method of making an electrode having a coating containing a platinum metal oxide thereon |
| DD112145B1 (de) * | 1974-03-22 | 1986-10-29 | Cordt Schmidt | Verfahren und vorrichtung zur erzeugung von wischfesten haftbelaegen auf metallfolien, insbesondere auf kupferfolien |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
-
1980
- 1980-03-27 DE DE19803012168 patent/DE3012168A1/de active Granted
-
1981
- 1981-03-17 US US06/244,727 patent/US4419192A/en not_active Expired - Lifetime
- 1981-03-23 GB GB8108990A patent/GB2076855B/en not_active Expired
- 1981-03-24 IT IT20676/81A patent/IT1135708B/it active
- 1981-03-25 JP JP4258581A patent/JPS56150197A/ja active Granted
- 1981-03-25 FR FR8105967A patent/FR2479275A1/fr active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE473919A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | ||||
| DE2165823A1 (de) * | 1971-12-31 | 1973-07-05 | Esser Kg Galvano Titanbau M | Vorrichtung zur elektrolytischen abscheidung von metallen |
| US3947344A (en) * | 1973-04-27 | 1976-03-30 | Nikolai Sergeevich Golikov | Inert anode |
| DE2443040A1 (de) * | 1974-07-31 | 1976-02-19 | Bbc Brown Boveri & Cie | Galvanisierungsverfahren fuer die herstellung galvanischer ueberzuege auf profilierten oberflaechen eines werkstueckes bei verwendung einer formanode und anlage zur durchfuehrung des verfahrens |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/75 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2538815A1 (fr) * | 1983-01-03 | 1984-07-06 | Omi Int Corp | Procede pour former, par electrolyse, un revetement de cuivre sur un substrat, a partir d'un bain exempt de cyanure, et anode pour la mise en oeuvre de ce procede |
| FR2649996A1 (fr) * | 1989-07-24 | 1991-01-25 | Omi Int Corp | Procede de cuivrage sans cyanure |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2479275B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1983-05-20 |
| IT1135708B (it) | 1986-08-27 |
| US4419192A (en) | 1983-12-06 |
| JPS6411719B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-02-27 |
| IT8120676A0 (it) | 1981-03-24 |
| GB2076855A (en) | 1981-12-09 |
| DE3012168A1 (de) | 1981-10-01 |
| DE3012168C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-12-01 |
| GB2076855B (en) | 1983-09-21 |
| JPS56150197A (en) | 1981-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property |