FR2403866A1 - Machine transfert pour le scellement sous vide de composants electroniques ou articles similaires - Google Patents
Machine transfert pour le scellement sous vide de composants electroniques ou articles similairesInfo
- Publication number
- FR2403866A1 FR2403866A1 FR7827141A FR7827141A FR2403866A1 FR 2403866 A1 FR2403866 A1 FR 2403866A1 FR 7827141 A FR7827141 A FR 7827141A FR 7827141 A FR7827141 A FR 7827141A FR 2403866 A1 FR2403866 A1 FR 2403866A1
- Authority
- FR
- France
- Prior art keywords
- electronic components
- sealing
- transfer machine
- vacuum
- vacuum sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 title abstract 5
- 239000013078 crystal Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Abstract
Machine transfert pour le scellement sous vide de composants électroniques. Elle comprend trois chambres à vide 4, 1, 7 reliées entre elles et disposées en ligne, des moyens porteurs de composants 11 transportables successivement à travers les chambres 4, 1, 7, des obturateurs 5, 6, 9, 8 permettant d'isoler les chambres 4, 1, 7 entre elles et de l'atmosphère, un appareillage de scellement 2 dans une chambre 1 et un dispositif transporteur 10 commandable de l'extérieur pour effectuer sans rupture du vide le transfert des moyens porteurs 11 dans et hors de la chambre 1 où a lieu le scellement. L'invention peut être utilisée pour le scellement d'encapsulages de cristaux piézo-électriques sur leur support.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/837,232 US4166563A (en) | 1977-09-27 | 1977-09-27 | Transfer machine for sealing electronic or like components under vacuum |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2403866A1 true FR2403866A1 (fr) | 1979-04-20 |
FR2403866B1 FR2403866B1 (fr) | 1982-03-12 |
Family
ID=25273887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7827141A Granted FR2403866A1 (fr) | 1977-09-27 | 1978-09-12 | Machine transfert pour le scellement sous vide de composants electroniques ou articles similaires |
Country Status (6)
Country | Link |
---|---|
US (1) | US4166563A (fr) |
JP (1) | JPS5463695A (fr) |
CH (1) | CH626489A5 (fr) |
DE (1) | DE2841767A1 (fr) |
FR (1) | FR2403866A1 (fr) |
GB (1) | GB2007778B (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0067705A2 (fr) * | 1981-06-15 | 1982-12-22 | Hitachi, Ltd. | Système de transport pour plaquette |
WO1984001084A1 (fr) * | 1982-08-24 | 1984-03-15 | Edward Bok | Appareil de traitement de substrats |
EP0178336A1 (fr) * | 1984-10-16 | 1986-04-23 | International Business Machines Corporation | Dispositif de transport sous vide |
WO2001086700A1 (fr) * | 2000-05-09 | 2001-11-15 | Siemens Aktiengesellschaft | Convoyeur longitudinal |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392435A (en) * | 1979-08-03 | 1983-07-12 | United Kingdom Atomic Energy Authority | Transport apparatus |
DE3119037A1 (de) * | 1981-05-13 | 1982-12-02 | Ganzhorn u. Stirn GmbH + Co, 7170 Schwäbisch Hall | Verfahren und vorrichtung zum sterilisieren |
US4799911A (en) * | 1987-07-13 | 1989-01-24 | Varo, Inc. | Image intensifier tube with integral CCD digital readout |
US4540326A (en) * | 1982-09-17 | 1985-09-10 | Nacom Industries, Inc. | Semiconductor wafer transport system |
JPS60187485A (ja) * | 1984-03-06 | 1985-09-24 | Raifu Technol Kenkyusho | 接合装置 |
US4619573A (en) * | 1984-03-09 | 1986-10-28 | Tegal Corporation | Article transport apparatus |
US4576828A (en) * | 1984-05-17 | 1986-03-18 | Geotel, Inc. | Method and apparatus for plasma spray coating |
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
DE3601408C1 (de) * | 1986-01-18 | 1987-03-12 | Sartorius Gmbh | Oberschalige Analysenwaage mit Waegekammerschleuse |
HU207175B (en) * | 1986-02-12 | 1993-03-01 | Tungsram Reszvenytarsasag | Device for manufacturing discharge tube of a sodium vapour discharge lamp |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
NL8901598A (nl) * | 1989-06-23 | 1991-01-16 | Soltec Bv | Met een beschermgas werkende soldeermachine, voorzien van automatisch werkende sluisdeuren. |
JPH04262865A (ja) * | 1991-01-22 | 1992-09-18 | Kenji Kondo | はんだ付け装置 |
SE469501B (sv) * | 1992-03-02 | 1993-07-12 | Quartz Proline Handelsbolag C | Foerfarande och anlaeggning foer framstaellning av piezoelektriska resonatorer |
JPH07508617A (ja) | 1992-06-26 | 1995-09-21 | マティリアルズ リサーチ コーポレイション | ウエハ処理工程ラインのための輸送装置 |
US5433639A (en) * | 1993-08-18 | 1995-07-18 | Santa Barbara Research Center | Processing of vacuum-sealed dewar assembly |
DE4432730A1 (de) * | 1994-09-14 | 1996-03-21 | Emitec Emissionstechnologie | Verfahren zur Herstellung einer metallischen Struktur |
US5799860A (en) * | 1995-08-07 | 1998-09-01 | Applied Materials, Inc. | Preparation and bonding of workpieces to form sputtering targets and other assemblies |
US6213704B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6215897B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Automated substrate processing system |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6298685B1 (en) | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US6935828B2 (en) * | 2002-07-17 | 2005-08-30 | Transfer Engineering And Manufacturing, Inc. | Wafer load lock and magnetically coupled linear delivery system |
US7306133B2 (en) * | 2003-04-25 | 2007-12-11 | St Assembly Test Services Ltd. | System for fabricating an integrated circuit package on a printed circuit board |
DE102019211212A1 (de) * | 2019-07-29 | 2021-02-04 | Rehm Thermal Systems Gmbh | Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3202406A (en) * | 1960-07-27 | 1965-08-24 | Clevite Corp | Furnace apparatus and conveyor therefor |
US3317106A (en) * | 1963-08-19 | 1967-05-02 | Dix Engineering Co | Solder boat |
US3717119A (en) * | 1971-07-30 | 1973-02-20 | Gen Motors Corp | Vacuum processing machine for aluminizing headlamp reflectors |
US3914836A (en) * | 1974-06-21 | 1975-10-28 | Us Army | Method for processing quartz crystal resonators |
US4030622A (en) * | 1975-05-23 | 1977-06-21 | Pass-Port Systems, Inc. | Wafer transport system |
-
1977
- 1977-09-27 US US05/837,232 patent/US4166563A/en not_active Expired - Lifetime
-
1978
- 1978-09-12 FR FR7827141A patent/FR2403866A1/fr active Granted
- 1978-09-14 CH CH963678A patent/CH626489A5/fr not_active IP Right Cessation
- 1978-09-15 GB GB7837060A patent/GB2007778B/en not_active Expired
- 1978-09-26 DE DE19782841767 patent/DE2841767A1/de not_active Withdrawn
- 1978-09-27 JP JP11903778A patent/JPS5463695A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0067705A2 (fr) * | 1981-06-15 | 1982-12-22 | Hitachi, Ltd. | Système de transport pour plaquette |
EP0067705A3 (en) * | 1981-06-15 | 1983-10-12 | Hitachi, Ltd. | Wafer transport system |
WO1984001084A1 (fr) * | 1982-08-24 | 1984-03-15 | Edward Bok | Appareil de traitement de substrats |
EP0178336A1 (fr) * | 1984-10-16 | 1986-04-23 | International Business Machines Corporation | Dispositif de transport sous vide |
US4643627A (en) * | 1984-10-16 | 1987-02-17 | International Business Machines Corporation | Vacuum transfer device |
WO2001086700A1 (fr) * | 2000-05-09 | 2001-11-15 | Siemens Aktiengesellschaft | Convoyeur longitudinal |
Also Published As
Publication number | Publication date |
---|---|
FR2403866B1 (fr) | 1982-03-12 |
JPS5724004B2 (fr) | 1982-05-21 |
DE2841767A1 (de) | 1979-04-26 |
GB2007778A (en) | 1979-05-23 |
GB2007778B (en) | 1982-03-10 |
US4166563A (en) | 1979-09-04 |
CH626489A5 (fr) | 1981-11-13 |
JPS5463695A (en) | 1979-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |