FR2442508A1 - Boitier de dispositif a semi-conducteurs - Google Patents
Boitier de dispositif a semi-conducteursInfo
- Publication number
- FR2442508A1 FR2442508A1 FR7929042A FR7929042A FR2442508A1 FR 2442508 A1 FR2442508 A1 FR 2442508A1 FR 7929042 A FR7929042 A FR 7929042A FR 7929042 A FR7929042 A FR 7929042A FR 2442508 A1 FR2442508 A1 FR 2442508A1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- device housing
- enclosure
- filled
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/37025—Plural core members
- H01L2224/37026—Plural core members being mutually engaged together, e.g. through inserts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01007—Nitrogen [N]
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L2924/01028—Nickel [Ni]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/01032—Germanium [Ge]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
L'invention concerne les dispositifs à semi-conducteurs. Une pastille semi-conductrice 22 est montée à l'intérieur d'une chambre hermétiquement fermée 40 qui est formée par une embase 12, conductrice de la chaleur, et une enceinte 30 pratiquement rigide. Cette enceinte comprend une chambre supérieure ouverte qui contient les bornes électriques et qui est emplie d'une couche d'obturation et de renfort 74. Application à la fabrication des transistors de puissance.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/963,807 US4249034A (en) | 1978-11-27 | 1978-11-27 | Semiconductor package having strengthening and sealing upper chamber |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2442508A1 true FR2442508A1 (fr) | 1980-06-20 |
FR2442508B1 FR2442508B1 (fr) | 1986-02-28 |
Family
ID=25507743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7929042A Expired FR2442508B1 (fr) | 1978-11-27 | 1979-11-26 | Boitier de dispositif a semi-conducteurs |
Country Status (7)
Country | Link |
---|---|
US (1) | US4249034A (fr) |
JP (1) | JPS5595344A (fr) |
DE (1) | DE2945972C2 (fr) |
FR (1) | FR2442508B1 (fr) |
GB (1) | GB2039144B (fr) |
IE (1) | IE48638B1 (fr) |
MX (1) | MX147809A (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503526A1 (fr) * | 1981-04-03 | 1982-10-08 | Silicium Semiconducteur Ssc | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
FR2531269A1 (fr) * | 1982-07-30 | 1984-02-03 | Bosch Gmbh Robert | Element de construction electrique contenant un element de construction electronique |
EP0505193A1 (fr) * | 1991-03-21 | 1992-09-23 | Harris Corporation | Couvercle pour empaquetage de composants électriques |
DE19534607A1 (de) * | 1995-09-18 | 1997-03-20 | Eupec Gmbh & Co Kg | Gehäuse für ein Leistungs-Halbleitermodul |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349831A (en) * | 1979-09-04 | 1982-09-14 | General Electric Company | Semiconductor device having glass and metal package |
JPS5746662A (en) * | 1980-09-04 | 1982-03-17 | Toshiba Corp | Semiconductor rectifier |
US4530003A (en) * | 1981-02-02 | 1985-07-16 | Motorola, Inc. | Low-cost power device package with quick connect terminals and electrically isolated mounting means |
DE3127457C2 (de) * | 1981-07-11 | 1985-09-12 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul |
DE3127456A1 (de) * | 1981-07-11 | 1983-02-03 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichteranordnung |
US4721543A (en) * | 1982-09-30 | 1988-01-26 | Burr-Brown Corporation | Hermetic sealing device |
US4568962A (en) * | 1982-11-08 | 1986-02-04 | Motorola, Inc. | Plastic encapsulated semiconductor power device means and method |
DE3241509A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
IT1212780B (it) * | 1983-10-21 | 1989-11-30 | Ates Componenti Elettron | Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione. |
US4611389A (en) * | 1983-11-03 | 1986-09-16 | Motorola, Inc. | Low-cost power device package with quick-connect terminals and electrically isolated mounting means |
GB8410847D0 (en) * | 1984-04-27 | 1984-06-06 | Westinghouse Brake & Signal | Semiconductor housings |
GB8625472D0 (en) * | 1986-10-24 | 1986-11-26 | Bicc Plc | Circuit board installation |
US5105262A (en) * | 1988-09-19 | 1992-04-14 | Ford Motor Company | Thick film circuit housing assembly design |
GB2249869B (en) * | 1990-09-17 | 1994-10-12 | Fuji Electric Co Ltd | Semiconductor device |
EP0582694B1 (fr) * | 1992-01-27 | 1998-05-20 | Harris Corporation | Dispositif a semi-conducteur avec un substrat semi-conducteur et une plaque en ceramique comme couvercle |
JP3092307B2 (ja) * | 1992-04-16 | 2000-09-25 | 富士電機株式会社 | 半導体圧力センサ |
US5699152A (en) * | 1995-04-03 | 1997-12-16 | Alltrista Corporation | Electro-optical inspection system and method |
WO1997004395A1 (fr) * | 1995-07-20 | 1997-02-06 | Dallas Semiconductor Corporation | Procede et appareil permettant la creation de cles de cryptage |
US6554774B1 (en) * | 2000-03-23 | 2003-04-29 | Tensys Medical, Inc. | Method and apparatus for assessing hemodynamic properties within the circulatory system of a living subject |
US6991969B2 (en) * | 2003-02-19 | 2006-01-31 | Octavian Scientific, Inc. | Methods and apparatus for addition of electrical conductors to previously fabricated device |
DE102004040596A1 (de) * | 2004-08-21 | 2006-02-23 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einem Gehäuse und einem Kühlkörper |
US8536062B2 (en) * | 2007-09-21 | 2013-09-17 | Advanced Inquiry Systems, Inc. | Chemical removal of oxide layer from chip pads |
US20100066395A1 (en) | 2008-03-13 | 2010-03-18 | Johnson Morgan T | Wafer Prober Integrated With Full-Wafer Contacter |
JP5767932B2 (ja) * | 2011-09-30 | 2015-08-26 | 新電元工業株式会社 | 半導体装置 |
DE102016209577A1 (de) * | 2016-06-01 | 2017-12-07 | Siemens Aktiengesellschaft | Leistungsmodul |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1471889A (fr) * | 1965-03-22 | 1967-03-03 | Gen Electric | Perfectionnements aux dispositifs semiconducteurs |
DE1564567A1 (de) * | 1966-04-16 | 1969-09-25 | Siemens Ag | Halbleiteranordnung |
FR2283552A1 (fr) * | 1973-07-25 | 1976-03-26 | Semikron Gleichrichterbau | Dispositif redresseur a semi-conducteurs a refroidissement par fluide |
DE2624226A1 (de) * | 1976-05-29 | 1977-12-15 | Semikron Gleichrichterbau | Halbleitergleichrichteranordnung |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3217213A (en) * | 1961-06-02 | 1965-11-09 | Slater Electric Inc | Semiconductor diode construction with heat dissipating housing |
CH397058A (de) * | 1962-01-10 | 1965-08-15 | Bbc Brown Boveri & Cie | Anordnung für das Anschliessen der Steuerelektrode bei einem steuerbaren Halbleiter-Gleichrichter |
BE629939A (fr) * | 1962-03-24 | |||
US3311798A (en) * | 1963-09-27 | 1967-03-28 | Trw Semiconductors Inc | Component package |
US3268309A (en) * | 1964-03-30 | 1966-08-23 | Gen Electric | Semiconductor contact means |
DE1564749A1 (de) * | 1966-10-27 | 1970-01-08 | Semikron Gleichrichterbau | Halbleiteranordnung |
DE1639402B2 (de) * | 1968-02-08 | 1976-12-16 | Siemens AG, 1000 Berlin und 8000 München | Steuerbares halbleiterbauelement |
DE1935227A1 (de) * | 1969-07-11 | 1971-01-14 | Siemens Ag | Halbleiterbauelement |
DE2042333A1 (de) * | 1970-08-26 | 1972-03-02 | Siemens Ag | Verfahren zum gasdichten Verschließen von Halbleiterbauelementen |
GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
US3904939A (en) * | 1974-02-11 | 1975-09-09 | Gen Electric | Capacitor case seal and venting means |
DE7512573U (de) * | 1975-04-19 | 1975-09-04 | Semikron Gesellschaft Fuer Gleichri | Halbleitergleichrichteranordnung |
-
1978
- 1978-11-27 US US05/963,807 patent/US4249034A/en not_active Expired - Lifetime
-
1979
- 1979-10-24 IE IE2037/79A patent/IE48638B1/en unknown
- 1979-10-26 GB GB7937277A patent/GB2039144B/en not_active Expired
- 1979-11-14 DE DE2945972A patent/DE2945972C2/de not_active Expired
- 1979-11-26 MX MX180195A patent/MX147809A/es unknown
- 1979-11-26 FR FR7929042A patent/FR2442508B1/fr not_active Expired
- 1979-11-27 JP JP15251779A patent/JPS5595344A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1471889A (fr) * | 1965-03-22 | 1967-03-03 | Gen Electric | Perfectionnements aux dispositifs semiconducteurs |
DE1564567A1 (de) * | 1966-04-16 | 1969-09-25 | Siemens Ag | Halbleiteranordnung |
FR2283552A1 (fr) * | 1973-07-25 | 1976-03-26 | Semikron Gleichrichterbau | Dispositif redresseur a semi-conducteurs a refroidissement par fluide |
DE2624226A1 (de) * | 1976-05-29 | 1977-12-15 | Semikron Gleichrichterbau | Halbleitergleichrichteranordnung |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503526A1 (fr) * | 1981-04-03 | 1982-10-08 | Silicium Semiconducteur Ssc | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
FR2531269A1 (fr) * | 1982-07-30 | 1984-02-03 | Bosch Gmbh Robert | Element de construction electrique contenant un element de construction electronique |
EP0505193A1 (fr) * | 1991-03-21 | 1992-09-23 | Harris Corporation | Couvercle pour empaquetage de composants électriques |
DE19534607A1 (de) * | 1995-09-18 | 1997-03-20 | Eupec Gmbh & Co Kg | Gehäuse für ein Leistungs-Halbleitermodul |
DE19534607C2 (de) * | 1995-09-18 | 2002-02-07 | Eupec Gmbh & Co Kg | Gehäuse mit Leistungs-Halbleiterbauelementen |
Also Published As
Publication number | Publication date |
---|---|
IE792037L (en) | 1980-05-27 |
MX147809A (es) | 1983-01-13 |
IE48638B1 (en) | 1985-04-03 |
JPS617025B2 (fr) | 1986-03-03 |
GB2039144A (en) | 1980-07-30 |
GB2039144B (en) | 1983-06-15 |
DE2945972C2 (de) | 1986-09-11 |
US4249034A (en) | 1981-02-03 |
JPS5595344A (en) | 1980-07-19 |
DE2945972A1 (de) | 1980-06-04 |
FR2442508B1 (fr) | 1986-02-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |