JP3295967B2 - Electronic component joining method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining electronic components, in particular, by inserting leads of an electronic component into lead insertion holes of a substrate and soldering the leads to wiring of the substrate.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter, there has been a growing demand for higher density circuit boards and smaller electronic components.

[0005] First, as shown in FIG. 5 (a), a lead 8 of an electronic component 7 is inserted into a lead insertion hole 5 provided in a substrate 4. Next, as shown in FIG. 5B, the tip of the lead 8 is bent (hereinafter, referred to as clinch). Next, as shown in FIG. 5 (c), the supporter 2 is applied to the molten solder 25 of the jet type solder bath 24.
The lead 8 of the substrate 4 held on 6 is brought into contact with the protruding side thereof, and the lead 8 and a wiring (not shown) of the substrate 4 are soldered. The lead 8 is clinched when the substrate 4 is brought into contact with the molten solder 25 by the molten solder 25.
This is to prevent the electronic component 7 from being pushed up and falling off, or from being soldered while being displaced.

[0004]

However, in the above-described conventional configuration, as shown in FIG. 6A, when the leads 8 are clinched, the leads 8 of the adjacent electronic components 7 may come into contact at the tip 8a. As shown in FIG. 6B, there is a problem that the leads 8 of the same electronic component 7 come into contact with each other at the tip 8b.

Further, when clinching the lead 8 of the electronic component 7 itself, the electronic component 7 may be destroyed by the impact force, and the reliability as a circuit board is reduced even if it is not destroyed. Had become. As shown in FIG. 6C, in the case of a floating electronic component 7 that generates heat during use, a gap 30 between the electronic component 7 and the substrate 4 must be provided. The tip portion is lead-molded into a shape 8c to form the shape 8c.
Is in contact with the inner wall of the lead insertion hole 5 of the substrate 4 to provide a gap 30 with the substrate 4.

In addition, due to the recent trend toward higher density of circuit boards as electronic devices become smaller and lighter, there is no longer any space for clinching itself, and the conventional process is no longer compatible with the apparatus side.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method for joining electronic parts, which improves the quality and mounting density of a circuit board.

[0008]

Means for Solving the Problems] electronic component bonding method of the present invention in order to achieve the object, a step of supplying solder paste to the lead insertion hole of the substrate, an electronic part having leads
A step of goods was gripped by a chuck for inserting the leads of the electronic component in the lead insertion hole of the substrate, the electronic component main body
The Cree by the heat source from the substrate surface between the existing side opposite
In the step of melting the solder , the electronic component is charged.
Hold the electronic component in the lead insertion hole of the board
Insert the lead and hold the electronic component with the chuck
The height of the chuck is adjusted according to the type of the electronic component in a state where the electronic component and the substrate have a predetermined gap.
And positioning the substrate by the heat source .
Melting the cream solder applied to the lead insertion hole ,
The lead of the electronic component is soldered to the substrate.

The heat source is movable and can be
Melt the cream solder applied to the lead insertion hole of the board,
For soldering electronic component leads to the substrate.
You.

[0010]

According to this method, the lead of the electronic component can be soldered to the substrate without clinching, the clinch space is not required, the high density mounting can be supported, and the electronic component easily broken by the impact of the clinch. Therefore, a delicate clinch is not required, so that the quality of the circuit board can be stabilized. In addition, a floating electronic component does not require lead molding, and can be inserted similarly to other electronic components, and the height can be set arbitrarily by the NC value.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component joining method according to one embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a syringe, 2 denotes cream solder, 3 denotes applied cream solder mass, 3a denotes melted and bonded solder, 4 denotes a substrate, and 5 denotes a lead insertion for inserting a lead 8 of an electronic component 7. A hole 6 is a chuck for holding and transferring the electronic component 7, a laser beam 9 as a heat source, and an optical fiber 10 for transmitting the laser beam 9. First, Figure 1
As shown in FIG. 1A, a cream solder 2 is supplied from a syringe 1 to form a cream solder mass 3 around a lead insertion hole 5 provided in a substrate 4. Next, as shown in FIG. 1B, the substrate 4 is inverted. Then, as shown in FIG. 1C, the electronic component 7 is transferred by the chuck 6 and the lead 8 is moved.
Into the lead insertion hole 5. When the electronic component 7 is a floating type, the height of the chuck 6 is set by the NC value. With the chuck 6 holding the electronic component 7, the inserted lead 8 is irradiated with the laser beam 9 transmitted by the optical fiber 10 from the lower part of the substrate, and the solder paste 3
And the leads 8 of the electronic component 7 are soldered to the substrate 4.

FIG. 2 is a perspective view of an electronic component joining apparatus for realizing the above joining method. In FIG. 2, reference numeral 11 denotes an insertion head having a chuck 6, 12 denotes an XY robot,
Reference numerals 13, 14, and 15 denote trays, sticks, and tapes for supplying the electronic components 7, reference numeral 16 denotes a transport rail, and reference numeral 17 denotes a lower irradiation unit that locks and moves the optical fiber 10 (not shown). First, as shown in FIG.
Is transported by the transport rail 16 and positioned at a predetermined position. The insertion head 11 is locked by the XY robot 12, and can move inside the apparatus. The insertion head 11 moves to the tray 13, the stick 14, or the tape 15, and the electronic component 7 is taken out and transferred onto the substrate 4 by the chuck 6 (not shown) in the insertion head 11. Next, the lower irradiation unit 17 moves the optical fiber 10 to the irradiation position of the laser beam 9, and irradiates the laser beam when the chuck 6 inserts the electronic component 7 into the substrate 4.

FIG. 3 is a detailed view of the lower irradiation unit 17 in the above apparatus. In FIG. 3, 18 is an X-axis motor, 19 is a Y-axis motor, 20 is a θ-axis motor, and 21 is a holder. First, as shown in FIG. 3, the optical fiber 10 is fixed to a holder 21, and can be freely moved below the substrate by an X-axis motor 18, a Y-axis motor 19, and a θ-axis motor 20. The movement data of each axis is calculated from the insertion position data of the electronic component 7 to be inserted and the component data in which the number and pitch of the leads 8 are recorded, and the holder 21 is moved to irradiate all the leads with the laser beam 9. I do.

FIG. 4 shows an apparatus for recognizing the leads 8 of the electronic component 7. In FIG. 4, 22 is a recognition camera, 2
3 is illumination. Recognition camera 2 in lower irradiation unit 17
2. By arranging the illumination 23, the recognition of the lead 8 by the camera 22 as to whether or not the electronic component 7 has been inserted eliminates the irradiation of the laser beam 9 in the case of an insertion error, and the melting and joining of the solder. By recognizing 3a, the joining state can be confirmed.

In this embodiment, an example in which the laser beam 9 is used as the heat source for soldering and the solder is supplied by the syringe 1 has been described. However, the same applies when the solder is supplied by a printing machine using a light beam such as a xenon lamp. The effect of is obtained.

In this embodiment, the chuck 6 is provided on the insertion head 11 and the electronic component 7 is taken out from the supply section and inserted into the substrate 4. However, when the electronic component 7 has a shape that can be sucked, the suction nozzle is used. And the electronic component 7 can be taken out and inserted into the substrate 4 by the suction force of the suction nozzle.

If the cream solder mass 3 is preheated by hot air at about 100 ° C. before irradiating the cream solder mass 3 with light, the water in the cream solder mass 3 evaporates and the cream solder mass 3 is bumped. Does not splatter.

[0019]

As is clear from the above description of the embodiment, the present invention provides a process of supplying cream solder to a lead insertion hole of a substrate, and holding an electronic component having a lead with a chuck.
A step to inserting the leads of the electronic component in the lead insertion hole of the substrate, opposite to the side where the electronic component body is present
In the step of melting the cream solder from a substrate surface with a heat source , gripping the electronic component with a chuck,
Insert the lead of the electronic component into the lead insertion hole of the board,
The electronic height of the chuck according to the type of the electronic component in a state in which the electronic component is grasped by the chuck
Position so as to provide a predetermined gap between the component and the substrate
Determine and apply to the lead insertion hole of the board by the heat source
The solder of the cream solder is melted, and the lead of the electronic component is solder-bonded to the substrate, so that the height of the chuck is adjusted to a predetermined gap between the component and the substrate according to the type of the component.
Since it is possible to maintain a predetermined distance between the board and the component, for example, even for a component that is easily affected by heat at the time of solder melting, it is possible to prevent the component from being affected by heat. Can be avoided. As a result, a substrate with good bonding quality can be provided.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view showing a state in which solder cream is supplied in the vicinity of a lead insertion hole of a board in a method for bonding electronic components according to one embodiment of the present invention. FIG. 1B is a cross-sectional view showing the inverted board. Sectional view showing a state in which leads of electronic components held by the chuck are inserted into lead insertion holes of an inverted substrate.

FIG. 2 is a perspective view showing an entire configuration of an apparatus for performing the electronic component bonding method.

FIG. 3 is a perspective view showing a configuration of a lower irradiation unit in the apparatus.

FIG. 4 is a sectional view showing a configuration of an apparatus for recognizing leads of electronic components in the apparatus.

FIG. 5A is a cross-sectional view showing a state in which a lead of an electronic component is inserted into a lead insertion hole of a substrate according to a conventional electronic component bonding method. Sectional view showing an inwardly bent state. (C) Sectional view showing a state in which a lead of a substrate is brought into contact with the molten solder.

FIG. 6A is a cross-sectional view illustrating an example of a defect generated by the electronic component bonding method. FIG. 6B is a cross-sectional view illustrating a defective example of the electronic component bonding method. FIG. 6C is a molded lead of the floating electronic component. Sectional view showing the relationship between lead insertion holes

[Explanation of symbols]

 2 cream solder 3 cream solder mass 4 board 5 lead insertion hole 6 chuck 7 electronic component 8 lead 9 laser beam (heat source) 17 lower irradiation unit

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/34 H05K 13/04

Claims (2)

(57) [Claims] 1. A step of supplying cream solder to a lead insertion hole of a substrate, and holding an electronic component having a lead by a chuck.
A step to inserting the leads of the electronic component in the lead insertion hole of the substrate, opposite to the side where the electronic component body is present
In the step of melting the cream solder from a substrate surface with a heat source , gripping the electronic component with a chuck,
Insert the lead of the electronic component into the lead insertion hole of the board,
The electronic height of the chuck according to the type of the electronic component in a state in which the electronic component is grasped by the chuck
Position so as to provide a predetermined gap between the component and the substrate
Determine and apply to the lead insertion hole of the board by the heat source
The cream solder is melted, the electronic component bonding method soldered leads of the electronic component on the substrate that. 2. The heat source is movable and can be controlled by said heat source.
Melt the cream solder applied to the lead insertion hole of the board,
2. The lead of an electronic component is soldered to the substrate.
Electronic component bonding method described above.