GB2588599B - Soldering Process - Google Patents

Soldering Process Download PDF

Info

Publication number
GB2588599B
GB2588599B GB1915407.9A GB201915407A GB2588599B GB 2588599 B GB2588599 B GB 2588599B GB 201915407 A GB201915407 A GB 201915407A GB 2588599 B GB2588599 B GB 2588599B
Authority
GB
United Kingdom
Prior art keywords
soldering process
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1915407.9A
Other versions
GB2588599A (en
GB201915407D0 (en
Inventor
Trevor Nicholas Broomfield Alan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apollo Fire Detectors Ltd
Original Assignee
Apollo Fire Detectors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Fire Detectors Ltd filed Critical Apollo Fire Detectors Ltd
Priority to GB1915407.9A priority Critical patent/GB2588599B/en
Publication of GB201915407D0 publication Critical patent/GB201915407D0/en
Publication of GB2588599A publication Critical patent/GB2588599A/en
Application granted granted Critical
Publication of GB2588599B publication Critical patent/GB2588599B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manipulator (AREA)
GB1915407.9A 2019-10-24 2019-10-24 Soldering Process Active GB2588599B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1915407.9A GB2588599B (en) 2019-10-24 2019-10-24 Soldering Process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1915407.9A GB2588599B (en) 2019-10-24 2019-10-24 Soldering Process

Publications (3)

Publication Number Publication Date
GB201915407D0 GB201915407D0 (en) 2019-12-11
GB2588599A GB2588599A (en) 2021-05-05
GB2588599B true GB2588599B (en) 2021-11-17

Family

ID=68769018

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1915407.9A Active GB2588599B (en) 2019-10-24 2019-10-24 Soldering Process

Country Status (1)

Country Link
GB (1) GB2588599B (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
EP0501290A1 (en) * 1991-02-25 1992-09-02 TEMIC TELEFUNKEN microelectronic GmbH Device for laser soldering micro-contacts
JPH0613746A (en) * 1992-06-29 1994-01-21 Matsushita Electric Ind Co Ltd Bonding of electronic component
JPH10209622A (en) * 1997-01-27 1998-08-07 Denso Corp Method for mounting insertion-type component
GB2353749A (en) * 1999-09-03 2001-03-07 Fujitsu Ltd Reflow soldering apparatus and method
JP2004103650A (en) * 2002-09-05 2004-04-02 Ckd Corp Component mounting device and air-bearing cylinder
JP2005057071A (en) * 2003-08-05 2005-03-03 Matsushita Electric Ind Co Ltd Method for mounting electronic component
JP2005072299A (en) * 2003-08-26 2005-03-17 Matsushita Electric Ind Co Ltd Packaging equipment of electronic component, its arrangement holder, and vacuum chuck
US20050112844A1 (en) * 2003-10-02 2005-05-26 Yoshihide Nishiyama Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
WO2016174715A1 (en) * 2015-04-27 2016-11-03 富士機械製造株式会社 Working machine
US20190176256A1 (en) * 2016-08-01 2019-06-13 Fuji Corporation Soldering device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
EP0501290A1 (en) * 1991-02-25 1992-09-02 TEMIC TELEFUNKEN microelectronic GmbH Device for laser soldering micro-contacts
JPH0613746A (en) * 1992-06-29 1994-01-21 Matsushita Electric Ind Co Ltd Bonding of electronic component
JPH10209622A (en) * 1997-01-27 1998-08-07 Denso Corp Method for mounting insertion-type component
GB2353749A (en) * 1999-09-03 2001-03-07 Fujitsu Ltd Reflow soldering apparatus and method
JP2004103650A (en) * 2002-09-05 2004-04-02 Ckd Corp Component mounting device and air-bearing cylinder
JP2005057071A (en) * 2003-08-05 2005-03-03 Matsushita Electric Ind Co Ltd Method for mounting electronic component
JP2005072299A (en) * 2003-08-26 2005-03-17 Matsushita Electric Ind Co Ltd Packaging equipment of electronic component, its arrangement holder, and vacuum chuck
US20050112844A1 (en) * 2003-10-02 2005-05-26 Yoshihide Nishiyama Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
WO2016174715A1 (en) * 2015-04-27 2016-11-03 富士機械製造株式会社 Working machine
US20190176256A1 (en) * 2016-08-01 2019-06-13 Fuji Corporation Soldering device

Also Published As

Publication number Publication date
GB2588599A (en) 2021-05-05
GB201915407D0 (en) 2019-12-11

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