JPH0347730Y2 - - Google Patents

Description

[Detailed explanation of the idea] Technical field The present invention relates to an automatic laser soldering device.

Prior Art In this type of conventional apparatus, soldering using paste solder is often performed by a laser irradiation type work unit mounted on an automatic robot machine. However, when pasty solder containing flux (pine resin) is irradiated with a non-contact laser heat source, the flux is rapidly heated and boils, resulting in the solder becoming spherical and scattering before it melts and adheres. There is a problem with this.

As a countermeasure, we installed separate stations for applying paste solder and for melting and welding after application, and installed preheating means between these stations. A method of welding using a laser has been adopted.

However, in the case of such conventional equipment, the dispensing and welding stations are installed separately, which negates the advantage of consistent soldering operations at the same location, and also increases the length of the assembly line. There is a point. In addition, the equipment cost of preheating means is high, and it cannot be used for electronic components that do not want to be affected by heat-induced deterioration of the elements, which narrows the scope of application of laser soldering. .

Purpose of the invention The present invention was made in order to solve the above-mentioned problems of the conventional device, and it is possible to continuously preheat and weld paste solder in a single machine, and to achieve high-precision soldering. The purpose is to provide an automatic laser soldering device that can perform

Structure of the invention The laser automatic soldering device according to the invention includes a conveyance means for conveying a printed circuit board from upstream to downstream on a conveyance path, and a solder portion provided on the upstream of the conveyance path and applied to electronic components on the printed circuit board. a preheating laser irradiation head that irradiates laser light to preheat the electronic components; and a welding laser that is provided downstream of the conveyance path and irradiates laser light to weld only the preheated solder portions of the electronic components on the printed circuit board. A movable hand equipped with an irradiation head, the preheating laser irradiation head and the welding laser irradiation head, welding solder on a printed circuit board downstream of the conveyance path, and preheating the hand of the printed circuit board upstream of the conveyance path. an automatic machine that controls the operations to be performed at the same time;
a laser supply source for supplying the laser beam; a spectroscopy means for dispersing the laser beam from the laser supply source into a preset ratio; and welding the laser beam separated by the spectrometry means to the preheating laser irradiation head. The invention is characterized in that it has a laser irradiation head and an optical fiber introduced into the laser irradiation head.

Embodiment Hereinafter, an automatic laser soldering device according to an embodiment of the present invention will be described with reference to the drawings.

In work unit U that performs soldering, 1
2 is a laser source; 2 is a reflector that separates the laser beam from the laser source into two bundles with different output powers; 3 is a fiber coupling device that couples each of the separated laser beams to an optical fiber 4; 5 is an optical fiber. An automatic machine such as a robot that can freely move the coordinate axis system by holding one end of 4, 6 and 7 are the hands 5 of the automatic machine 5.
This is a laser irradiation head that is attached to the optical fiber 4 and emits a laser beam through the optical fiber 4.

Furthermore, the distance between the two laser irradiation heads 6 and 7 is determined by the distance between two printed circuit boards (hereinafter referred to as "workpieces") 9 and 10, which are respectively positioned at two stations on the conveyor 8 and are to be soldered. It has dimensions that can accommodate the following.

Furthermore, a work supply section 11 is connected to the upstream end of the conveyor 8 . In this workpiece supply section 11, paste solder is applied in advance to the parts of the circuit wiring on the works 9 and 10 to be soldered, and the soldered parts to be bonded are placed on this application part until they are set. The following steps are performed.

In such a configuration, the first workpiece 9 that has been subjected to the above-mentioned necessary pretreatment in the workpiece supply section 11
is transported to an upstream station by the transport conveyor 8 and positioned.

In the laser irradiation head 6 corresponding to the positioned workpiece 9, the output power and processing conditions suitable for preheating the paste-like paste that has already been applied are set, that is, the spectroscopy of the laser supplied from the laser supply source 1 at the reflecting mirror 2 is performed. Transmittance, reflectance, etc. are set.

It is also assumed that the distances between the laser irradiation heads 6, 7 and the printed circuit boards 10, 9 are adjusted so that the amount of defocus is suitable for preheating and soldering.

Based on these processing conditions, first, the solder application area for the workpiece 9 is preheated by the laser irradiation head 6.
After preheating, the workpiece 9 is moved by the conveyor 8 to a station at the position of the workpiece 10 in the figure and is positioned there. At this stage, the subsequent work 10 is heated by the preheated preceding work 9.
It reaches the position, is positioned, and waits to be preheated.

In the laser irradiation head 7 corresponding to the preceding work 9 which has been preheated and is positioned at the downstream station, the settings suitable for melting the preheated solder are the same as those of the preheating laser irradiation head 6 described above. have been made under different conditions.

In this way, the preceding workpiece 9 is partially welded with preheated solder by the laser irradiation head 7, and the solder application area of the subsequent workpiece 10 is preheated by the laser irradiation head 6. Then, the soldering section is moved by following the movement of the automatic machine 5 based on the taught program of the soldering section. Thereafter, a series of preheating and welding operations are performed on the continuously supplied workpieces by the operation of a single working unit U.

Effects of the Invention As can be understood from the above, the automatic laser soldering device according to the present invention is capable of preheating and welding the applied paste solder, and is equipped with a laser irradiation head that is suitably set for each. Since soldering is carried out continuously by a single working unit, high precision soldering can be achieved efficiently and the assembly line length can be shortened.

[Brief explanation of drawings]

The figure is an overall perspective view of an automatic laser soldering device according to an embodiment of the present invention. 1... Laser supply unit, 4... Optical fiber, 5...
...Automatic machine, 6... Laser irradiation head for preheating, 7...
...Laser irradiation head for melting, 8...Transport conveyor, 9, 10...Works such as printed circuit boards, 11
...Work supply section.

Claims (1)

[Scope of utility model registration request] a transport means for transporting a printed circuit board from upstream to downstream on a transport path; and a preheating laser provided upstream of the transport path that irradiates laser light to preheat only the solder portion applied to the electronic components on the printed circuit board. an irradiation head; a welding laser irradiation head that is provided downstream of the conveyance path and irradiates a laser beam for welding only the preheated solder portion of the electronic component on the printed circuit board; the preheating laser irradiation head and the welding head; a movable hand equipped with a laser irradiation head; an automatic machine configured to simultaneously perform welding of solder on a printed circuit board downstream of the conveyance path and preheating of the hand on a printed circuit board upstream of the conveyance path; a laser supply source for supplying a welding laser, a spectroscopic means for dispersing the laser light from the laser supply source into predetermined ratios, and a dispersion means for transmitting the laser light separated by the spectrometer to the preheating laser irradiation head and the welding laser irradiation head. 1. A laser automatic soldering device comprising: a head; and an optical fiber introduced into the head.