US4370515A
(en)
*
|
1979-12-26 |
1983-01-25 |
Rockwell International Corporation |
Electromagnetic interference
|
DE3035872C2
(de)
*
|
1980-09-23 |
1984-12-06 |
Siemens AG, 1000 Berlin und 8000 München |
Gehäuse mit Wänden aus Kunststofflaminat
|
JPS58182495U
(ja)
*
|
1982-05-28 |
1983-12-05 |
日本精機株式会社 |
液晶表示装置
|
JPS59103186A
(ja)
*
|
1982-11-15 |
1984-06-14 |
ピツトネイ・ボウズ・インコ−ポレ−テツド |
シ−ルド用スクリ−ンを備えた電子郵便料金計
|
JPS6033732U
(ja)
*
|
1983-08-12 |
1985-03-07 |
オムロン株式会社 |
高周波リレ−
|
US4567317A
(en)
*
|
1983-07-07 |
1986-01-28 |
Computer Products, Inc. |
EMI/RFI Protected enclosure
|
US4626812A
(en)
*
|
1983-08-12 |
1986-12-02 |
Omron Tateisi Electronics Co. |
Electromagnetic relay for switching high frequency signals
|
JPS60143511A
(ja)
*
|
1983-12-29 |
1985-07-29 |
スタツクス工業株式会社 |
マイクロフォンのシールド装置
|
US4642735A
(en)
*
|
1984-02-27 |
1987-02-10 |
General Electric Company |
Frequency synthesizer module
|
US4542437A
(en)
*
|
1984-07-06 |
1985-09-17 |
Broadband Engineering, Inc. |
CATV package designed for underground system use
|
US4706161A
(en)
*
|
1986-11-17 |
1987-11-10 |
Minnesota Mining And Manufacturing Company |
Device protective apparatus
|
JPH0721512B2
(ja)
*
|
1987-03-27 |
1995-03-08 |
日本碍子株式会社 |
光センサ用光部品
|
DE3742763A1
(de)
*
|
1987-12-17 |
1989-06-29 |
Philips Patentverwaltung |
Stapelbares gehaeuse
|
US4851609A
(en)
*
|
1988-05-10 |
1989-07-25 |
Prabhakara Reddy |
Protective housing for an electrical device
|
US5182424A
(en)
*
|
1989-10-31 |
1993-01-26 |
Vlastimil Frank |
Module encapsulation by induction heating
|
EP0429695B1
(fr)
*
|
1989-11-28 |
1992-11-11 |
Siemens Aktiengesellschaft |
Appareil de commande, en particulier pour commander des fonctions d'un véhicule automobile
|
FR2656494B1
(fr)
*
|
1989-12-21 |
1992-04-30 |
Telemecanique |
Dispositif de blindage et d'isolation d'une carte de circuit electronique.
|
JPH0521655A
(ja)
*
|
1990-11-28 |
1993-01-29 |
Mitsubishi Electric Corp |
半導体装置および半導体装置用パツケージ
|
FR2668847B1
(fr)
*
|
1990-11-07 |
1994-06-03 |
Alcatel Espace |
Methode de protection de composants electroniques d'un circuit contre les radiations et dispositif utilisant cette methode.
|
DE4143494C2
(de)
*
|
1990-11-28 |
1998-05-14 |
Mitsubishi Electric Corp |
Halbleitereinrichtung insb. für eine Chipkarte mit Abschirmung gegenüber Lichteinwirkung und damit verbundene Fehlfunktionen
|
US5130896A
(en)
*
|
1991-02-22 |
1992-07-14 |
Hewlett-Packard Company |
Apparatus for electromagnetic interference containment for printed circuit board connectors
|
JP2616280B2
(ja)
*
|
1991-04-27 |
1997-06-04 |
株式会社村田製作所 |
発振器及びその製造方法
|
DE4115153A1
(de)
*
|
1991-05-08 |
1992-11-12 |
Lo Kun Nan |
Bestueckte leiterplatte mit einem aluminium-abschirmgehaeuse
|
US5336848A
(en)
*
|
1991-05-31 |
1994-08-09 |
Katz Joseph M |
Lap-top computer operators protective device
|
DE4137112A1
(de)
*
|
1991-11-12 |
1993-05-13 |
Bayerische Motoren Werke Ag |
Lokale abschirmung von elektronischen bauteilen eines elektronischen steuergeraetes in einem kraftfahrzeug
|
DE4212948A1
(de)
*
|
1992-04-18 |
1993-10-21 |
Telefunken Microelectron |
Halbleiterbaugruppe, insbesondere Fernsteuer-Empfangsmodul
|
JPH07506223A
(ja)
*
|
1993-02-11 |
1995-07-06 |
テレフオンアクチーボラゲツト エル エム エリクソン |
電子成分をカプセル封じする可撓装置
|
CA2092371C
(fr)
*
|
1993-03-24 |
1999-06-29 |
Boris L. Livshits |
Boitier pour circuit integre
|
US5376759A
(en)
*
|
1993-06-24 |
1994-12-27 |
Northern Telecom Limited |
Multiple layer printed circuit board
|
WO1995007602A1
(fr)
*
|
1993-09-06 |
1995-03-16 |
Vladimir Ivanovich Kapitonov |
Materiaux de protection contre les rayonnements
|
JPH07235775A
(ja)
*
|
1994-02-21 |
1995-09-05 |
Mitsubishi Electric Corp |
多層プリント配線基板
|
US5574249A
(en)
*
|
1994-07-18 |
1996-11-12 |
Lindsay Audiophile Inc. |
High resistivity inner shields for cabinets housing electronic circuitry
|
US5633786A
(en)
*
|
1995-08-21 |
1997-05-27 |
Motorola |
Shield assembly and method of shielding suitable for use in a communication device
|
US6433825B1
(en)
|
1997-12-18 |
2002-08-13 |
Eastman Kodak Company |
EMI-protected eject interface for an electronic device
|
US5956925A
(en)
*
|
1997-12-31 |
1999-09-28 |
Bmi, Inc. |
Carrier tape and method for washing of components in carrier tape
|
US6235985B1
(en)
*
|
1998-04-13 |
2001-05-22 |
Lucent Technologies, Inc. |
Low profile printed circuit board RF shield for radiating pin
|
JP2000236189A
(ja)
*
|
1999-02-16 |
2000-08-29 |
Minebea Co Ltd |
航空機用電子回路のシールド装置
|
US20070137653A1
(en)
*
|
2000-03-13 |
2007-06-21 |
Wood Thomas J |
Ventilation interface for sleep apnea therapy
|
US6269008B1
(en)
*
|
1999-11-22 |
2001-07-31 |
Lucent Technologies Inc. |
Multi-walled electromagnetic interference shield
|
JP2002094689A
(ja)
*
|
2000-06-07 |
2002-03-29 |
Sony Computer Entertainment Inc |
プログラム実行システム、プログラム実行装置、中継装置、および記録媒体
|
DE60032471T2
(de)
*
|
2000-07-14 |
2007-05-03 |
Minebea Co., Ltd. |
Vorrichtung zur abschirmung eielktronischer schaltungen in flugzeugen
|
US6607308B2
(en)
|
2001-02-12 |
2003-08-19 |
E20 Communications, Inc. |
Fiber-optic modules with shielded housing/covers having mixed finger types
|
US6659655B2
(en)
|
2001-02-12 |
2003-12-09 |
E20 Communications, Inc. |
Fiber-optic modules with housing/shielding
|
US6781851B2
(en)
*
|
2002-05-30 |
2004-08-24 |
Lucent Technologies Inc. |
Electromagnetic interference shield
|
US6965072B2
(en)
*
|
2003-02-07 |
2005-11-15 |
Nokia Corporation |
Shielding arrangement
|
US7326862B2
(en)
*
|
2003-02-13 |
2008-02-05 |
Parker-Hannifin Corporation |
Combination metal and plastic EMI shield
|
US7005573B2
(en)
|
2003-02-13 |
2006-02-28 |
Parker-Hannifin Corporation |
Composite EMI shield
|
JP4377157B2
(ja)
*
|
2003-05-20 |
2009-12-02 |
Necエレクトロニクス株式会社 |
半導体装置用パッケージ
|
US20060002099A1
(en)
*
|
2004-06-30 |
2006-01-05 |
Stoneham Edward B |
Electromagnetic shield assembly
|
US7813145B2
(en)
*
|
2004-06-30 |
2010-10-12 |
Endwave Corporation |
Circuit structure with multifunction circuit cover
|
US7258574B2
(en)
*
|
2004-09-30 |
2007-08-21 |
International Business Machines Corporation |
Snap-fit electromagnetic shield
|
US7087835B2
(en)
*
|
2004-10-19 |
2006-08-08 |
Bi-Link Metal Specialties Inc. |
Apparatus and method for shielding printed circuit boards
|
JP4555119B2
(ja)
*
|
2005-02-22 |
2010-09-29 |
アルプス電気株式会社 |
面実装型電子回路ユニット
|
JP4447487B2
(ja)
*
|
2005-02-23 |
2010-04-07 |
シャープ株式会社 |
高周波ユニット
|
TWM289575U
(en)
*
|
2005-11-04 |
2006-04-11 |
Hon Hai Prec Ind Co Ltd |
Electromagnetic interference shield device
|
US7518880B1
(en)
|
2006-02-08 |
2009-04-14 |
Bi-Link |
Shielding arrangement for electronic device
|
US20100257732A1
(en)
*
|
2009-04-14 |
2010-10-14 |
Ziberna Frank J |
Shielding Arrangement for Electronic Device
|
US20110018160A1
(en)
*
|
2009-07-24 |
2011-01-27 |
Ziberna Frank J |
Method of Producing Covers for Electronics
|
TWI489610B
(zh)
|
2010-01-18 |
2015-06-21 |
矽品精密工業股份有限公司 |
具電磁遮蔽之封裝結構之製法
|
TWI404187B
(zh)
|
2010-02-12 |
2013-08-01 |
矽品精密工業股份有限公司 |
能避免電磁干擾之四方形扁平無引腳封裝結構及其製法
|
TWI484897B
(zh)
*
|
2012-01-20 |
2015-05-11 |
Lite On Technology Corp |
散熱結構與具有此散熱結構的電子裝置
|
JP5733260B2
(ja)
*
|
2012-04-09 |
2015-06-10 |
株式会社村田製作所 |
電源モジュール
|
CN214901942U
(zh)
|
2018-10-03 |
2021-11-26 |
怡得乐工业有限公司 |
用于安装到基板的emc屏蔽罩
|