FR2434002A1 - LASER WELDING METHOD AND APPARATUS - Google Patents
LASER WELDING METHOD AND APPARATUSInfo
- Publication number
- FR2434002A1 FR2434002A1 FR7919725A FR7919725A FR2434002A1 FR 2434002 A1 FR2434002 A1 FR 2434002A1 FR 7919725 A FR7919725 A FR 7919725A FR 7919725 A FR7919725 A FR 7919725A FR 2434002 A1 FR2434002 A1 FR 2434002A1
- Authority
- FR
- France
- Prior art keywords
- laser welding
- welding method
- welds
- soldering
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
L'invention concerne un procédé et un appareil de soudage par laser. Des dispositifs optiques focalisent simultanément des faisceaux laser cohérents sur des soudures aux extrémités opposées d'un composant L'énergie ainsi produite fait refondre la soudure, et les deux soudures sont formées simultanément au refroidissement. L'invention s'applique notamment au soudage des condensateurs plats sur des plaques de circuits imprimés.A method and apparatus for laser welding is disclosed. Optical devices simultaneously focus coherent laser beams on welds at opposite ends of a component. The energy thus produced causes the weld to melt, and both welds are formed simultaneously on cooling. The invention applies in particular to the soldering of flat capacitors on printed circuit boards.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93667178A | 1978-08-24 | 1978-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2434002A1 true FR2434002A1 (en) | 1980-03-21 |
FR2434002B1 FR2434002B1 (en) | 1983-08-12 |
Family
ID=25468940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7919725A Granted FR2434002A1 (en) | 1978-08-24 | 1979-07-31 | LASER WELDING METHOD AND APPARATUS |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5530895A (en) |
CA (1) | CA1123920A (en) |
DE (1) | DE2934407A1 (en) |
FR (1) | FR2434002A1 (en) |
GB (1) | GB2038220B (en) |
IT (1) | IT1120489B (en) |
NL (1) | NL7906042A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0223066A1 (en) * | 1985-11-11 | 1987-05-27 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Device for soldering electronic components on a printed-circuit board |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0085278A1 (en) * | 1982-01-28 | 1983-08-10 | Battelle Development Corporation | Split beam method of altering material properties |
JPH0347730Y2 (en) * | 1985-04-18 | 1991-10-11 | ||
JPH0677811B2 (en) * | 1986-01-20 | 1994-10-05 | 株式会社ハイベツク | Automatic soldering equipment |
JPH0783036B2 (en) * | 1987-12-11 | 1995-09-06 | 三菱電機株式会社 | Carrier tape |
JPH02138066U (en) * | 1989-04-17 | 1990-11-19 | ||
US5309545A (en) * | 1990-08-27 | 1994-05-03 | Sierra Research And Technology, Inc. | Combined radiative and convective rework system |
US5060288A (en) * | 1990-08-27 | 1991-10-22 | Sierra Research And Technology, Inc. | Infrared heater array for IC soldering |
DE19833368C1 (en) * | 1998-07-24 | 2000-02-17 | Schott Glas | Method and device for processing components made of brittle materials |
JP2005347415A (en) * | 2004-06-01 | 2005-12-15 | Miyachi Technos Corp | Electric part mounting method |
WO2006037566A1 (en) | 2004-10-06 | 2006-04-13 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg | Laser arrangement |
WO2006037370A1 (en) * | 2004-10-06 | 2006-04-13 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg | Laser array |
CN110948079B (en) * | 2019-12-24 | 2023-10-10 | 武汉嘉铭激光股份有限公司 | Double-laser tin soldering combined device and welding method thereof |
CN114682948B (en) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | Method, device and system for testing weldability of chip component |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3524046A (en) * | 1968-04-26 | 1970-08-11 | Aluminum Co Of America | Apparatus and method for piercing holes in elastomeric articles |
US4083629A (en) * | 1976-11-29 | 1978-04-11 | Gte Laboratories Incorporated | Beam splitting system for a welding laser |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1565832A1 (en) * | 1966-09-06 | 1970-02-12 | Siemens Ag | Optical arrangement for laser beams |
GB1371624A (en) * | 1971-03-26 | 1974-10-23 | Atomic Energy Authority Uk | Optical processing of materials |
JPS5539434B2 (en) * | 1972-08-25 | 1980-10-11 | ||
JPS5310937B2 (en) * | 1973-05-18 | 1978-04-18 | ||
JPS5148917B2 (en) * | 1973-10-26 | 1976-12-23 | ||
GB1510899A (en) * | 1975-11-21 | 1978-05-17 | Boc Ltd | Laser machining |
JPS5297696U (en) * | 1976-01-21 | 1977-07-22 |
-
1979
- 1979-07-13 CA CA331,825A patent/CA1123920A/en not_active Expired
- 1979-07-20 GB GB7925327A patent/GB2038220B/en not_active Expired
- 1979-07-31 FR FR7919725A patent/FR2434002A1/en active Granted
- 1979-08-07 IT IT49988/79A patent/IT1120489B/en active
- 1979-08-07 NL NL7906042A patent/NL7906042A/en not_active Application Discontinuation
- 1979-08-24 JP JP10805979A patent/JPS5530895A/en active Granted
- 1979-08-24 DE DE19792934407 patent/DE2934407A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3524046A (en) * | 1968-04-26 | 1970-08-11 | Aluminum Co Of America | Apparatus and method for piercing holes in elastomeric articles |
US4083629A (en) * | 1976-11-29 | 1978-04-11 | Gte Laboratories Incorporated | Beam splitting system for a welding laser |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0223066A1 (en) * | 1985-11-11 | 1987-05-27 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Device for soldering electronic components on a printed-circuit board |
Also Published As
Publication number | Publication date |
---|---|
IT7949988A0 (en) | 1979-08-07 |
GB2038220B (en) | 1982-10-20 |
FR2434002B1 (en) | 1983-08-12 |
NL7906042A (en) | 1980-02-26 |
IT1120489B (en) | 1986-03-26 |
JPS6349594B2 (en) | 1988-10-05 |
JPS5530895A (en) | 1980-03-04 |
GB2038220A (en) | 1980-07-23 |
CA1123920A (en) | 1982-05-18 |
DE2934407A1 (en) | 1980-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |