JPS62275571A - Soldering method for electronic component by laser light and inserter of electronic component - Google Patents

Abstract

PURPOSE:To accurately solder an electronic component to the part where packaging components are crowded by blowing up a solder in advance into the through hole formed on a printed board, inserting the electronic component from the face side of one part of the printed board and projecting a laser light from the face side of the other part. CONSTITUTION:The printed board 40 subjected to a solder dipping in advance and flowing up a solder into a through hole 41 is set to the printed board setting part 10 of a soldering device. The printed board setting part 10 is then moved and the through hole 41 into which the lead wire of the electronic component is inserted is located. The work inserting head is then moved to hold the lead wires 44a, 44b of the electronic component 43 and press-contacted to the solder of the through holes 41a, 41b inside from the face side of one part of the printed board 40. The laser light of a laser light projecting device 30 is then stopped down adequately via lens units 33a, 33b from the face side of the other part of the printed board 30 and projected by inclining a very small angle for the extension direction of the lead wire.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method of soldering electronic components using a laser beam and an inserter for electronic components, and in particular, eliminates the need for supplying solder during laser reflow. A method for soldering electronic components using a laser beam suitable for smoothly inserting and soldering lead wires of electronic components into through-holes of a board, and an inserter for electronic components effective for carrying out this method. Regarding.

[Prior Art] A conventional technique for soldering lead wires of electronic components using this type of laser light is disclosed in Japanese Patent Application Laid-Open No. 58-1101.7.
Publication No. 2, Publication No. 5g-122175, Publication No. 58-20
There are techniques disclosed in Japanese Patent No. 5675 and Japanese Patent No. 59-92163.

In the technique disclosed in JP-A-58-110172, an object to be soldered is brought into contact with a soldering surface, the object to be soldered is fixed with a cylinder, the reflected laser is blocked by the cylinder, and the soldering This is to prevent surrounding objects from being burned out by the laser reflected from the surface.

Furthermore, in the technology disclosed in Japanese Patent Application Laid-Open No. 58-122175, when lead wires of electronic components are soldered to a printed circuit board, radiant light from the part to be soldered is focused on a detector, The system monitors the temperature of the laser, compares the temperature signal from the detector with a set value, and controls the power supply to the laser.

Next, in the technique disclosed in Japanese Patent Application Laid-Open No. 58-205675, the laser beam is split by a compound lens, the split laser beam is transmitted to the position of a condensing lens by an optical fiber, and the laser beam is transmitted to the position of a condensing lens through this condensing lens. The irradiation is aimed at the soldering area.

Next, in the technique disclosed in Japanese Patent Application Laid-Open No. 59-92163, lead wires protruding from both sides of the electronic component are placed on a flat package pattern adhered to a substrate, and each lead wire is is pressurized by a pressing mechanism, and the laser beam is continuously operated back and forth along the part to be soldered to perform soldering.

[Problems to be Solved by the Invention] However, in all of the above-mentioned conventional techniques, electronic components and their lead wires are arranged on one side of the board, and the lead wires are soldered.

Therefore, in the prior art, it is extremely difficult to smoothly and accurately solder electronic components to a portion of a board where mounted components are densely mounted.

An object of the present invention is to solve the problems of the prior art described above, and to solder electronic components using a laser beam, which enables accurate and smooth soldering of electronic components even in areas where mounted components are densely packed on a board. Another object of the present invention is to provide an inserter for electronic components that is effective for carrying out the method of the present invention.

[Means for Solving the Problems] In the method of the present invention, solder is flowed up in advance into through holes formed in a substrate for mounting electronic components.

Next, the lead wire of the electronic component is pressed against the solder in the through hole from one side of the board.

Then, a beam spot of a laser beam is focused on the through hole from the other side of the substrate to a diameter that matches the through hole, and at a minute angle with respect to the extending direction of the lead wire.
I'm trying to irradiate it at an angle.

In the inserter of the present invention, a workpiece chuck is attached to the workpiece insertion head.

The workpiece insertion head is movable between an electronic component receiving position and an electronic component insertion position.

The work chuck is configured to grip the base portion of the lead wire of the electronic component, and a push rod is provided inside the work chuck to open the work chuck at the same time as pushing the head portion of the electronic component. It is being

[Function] In the method of the present invention, solder is flowed up in advance into the through holes formed in the substrate, so there is no need to supply solder during soldering.

Furthermore, in the method of the present invention, the lead wire of the electronic component is pressed into contact with the solder in the through hole from one side of the board, and the beam spot of the laser beam is irradiated onto the through hole from the other side of the board. Therefore, it is possible to eliminate the problem that the inserter of the electronic component and the laser beam irradiation equipment intersect on one side of the board.

Therefore, the above-mentioned supply of solder is not required, and the problem of intersecting the inserter of the electronic component and the laser beam irradiation equipment can be solved. It is also possible to solder electronic components accurately.

Furthermore, in the method of the present invention, the lead wire of the electronic component is pressed into contact with the solder in the through hole from one side of the board, and the through hole is irradiated with laser light from the other side of the board, so the solder At the same time as the lead wire is heated, heat is also propagated to the tip of the lead wire, and the solder in the through hole is melted and the lead wire is inserted into the through hole at the same time.

Moreover, in the method of the present invention, the beam spot of the laser beam is narrowed down to a diameter that fits the through hole, and the beam spot is irradiated at a slight angle with respect to the direction in which the lead wire extends. It is possible to irradiate light and heat the inside of the through hole while avoiding interference with irradiation by the end face of the lead wire.

Therefore, the lead wire is inserted into the through hole at the same time as the solder in the through hole melts, the through hole can be irradiated with a laser beam accurately, and irradiation interference by the end face of the lead wire can be avoided. Combined with the fact that it can be heated, soldering can be done extremely smoothly.

Then, in the inserter of the present invention, the workpiece insertion head moves to the electronic component receiving position.

At this position, the work chuck is open, and the electronic component is received into the work chuck, and then the work chuck is closed, and the base portion of the lead wire of the electronic component is gripped by the work chuck.

Then, the workpiece insertion head moves to the insertion position of the lead wire of the electronic component into the through hole.

At this position, a push rod provided inside the workpiece chuck is pushed. As this push rod is pushed, the push rod pushes the head portion of the electronic component and at the same time opens the workpiece chuck. As a result, the work chuck releases the electronic component, and the lead wire of the electronic component is inserted into the through hole from one side of the board.

As mentioned above, in the inserter of the present invention, the workpiece chuck grips the base portion of the lead wire of the electronic component, and the workpiece chuck is not moved in the direction approaching the board at the insertion position of the lead wire of the electronic component. A push rod installed inside the chuck pushes the head of the electronic component, opens the workpiece chuck, and inserts the lead wire into the through hole, so the shadow area of the workpiece chuck becomes O, allowing mounting on the board. Electronic components can be easily inserted even in areas where components are crowded together.

[Example code] Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an example of the method of the present invention, and shows a state in which solder in a through hole is irradiated with a laser beam, and FIG. Figure 3 showing the process order of the method of the present invention applied to soldering resistors to
The figure is a partially enlarged sectional view of the soldered state, FIG. 4 is a diagram showing an example of an apparatus for implementing the method of the present invention, FIG. 5 is a sectional view of the inserter of the present invention, and b), (c
) is an explanatory diagram of the operation of inserting a lead wire of an electronic component into a through hole of a board by an inserter.

The embodiment of the soldering apparatus shown in FIG.
, the X and Y tables 3 and 8, the board setting section 10, the guide section for the workpiece insertion head, and the workpiece insertion head 16.
, a work chuck 17 attached thereto, and a laser beam irradiation device 30.

In this embodiment, the workpiece leg cutting type 2 has a lead wire of a resistor as an electronic component in a length slightly longer than the height of the mounted component around the insertion position of the electronic component, and a V-shaped tip. In addition to cutting into shapes, it also straightens the bends in the lead wires.

The X-table 3 is configured such that a ball screw 5 is rotated by reversibly rotating a pulse motor 4, and the action of the ball screw 5 and a nut 6 causes the X table 3 to reciprocate along the guide rails 1a and 7b.

The Y table 8 is mounted on the X table 3. When a pulse motor (not shown) is reversibly rotated, a ball screw (not shown) rotates, and the Y table 8 is rotated along guide rails 9a and 9b by the action of this ball screw and a nut (not shown). It is designed to reciprocate in a direction perpendicular to the moving direction of the X table 3.

The board setting section 10 is capable of removably setting a board on the Y table 8.

The guide portion for the workpiece insertion head is attached to the frame 1.
Brackets fixed opposite each other on top 1. la,
llb, both brackets lla and llb, two guide bars 12a and 12b are passed in parallel between them, and the first
゜Second head stopper 13, 14. The first head stopper 13 is adjustably screwed into the bracket lla on the side of the workpiece leg cutting die 2, and is adapted to restrict the workpiece insertion head 16 to a receiving position for electronic components on the workpiece leg cutting die 2. ing. The second head stopper 14 is connected to the guide bar 12a of the guide portion.
, 12b, and restricts the workpiece insertion head 16 to the insertion position of the lead wire of the electronic component.

The workpiece insertion head 16 is arranged on one side of the substrate set in the nest plate setting section 10. Further, this workpiece insertion head 16 is attached to the guide bars 12a and 12b of the guide section, and is attached to the fluid pressure cylinder 1.
5, and is movably provided between a receiving position for an electronic component on the workpiece foot cutting die 2 and a position for inserting a lead wire of the electronic component.

The work chuck 17 is as shown in FIG.

Two chuck parts 18a and L8b are provided facing each other.
The first and second spools 22a and 22b push the chuck portions 18a and 18b in the closing direction, and the first and second spools 22a and 22b push the chuck portions 18a and 18b in the closing direction. Second stopper 2
4a, 24b, and the third pushing the chuck parts 18a, 18b in the opening direction. fourth compression springs 25a, 25b;
The third position in the closing direction of the chuck portions 18a, 18b. It is configured to include fourth stoppers 26a and 26b and a pushbutton 27. The chuck portion 18a.

18b is formed in a hook shape, and cam surfaces 19a and 19b as inclined surfaces are formed on the inner side approximately in the middle in the length direction. Further, the chuck portions 18a, 18b
is attached to the workpiece insertion head 16 via pins 20a and 20b so as to be openable and closable, and is adapted to grip the base portion of the lead wire of the electronic component, which is the workpiece, between its tip portions. Said 1st. second spool 22
a, 22b are the first . It is fitted into the second fluid pressure chambers 21a and 21b to close the chuck portions 18a and 18b. In addition, the above-mentioned No. 1. Second spool 22a.

22b is the first. It is adapted to be returned by second compression springs 23a, 23b. Said 1st. The second stoppers 24a, 24b are connected to the first stoppers 24a, 24b. second spool 22a,
When 22b is returned, the chuck parts 18a and 18b
The movement in the opening direction is restricted. Said 3rd. The fourth compression springs 25a, 25b are interposed between the side of the workpiece insertion head 16 and the chuck parts 18a, 18b, and push the chuck parts 18a, 18b in the opening direction. Said 3rd. The fourth stoppers 26a, 26b are connected to the first stoppers 26a, 26b. The chuck portion 18a is secured by the second spools 22a and 22b.
, When 18b is pushed in the closing direction, the chuck part 1
The operations of 8g and 18b are restricted. Said pushpiece 27
The chuck portions 18a, 18 engage with the suppressing portion 27a of the head portion of the electronic component and the cam surfaces 19a, 19b.
It has a cam part 27b for opening the cam part 27b and a spool part 27c. Further, the spool portion 27c is connected to a third fluid pressure chamber 28 formed inside the workpiece insertion head 1G.
is inserted into. This pushbutton 27 is the insertion position of the lead wire of the electronic component into the through hole, and when the spool portion 27c is pushed forward, the suppressing portion 27a pushes the head portion of the electronic component and at the same time the cam portion 27b The chuck portions 18a and 18b are opened by means of the chuck portions 18a and 18b. Furthermore, the push rod 27 is adapted to be returned by a fifth compression spring 29. In addition, the above-mentioned No. 1. Second
, the third fluid pressure chambers 21a, 21b, and 2g are each connected to a fluid pressure supply source (not shown) such as a near compressor.

The laser beam irradiation device 3o is arranged on the other side of the substrate set in the substrate setting section IO. As shown in FIG. 1, this laser beam irradiation device 30 includes a lens unit mounting base 31, a lens unit 33a,
33b, a lens protection glass 36, and lens position adjustment knob groups 37a and 37b.

The lens units 33a and 33b are individually tiltably attached to arms 32a and 32b extending from the lens unit mounting base 31 toward the board setting section 10 via pins 34a and 34b. Further, the lens units 33a and 33b are laser oscillation units (not shown).
are connected to the electronic parts via optical fibers 35a and 35b, so that the beam spot of the laser beam can be irradiated onto the soldered portion of the electronic component. The position adjustment knob group 37a
, 37b are adapted to adjust the three-dimensional position of the lens units 33a, 33b via the arms 32a, 32b.

An embodiment of the method of the present invention will be explained in connection with the operation of the soldering apparatus of the above embodiment.

First, in the method of the present invention, the substrate 40 is soldered dipped, and the solder 42 is flowed up into the through hole 41 in advance.

Next, the board 40 with the solder 42 flowed up into the through holes 41 is set in the board setting section 10 of the soldering apparatus shown in FIG.

Next, the X and Y tables 3 and 8 are operated to move the board setting section 10 in a two-dimensional direction, and the through hole 41 into which the lead wire of the electronic component is to be inserted is positioned at the set position.

On the other hand, the workpiece leg cutting type 2 shown in FIG.
Here, the lead wire 44a of the resistor as the electronic component 43,
44b, cut both lead wires 44a and 44b into a V-shape that is slightly longer than the height of the mounted component around the insertion position, and cut the lead wires 44a and 44b into a V-shape.

44b is corrected.

Meanwhile, the chuck portion 18a of the workpiece chuck 17 attached to the workpiece insertion head 16 shown in FIG.

With 18b open, the workpiece insertion head 16 is moved along the guide bars 12a and 12b by the hydraulic cylinder 15.
is moved toward the receiving position of the electronic component 43. The workpiece insertion head 16 comes into contact with the first blade stopper 13, and the chuck portions L8a and 18b of the workpiece chuck 17 attached to the workpiece insertion head 16 are positioned at the receiving position of the electronic component 43.

Next, the first and second holes formed on the workpiece insertion head 16 are
Fluid pressure such as air is supplied into the fluid pressure chambers 21a and 21b of the first. The chuck portions 18a, 18b are closed via the second spools 22a, 22b. Then, the tip portions of the chuck portions 18a and 18b can
As can be seen from a), the lead wire 44a of the electronic component 43
, 44b by gripping the base portion thereof.

Chuck parts 18a and 18b of the work chuck 17
When the base portions of the lead wires 44a, 44b of the electronic component 43 are grasped by the guide bars 12a, 12b, the workpiece insertion head 16 is moved by the fluid pressure cylinder 15.
along the direction toward the insertion position of the electronic component 43.

This workpiece insertion head 16 is connected to the second blade stopper 1
The electronic component 43 held by the chuck parts 18a and 18b of the work chuck 17 is placed in the through hole 41 of the board 40 set in the board setting part 10.
Lead wires 44a and 44b are positioned at corresponding positions.

Next, as shown in FIG. 5, fluid pressure is supplied to the third fluid pressure chamber 28 formed in the workpiece insertion head 16 to pressurize the spool portion 27c of the pushbutton 27.

When the spool portion 27c of the push piece 27 is pressurized, the push piece 27 moves in the direction of the electronic component 43 held by the chuck portions 18a and 18b, as shown in FIGS. 6(a) and (b).
As shown in FIG. 2, the head portion of the electronic component 43 is pushed by the suppressing portion 27a, and at the same time, the chuck portions L8a, 18b are pushed open by the action of the cam surfaces L9a, 19b and the cam portion 27b.

As a result, as shown in FIG. 6(a), the electronic component 43
The tips of the leads 1i 44a, 44b are pressed against the solder 42 in the through holes 41a, 41b from one side of the substrate 4o.

Meanwhile, the lens units 33a and 33b of the laser beam irradiation device 30 shown in FIG.
Lead wire 44a pressure-welded to solder 42 of a and 41b
.

As shown in FIG. 3, it is inclined within the range of inclination angle θ=90±2° with respect to the extension direction of 44b. Also, from the lens units 33a and 33b, through holes 41a,
41b, and operate the position adjustment knob groups 37a, 37b so that the beam spot of the laser beam can be irradiated from the other side of the substrate 40 to the through holes 41a, 41b with a diameter of about 80%. and adjust. Note that the beam spot is positioned using a He-Ne guide beam.

Next, the laser beam emitted from the laser oscillation unit (not shown) is passed through a half mirror (not shown) with a transmittance of 50%.
The laser beam is split into two parts by an optical fiber 35a,
Lens unit 33a through 35b.

33b. And the lens unit 33a
.

As shown in FIGS. 1, 2(a), and 3 through 33b, the through hole 41 is
a, beam spot 45a on solder 42 in 41b;

45b and perform preheating.

When the beam spots 45a and 45b are irradiated onto the solder 42 in the through holes 41a and 41b, the solder 42
Heat is propagated to the lead wires 44a, 44b through the lead wires 44a, 44b, and as can be seen from FIGS. 2(b), 6(a), and (b), the lead wires 44a, 4
Since the pressure contact force 46 is applied in the insertion direction of the lead wires 44a and 44b, as the solder 42 melts, the lead wires 44a and 44b
are gradually inserted into the through-holes 41a and 41b, during which insertion heating is performed as shown in FIG. 2(b).

In addition, in Fig. 1, Fig. 6 (a), (b), (c), 48
indicates other electronic components.

As mentioned above, while applying the pressure contact force 46 to the head portion of the electronic component 43, the solder 42 in the through holes 41a and 41b is pressed.
By irradiating and heating the beam spots 45a and 45b, as shown in FIG. 1, FIG. 2(C), FIG. Lead wires 44a, 44b are through holes 41a, 41
(almost simultaneously) through the other side of the board 40.

Subsequently, by performing afterheating, the image shown in Fig. 2(c) is obtained.
As shown, the lead wire 44a is inserted.

A solder fillet 47 is formed around 44b, and leads 44a, 44b are completely soldered.

After soldering, the laser beam is cut and the first
．． releasing the fluid pressure in the second fluid pressure chambers 21a, 21b;
Third. By the action of the fourth compression springs 25a, 25b, the chuck portions 18a, 18b of the rework chuck 17 are opened, and the fluid pressure in the third fluid pressure chamber 28 is released.
The pushbutton 27 is returned by the action of the compression spring 29, and one stroke is completed.

As described above, in this embodiment, the solder is flowed up into the through holes of the board 40 in advance, so there is no need to supply solder during soldering.

Also, the lead wire 44a of the electronic component 43 to be soldered
, 44b into the through hole 41a to be inserted.

41b, and grip the base portions of the lead wires 44a and 44b with the chuck parts 18a and 18b of the work chuck 17.
At the insertion position of the lead wires 44a and 44b, the electronic component 4 is pushed by the pushbutton 27 provided inside the work chuck 17.
Since the head part 3 is pressed, the shadow area of the work chuck 17 becomes 0. Moreover.

Lead wires 44a and 44b are inserted from one side of the substrate 40, and a beam spot 45 of the laser beam is inserted from the other side.
a and 45b so that the inserter of the electronic component 43 and the laser beam irradiation device 30 do not intersect on one surface of the substrate 40. Therefore, the substrate 40
The electronic component 40 can be accurately soldered even on a portion where mounted components are densely packed.

Furthermore, in this embodiment, the lead wires 44a and 44b of the electronic component 43 are connected to the through hole 4 from one side of the board 40.
Since the lead wires 44a and 44b are pressed against the solder 42 in the solder 1a and 41b and the beam spots 45a and 45b are irradiated from the other side of the substrate 40, the solder 42 is heated and the lead wires 44a and 44b are connected to the through hole 41a. ,
41b. Also. beam spot 45a,
The diameter of 45b is reduced to about 80% of the diameter of through holes 41a, 41b, and lead wires 44a, 4
The through hole 41
a, 41b can be accurately irradiated with beam spots 45a, 45b, and the inserted lead wires 44a,
It is possible to heat the insides of the through holes 41a and 41b without the irradiation being obstructed by the end face of the through holes 44b. Therefore, the lead wires 44 are connected to the through holes 41a and 41b.
a and 44b can be inserted smoothly and soldered reliably.

[Effects of the Invention] According to the method of the present invention described above, solder is flowed up in advance into the through holes formed in the board for mounting electronic components, and the leads of the electronic components are connected from one side of the board. The wire is pressed into contact with the solder in the through hole, and the beam spot of the laser beam is focused on the through hole from the other side of the board to a diameter that matches the through hole, and at a minute angle with respect to the direction of extension of the lead wire. The irradiation is performed at an angle, and the solder is flowed up in advance into the through holes formed on the board, so there is no need to supply solder during soldering, and the solder is irradiated from one side of the board. The lead wire of the electronic component is pressed into contact with the solder inside the through hole, and the laser beam spot is irradiated onto the through hole from the other side of the board.
Coupled with the ability to eliminate the problem of the electronic component inserter and the laser beam irradiation equipment intersecting on one side of the board, it is possible to accurately place electronic components even in areas where the mounted components are densely packed on the board. It has the effect of being soldered.

Further, according to the method of the present invention, the lead wire of the electronic component is pressed into contact with the solder in the through hole from one side of the board, and the through hole is irradiated with laser light from the other side of the board. Therefore, at the same time as the solder is heated, heat is also propagated to the tip of the lead wire, and the solder in the through hole melts, allowing the lead wire to be inserted into the through hole at the same time. The laser beam is focused to a diameter that fits the hole, and the laser beam is irradiated at a slight angle and inclination to the direction of extension of the lead wire, so the through hole can be accurately irradiated with the laser beam, and the end surface of the lead wire Coupled with the ability to heat the inside of the through hole while avoiding irradiation interference caused by irradiation, the lead wire of the electronic component can be inserted extremely smoothly and the soldering can be performed reliably.

In addition, according to the inserter of the present invention, a work chuck that grips the base portion of the lead wire of the electronic component is attached to the component insertion head that is movable between the receiving position and the insertion position of the electronic component, and the work chuck can be opened and closed. At the same time, a push rod is provided inside the work chuck to open the work chuck at the same time as pushing the head of the electronic component at the insertion position of the lead wire of the electronic component in the through hole. Grasp the base of the lead wire of the electronic component, and at the insertion position of the electronic component lead wire, move the workpiece chuck in a direction approaching the board, and then remove the electronic component installed inside the workpiece chuck. By pressing the head part and opening the workpiece chuck to insert the lead wire into the through hole, the shadow area of the workpiece chuck can be reduced to 0, and as a result, even in areas where mounted components are densely packed on the board, This has the effect of allowing electronic components to be inserted easily.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an example of the method of the present invention, and shows a state in which solder in a through hole is irradiated with a laser beam, and FIG. Figure 3 showing the process order of the method of the present invention applied to soldering resistors to
The figure is a partially enlarged sectional view of the soldered state, FIG. 4 is a diagram showing an example of an apparatus for implementing the method of the present invention, FIG. 5 is a sectional view of the inserter of the present invention, and b), (c
) is an explanatory diagram of the operation of inserting a lead wire of an electronic component into a through hole of a board by an inserter. 2... Work leg cutting type, 3, 8... X, Y table. DESCRIPTION OF SYMBOLS 10... Board setting part, 13... A first head stopper that positions the workpiece insertion head at a receiving position for electronic components, 14... Positions the workpiece insertion head at a position where a lead wire is inserted into a through hole. a second spatula stopper, 15... a workpiece insertion head constituting the inserter, 17... the same workpiece chuck, 18a;
18b...Chuck part of work chuck, 22a. 22b...The first step for closing the chuck part. Second spool, 25a, 25b... 3rd and fourth compression springs for closing the chuck part, 27... Push rod, 27a...
- Pressing part of head part of electronic component, 27b... Cam part for opening the chuck part, 30... Laser light irradiation device, 31... Lens unit mounting stand, 33a, 3
3b... Lens unit, 35a, 35b... Optical fiber, 37a, 37b... Lens unit adjustment knob group, 40... Board, 41a, 41b...
・Through hole, 42...Solder inside the through hole,
43... Electronic component, 45a, 45b... Beam spot, 46... Pressing force for pressing the lead wire onto the solder, 47... Solder fillet.

Claims (1)

[Claims] 1. Solder is flowed up in advance into the through-hole formed in the board for mounting electronic components, and the lead wire of the electronic component is connected to the solder in the through-hole from one side of the board. A laser beam spot is focused on the through hole from the other side of the substrate to a diameter that matches the through hole, and is irradiated at a slight angle with respect to the direction of extension of the lead wire. A method of soldering electronic components using a distinctive laser beam. 2. In claim 1, the diameter of the beam spot of the laser beam is approximately 80% of the diameter of the through hole.
A method for soldering electronic components using a laser beam, characterized by: 3. The method of soldering electronic components using a laser beam according to claim 1, wherein the inclination angle of the beam spot of the laser beam with respect to the extending direction of the lead wire is approximately 10 degrees. 4. A workpiece chuck that grips the base portion of the lead wire of the electronic component is attached to the workpiece insertion head that is movable between the receiving position and the insertion position of the electronic component, and the workpiece chuck is configured to be openable and closable, and the workpiece An inserter for an electronic component, characterized in that a push rod is provided inside the chuck to simultaneously open a workpiece chuck by pushing a head portion of an electronic component at a position where a lead wire of the electronic component is inserted into a through hole.