GB2038220B - Soldering apparatus and method - Google Patents

Soldering apparatus and method

Info

Publication number
GB2038220B
GB2038220B GB7925327A GB7925327A GB2038220B GB 2038220 B GB2038220 B GB 2038220B GB 7925327 A GB7925327 A GB 7925327A GB 7925327 A GB7925327 A GB 7925327A GB 2038220 B GB2038220 B GB 2038220B
Authority
GB
United Kingdom
Prior art keywords
soldering apparatus
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7925327A
Other versions
GB2038220A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of GB2038220A publication Critical patent/GB2038220A/en
Application granted granted Critical
Publication of GB2038220B publication Critical patent/GB2038220B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB7925327A 1978-08-24 1979-07-20 Soldering apparatus and method Expired GB2038220B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93667178A 1978-08-24 1978-08-24

Publications (2)

Publication Number Publication Date
GB2038220A GB2038220A (en) 1980-07-23
GB2038220B true GB2038220B (en) 1982-10-20

Family

ID=25468940

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7925327A Expired GB2038220B (en) 1978-08-24 1979-07-20 Soldering apparatus and method

Country Status (7)

Country Link
JP (1) JPS5530895A (en)
CA (1) CA1123920A (en)
DE (1) DE2934407A1 (en)
FR (1) FR2434002A1 (en)
GB (1) GB2038220B (en)
IT (1) IT1120489B (en)
NL (1) NL7906042A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0085278A1 (en) * 1982-01-28 1983-08-10 Battelle Development Corporation Split beam method of altering material properties
JPH0347730Y2 (en) * 1985-04-18 1991-10-11
DE3539933A1 (en) * 1985-11-11 1987-05-14 Nixdorf Computer Ag DEVICE FOR SOLELING ELECTRONIC COMPONENTS ON A CIRCUIT BOARD
JPH0677811B2 (en) * 1986-01-20 1994-10-05 株式会社ハイベツク Automatic soldering equipment
JPH0783036B2 (en) * 1987-12-11 1995-09-06 三菱電機株式会社 Carrier tape
JPH02138066U (en) * 1989-04-17 1990-11-19
US5060288A (en) * 1990-08-27 1991-10-22 Sierra Research And Technology, Inc. Infrared heater array for IC soldering
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
DE19833368C1 (en) * 1998-07-24 2000-02-17 Schott Glas Method and device for processing components made of brittle materials
JP2005347415A (en) * 2004-06-01 2005-12-15 Miyachi Technos Corp Electric part mounting method
WO2006037370A1 (en) * 2004-10-06 2006-04-13 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Laser array
DE502005007859D1 (en) 2004-10-06 2009-09-17 Limo Patentverwaltung Gmbh LASER ARRANGEMENT
CN110948079B (en) * 2019-12-24 2023-10-10 武汉嘉铭激光股份有限公司 Double-laser tin soldering combined device and welding method thereof
CN114682948B (en) * 2022-03-04 2023-10-31 广东风华高新科技股份有限公司 Method, device and system for testing weldability of chip component

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565832A1 (en) * 1966-09-06 1970-02-12 Siemens Ag Optical arrangement for laser beams
US3524046A (en) * 1968-04-26 1970-08-11 Aluminum Co Of America Apparatus and method for piercing holes in elastomeric articles
GB1371624A (en) * 1971-03-26 1974-10-23 Atomic Energy Authority Uk Optical processing of materials
JPS5539434B2 (en) * 1972-08-25 1980-10-11
JPS5310937B2 (en) * 1973-05-18 1978-04-18
JPS5148917B2 (en) * 1973-10-26 1976-12-23
GB1510899A (en) * 1975-11-21 1978-05-17 Boc Ltd Laser machining
JPS5297696U (en) * 1976-01-21 1977-07-22
US4083629A (en) * 1976-11-29 1978-04-11 Gte Laboratories Incorporated Beam splitting system for a welding laser

Also Published As

Publication number Publication date
FR2434002A1 (en) 1980-03-21
CA1123920A (en) 1982-05-18
JPS6349594B2 (en) 1988-10-05
NL7906042A (en) 1980-02-26
IT7949988A0 (en) 1979-08-07
JPS5530895A (en) 1980-03-04
IT1120489B (en) 1986-03-26
DE2934407A1 (en) 1980-03-06
GB2038220A (en) 1980-07-23
FR2434002B1 (en) 1983-08-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee