FR2445621A1 - Procede de fabrication d'un dispositif par attaque par plasma, avec diminution de l'effet de charge - Google Patents
Procede de fabrication d'un dispositif par attaque par plasma, avec diminution de l'effet de chargeInfo
- Publication number
- FR2445621A1 FR2445621A1 FR7919156A FR7919156A FR2445621A1 FR 2445621 A1 FR2445621 A1 FR 2445621A1 FR 7919156 A FR7919156 A FR 7919156A FR 7919156 A FR7919156 A FR 7919156A FR 2445621 A1 FR2445621 A1 FR 2445621A1
- Authority
- FR
- France
- Prior art keywords
- attack
- plasma
- reduction
- manufacturing
- load effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000001459 lithography Methods 0.000 abstract 1
- 238000001020 plasma etching Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/941—Loading effect mitigation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
L'invention concerne les techniques de lithographie par attaque par plasma. L'invention a pour but de réduire l'effet de charge qui se manifeste dans l'attaque par plasma, et qui consiste en une variation de la vitesse d'attaque en fonction de la charge du dispositif utilisé, c'est-à-dire de la surface totale à attaquer. La courbe 12 qui présente un effet de charge important est caractéristique des procédés de l'art anterieur, tandis que les courbes 10 et 11 qui correspondent à l'invention, manifestent un effet de charge beaucoup plus faible. Cette amélioration résulte d'un choix approprié de la durée de vie de la substance d'attaque dans le plasma, indépendamment de la réaction d'attaque. Application à la fabrication des circuits intégrés complexes.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/929,568 US4226665A (en) | 1978-07-31 | 1978-07-31 | Device fabrication by plasma etching |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2445621A1 true FR2445621A1 (fr) | 1980-07-25 |
FR2445621B1 FR2445621B1 (fr) | 1986-10-03 |
Family
ID=25458066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7919156A Expired FR2445621B1 (fr) | 1978-07-31 | 1979-07-25 | Procede de fabrication d'un dispositif par attaque par plasma, avec diminution de l'effet de charge |
Country Status (14)
Country | Link |
---|---|
US (1) | US4226665A (fr) |
JP (1) | JPS5521595A (fr) |
AU (1) | AU524556B2 (fr) |
BE (1) | BE877893A (fr) |
CA (1) | CA1124207A (fr) |
DE (1) | DE2930292A1 (fr) |
ES (1) | ES482960A1 (fr) |
FR (1) | FR2445621B1 (fr) |
GB (1) | GB2026395B (fr) |
IE (1) | IE48606B1 (fr) |
IL (1) | IL57888A (fr) |
IT (1) | IT1193492B (fr) |
NL (1) | NL7905868A (fr) |
SE (1) | SE442358B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2478421A1 (fr) * | 1980-02-06 | 1981-09-18 | Western Electric Co | Procede de fabrication de dispositifs microminiatures par attaque reactive du silicium avec bombardement |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56100422A (en) * | 1980-01-17 | 1981-08-12 | Toshiba Corp | Plasma etching method |
JPS56134738A (en) * | 1980-03-26 | 1981-10-21 | Toshiba Corp | Method of forming pattern |
US4310380A (en) * | 1980-04-07 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Plasma etching of silicon |
NL8004005A (nl) * | 1980-07-11 | 1982-02-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
US4344816A (en) * | 1980-12-19 | 1982-08-17 | Bell Telephone Laboratories, Incorporated | Selectively etched bodies |
EP0099558A3 (fr) * | 1982-07-22 | 1985-07-31 | Texas Instruments Incorporated | Décapage du plasma rapide d'aluminium |
US4426246A (en) * | 1982-07-26 | 1984-01-17 | Bell Telephone Laboratories, Incorporated | Plasma pretreatment with BCl3 to remove passivation formed by fluorine-etch |
NL8204437A (nl) * | 1982-11-16 | 1984-06-18 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting met behulp van plasma-etsen. |
US4414057A (en) * | 1982-12-03 | 1983-11-08 | Inmos Corporation | Anisotropic silicide etching process |
US4778562A (en) * | 1984-08-13 | 1988-10-18 | General Motors Corporation | Reactive ion etching of tin oxide films using neutral reactant gas containing hydrogen |
US4544444A (en) * | 1984-08-15 | 1985-10-01 | General Motors Corporation | Reactive ion etching of tin oxide films using silicon tetrachloride reactant gas |
GB2171360A (en) * | 1985-02-19 | 1986-08-28 | Oerlikon Buehrle Inc | Etching aluminum/copper alloy films |
EP0203560A1 (fr) * | 1985-05-31 | 1986-12-03 | Tegal Corporation | Gravure de tranchées à l'aide de plasma |
DE3613181C2 (de) * | 1986-04-18 | 1995-09-07 | Siemens Ag | Verfahren zum Erzeugen von Gräben mit einstellbarer Steilheit der Grabenwände in aus Silizium bestehenden Halbleitersubstraten |
EP0246514A3 (fr) * | 1986-05-16 | 1989-09-20 | Air Products And Chemicals, Inc. | Gravure de sillons profonds dans du silicium monocristallin |
US4917586A (en) * | 1987-02-25 | 1990-04-17 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US5087418A (en) * | 1987-02-25 | 1992-02-11 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US5171525A (en) * | 1987-02-25 | 1992-12-15 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4818488A (en) * | 1987-02-25 | 1989-04-04 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4976920A (en) * | 1987-07-14 | 1990-12-11 | Adir Jacob | Process for dry sterilization of medical devices and materials |
US4801427A (en) * | 1987-02-25 | 1989-01-31 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US5200158A (en) * | 1987-02-25 | 1993-04-06 | Adir Jacob | Process and apparatus for dry sterilization of medical devices and materials |
US4931261A (en) * | 1987-02-25 | 1990-06-05 | Adir Jacob | Apparatus for dry sterilization of medical devices and materials |
US4943417A (en) * | 1987-02-25 | 1990-07-24 | Adir Jacob | Apparatus for dry sterilization of medical devices and materials |
EP0295581A1 (fr) * | 1987-06-19 | 1988-12-21 | Tegal Corporation | Procédé de décapage d'aluminium dans un plasma |
US4981551A (en) * | 1987-11-03 | 1991-01-01 | North Carolina State University | Dry etching of silicon carbide |
US4946547A (en) * | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
JP3092185B2 (ja) * | 1990-07-30 | 2000-09-25 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US5217567A (en) * | 1992-02-27 | 1993-06-08 | International Business Machines Corporation | Selective etching process for boron nitride films |
JP2734915B2 (ja) * | 1992-11-18 | 1998-04-02 | 株式会社デンソー | 半導体のドライエッチング方法 |
JP2884970B2 (ja) * | 1992-11-18 | 1999-04-19 | 株式会社デンソー | 半導体のドライエッチング方法 |
JP3370806B2 (ja) | 1994-11-25 | 2003-01-27 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
US5711849A (en) * | 1995-05-03 | 1998-01-27 | Daniel L. Flamm | Process optimization in gas phase dry etching |
KR100528569B1 (ko) | 1997-09-24 | 2005-11-15 | 인피니언 테크놀로지스 아게 | 실리콘 기판에 트렌치 구조물을 형성하는 방법 |
US6399507B1 (en) | 1999-09-22 | 2002-06-04 | Applied Materials, Inc. | Stable plasma process for etching of films |
US20050029226A1 (en) * | 2003-08-07 | 2005-02-10 | Advanced Power Technology, Inc. | Plasma etching using dibromomethane addition |
US8649123B1 (en) | 2008-11-26 | 2014-02-11 | Western Digital (Fremont), Llc | Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabrication |
US8257597B1 (en) | 2010-03-03 | 2012-09-04 | Western Digital (Fremont), Llc | Double rie damascene process for nose length control |
JP5537324B2 (ja) * | 2010-08-05 | 2014-07-02 | 株式会社東芝 | 半導体装置の製造方法 |
JP7304557B2 (ja) * | 2019-07-16 | 2023-07-07 | パナソニックIpマネジメント株式会社 | プラズマエッチング方法および素子チップの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1417085A (en) * | 1973-05-17 | 1975-12-10 | Standard Telephones Cables Ltd | Plasma etching |
US3994793A (en) * | 1975-05-22 | 1976-11-30 | International Business Machines Corporation | Reactive ion etching of aluminum |
US4069096A (en) * | 1975-11-03 | 1978-01-17 | Texas Instruments Incorporated | Silicon etching process |
DE2716592C3 (de) * | 1976-04-15 | 1979-11-08 | Hitachi, Ltd., Tokio | Plasma-Ätzvorrichtung |
CA1059882A (fr) * | 1976-08-16 | 1979-08-07 | Northern Telecom Limited | Burinage de l'aluminium et de l'alumine au plasma gazeux |
US4030967A (en) * | 1976-08-16 | 1977-06-21 | Northern Telecom Limited | Gaseous plasma etching of aluminum and aluminum oxide |
-
1978
- 1978-07-31 US US05/929,568 patent/US4226665A/en not_active Expired - Lifetime
-
1979
- 1979-07-19 CA CA332,163A patent/CA1124207A/fr not_active Expired
- 1979-07-23 SE SE7906299A patent/SE442358B/sv unknown
- 1979-07-25 AU AU49237/79A patent/AU524556B2/en not_active Expired
- 1979-07-25 FR FR7919156A patent/FR2445621B1/fr not_active Expired
- 1979-07-25 BE BE0/196453A patent/BE877893A/fr not_active IP Right Cessation
- 1979-07-25 IL IL57888A patent/IL57888A/xx unknown
- 1979-07-26 DE DE19792930292 patent/DE2930292A1/de active Granted
- 1979-07-26 GB GB7926038A patent/GB2026395B/en not_active Expired
- 1979-07-30 NL NL7905868A patent/NL7905868A/nl active Search and Examination
- 1979-07-30 IT IT24775/79A patent/IT1193492B/it active
- 1979-07-30 ES ES482960A patent/ES482960A1/es not_active Expired
- 1979-07-31 JP JP9687979A patent/JPS5521595A/ja active Granted
- 1979-08-08 IE IE1448/79A patent/IE48606B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2478421A1 (fr) * | 1980-02-06 | 1981-09-18 | Western Electric Co | Procede de fabrication de dispositifs microminiatures par attaque reactive du silicium avec bombardement |
Also Published As
Publication number | Publication date |
---|---|
AU524556B2 (en) | 1982-09-23 |
GB2026395B (en) | 1982-07-14 |
IT1193492B (it) | 1988-07-08 |
DE2930292C2 (fr) | 1988-01-21 |
CA1124207A (fr) | 1982-05-25 |
GB2026395A (en) | 1980-02-06 |
IL57888A (en) | 1981-10-30 |
SE7906299L (sv) | 1980-02-01 |
IT7924775A0 (it) | 1979-07-30 |
NL7905868A (nl) | 1980-02-04 |
JPS5521595A (en) | 1980-02-15 |
IE48606B1 (en) | 1985-03-20 |
IL57888A0 (en) | 1979-11-30 |
AU4923779A (en) | 1980-02-07 |
JPS5711954B2 (fr) | 1982-03-08 |
BE877893A (fr) | 1979-11-16 |
SE442358B (sv) | 1985-12-16 |
ES482960A1 (es) | 1980-03-01 |
DE2930292A1 (de) | 1980-02-28 |
IE791448L (en) | 1980-01-31 |
FR2445621B1 (fr) | 1986-10-03 |
US4226665A (en) | 1980-10-07 |
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