US4166563A - Transfer machine for sealing electronic or like components under vacuum - Google Patents
Transfer machine for sealing electronic or like components under vacuum Download PDFInfo
- Publication number
- US4166563A US4166563A US05/837,232 US83723277A US4166563A US 4166563 A US4166563 A US 4166563A US 83723277 A US83723277 A US 83723277A US 4166563 A US4166563 A US 4166563A
- Authority
- US
- United States
- Prior art keywords
- vacuum
- sealing
- transfer machine
- chambers
- carrying means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 22
- 238000005476 soldering Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 2
- 238000005086 pumping Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment
Definitions
- quartz crystal resonators which are required in view of their nature to be maintained under vacuum and thus must be placed in supporting containers in such a way to be competely sealed.
- This sealing must be absolute in nature and must have a life of at least several years.
- quartz resonators for instance, even the smallest leaks will bring about an increase in the series resistance of the resonator which finally will no longer oscillate.
- a component carrier may take the form of an elongated element or bar provided with cells for holding and retaining the components undergoing sealing, each such component being stepped under a soldering head. In order to maintain such a bar under the necessary vacuum, the working chamber is required to be unusually long.
- the invention thus comprises a transfer machine for sealing electronic or like components under vacuum comprising a plurality of interconnected vacuum chambers in a linear arrangement, component carrying means adapted to the form and dimensions of the vacuum chanbers so as to be capable of being transported through said chambers successively, valve means which when closed isolate the chambers from one another or from the surrounding atmosphere, a sealing instrumentality in at least one chamber arranged to effect sealing of the components in succession and transport means actuable from the exterior so as to transfer the carrying means into and out of a chamber provided with sealing means without breaking the vacuum.
- FIG. 1 is a schematic diagram showing the arrangement of the overall system
- FIGS. 2,3,4,5 and 6 show successive partial views of a component carrying bar being transported through the machine.
- the machine comprises three vacuum chambers of elongated form which are connected in a linear arrangement as shown in FIG. 1.
- working chamber 1 is in the centre and is provided with a sealing head 2 and a stepping mechanism 3 which may for example comprise a pinion which engages with a rack mounted on a component carrying bar 11.
- the first vacuum chamber 4 comprises an entry air lock and is coupled to the working chamber 1 through a gate-type valve 6. At its entry end it is further provided with a valve 5.
- the third vacuum chamber 7 constitutes an exit air lock and is likewise coupled to the working chamber 1 by means of a gate valve 9.
- the entry air lock it is also provided with a valve 8 which will be closed when under vacuum.
- Each of the separate chambers is provided with its own separate pump to obtain the vacuum therein.
- vacuum pump 12 is connected over valve 14 with the entry air lock 4 and a similar pump is likewise connected with the exit air lock 7.
- the control lines in both cases are respectively provided with release valves 15 whereby air may be admitted, and pressure gauges 16.
- the working chamber 1 is likewise provided with vacuum pumping means and in this case such vacuum pump may comprise a primary vacuum pump 12 as in the preceding cases as well as a turbo-molecular type of vacuum pump 13 whereby a higher vacuum may be obtained within the working chamber.
- a system of release valves and gauges is provides as shown at 15, 16 and 17.
- the component carrying bar 11 in a typical version may have therewithin 200 cells each of which is adapted to provide space for one component to be sealed by soldering for example.
- Each end of the bar 11 is provided with a permanent magnet which may be oppositely poled.
- the material from which the three vacuum chambers are fashioned may be any suitable material capable of sustaining a vacuum and at the same time capable of being traversed by magnetic lines of force.
- a magnetic means 10 which could in a manually operated version comprise a simple hand held permanent magnet or in a more automated version might comprise an electromagnet controlled by electronic means.
- An electronic control system for the apparatus as shown may provide sequential controls whereby following introduction of a component carrying bar and closing of the entry valve 5 the entry air lock is placed under vacuum. Thereafter, once the desired degree of vacuum which may, for instance, be 10 -2 Torr has been achieved it is then possible to open the gate valve 6 interconnecting the entry air lock and the working chamber 1. Herein it is now necessary to obtain the working vacuum which should be approximately 10 -4 Torr. As soon as this has been achieved then the component carrying bar may be transferred from the entry air lock into the working chamber through application of the magnetic means at the exterior.
- the rack mechanism provided on the transport bar will engage with the pinion 3 whereby the electronic control may then provide signals to effect stepping of each cell past the head 2 heat being applied to each component in succession to effect soldering thereof.
- the gate valve 6 may be closed and the entry air lock subsequently reopened following air admission by means of the release valve 15 whereby the entry air lock is now prepared to receive a new bar carrying a further supply of components to be soldered.
- the exit vane or gate valve 9 may be opened once the component carrying bar has progressed a certain distance and thereafter the bar as soon as all components have been sealed may be entirely shifted into the exit air lock 7, again through application of the external magnet means. Thereafter, the exit gate valve 9 may be closed and ambient pressure then restored to exit air lock 7 by means of release valve 15. Exit valve 8 may now be opened and the bar 11 removed, again with the aid of magnetic means 10.
- FIGS. 2, 3, 4, 5 and 6 show in succession the steps which may be followed in a practical embodiment of the invention.
- the apparatus In the initial state the apparatus is ready to operate with the entry air lock opened, the working chamber under a vacuum of 10 -4 Torr and the exit air lock under a vacuum of 10 -2 Torr with the exit and entry gate valves 6 and 9 respectively closed.
- the first step then is to introduce the component carrying bar 11 into the entry air lock 4 as shown in FIG. 1.
- the valve 5 is then closed and the entry air lock is exhausted to a vacuum of 10 -2 Torr by means of the primary vacuum pump 12.
- the gate valve 6 is opened as shown in FIG. 3 and the component carrying bar 11 is then shifted into the working chamber 1 by means of the magnetic coupling to the point where the stepping means 3 has been properly engaged.
- the exit valve 9 may be opened and as soon as a vacuum of 10 -4 Torr has been achieved within the working chamber then sealing may continue and the components each in their individual retaining cell are passed successively under the head 2 by means of the stepping arrangement 3 as shown. It is noted, moreover, that as soon as the component carrying bar is entirely past the entry gate valve 6 said gate valve is closed and thereafter the entry air lock 4 may be reopened as soon as the vacuum has been relieved through operation of the release valve 15. At this point a further component carrying bar 11 may be placed within the entry air lock 4.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/837,232 US4166563A (en) | 1977-09-27 | 1977-09-27 | Transfer machine for sealing electronic or like components under vacuum |
FR7827141A FR2403866A1 (fr) | 1977-09-27 | 1978-09-12 | Machine transfert pour le scellement sous vide de composants electroniques ou articles similaires |
CH963678A CH626489A5 (fr) | 1977-09-27 | 1978-09-14 | |
GB7837060A GB2007778B (en) | 1977-09-27 | 1978-09-15 | Transfer machine for sealing electronic or like components under vacuum |
DE19782841767 DE2841767A1 (de) | 1977-09-27 | 1978-09-26 | Transfervorrichtung zum umhuellen von elektronischen bauteilen o.dgl. |
JP11903778A JPS5463695A (en) | 1977-09-27 | 1978-09-27 | Part moving device for sealing electronic parts or like in vacuum |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/837,232 US4166563A (en) | 1977-09-27 | 1977-09-27 | Transfer machine for sealing electronic or like components under vacuum |
Publications (1)
Publication Number | Publication Date |
---|---|
US4166563A true US4166563A (en) | 1979-09-04 |
Family
ID=25273887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/837,232 Expired - Lifetime US4166563A (en) | 1977-09-27 | 1977-09-27 | Transfer machine for sealing electronic or like components under vacuum |
Country Status (6)
Country | Link |
---|---|
US (1) | US4166563A (fr) |
JP (1) | JPS5463695A (fr) |
CH (1) | CH626489A5 (fr) |
DE (1) | DE2841767A1 (fr) |
FR (1) | FR2403866A1 (fr) |
GB (1) | GB2007778B (fr) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392435A (en) * | 1979-08-03 | 1983-07-12 | United Kingdom Atomic Energy Authority | Transport apparatus |
US4540326A (en) * | 1982-09-17 | 1985-09-10 | Nacom Industries, Inc. | Semiconductor wafer transport system |
US4576828A (en) * | 1984-05-17 | 1986-03-18 | Geotel, Inc. | Method and apparatus for plasma spray coating |
US4619573A (en) * | 1984-03-09 | 1986-10-28 | Tegal Corporation | Article transport apparatus |
US4622800A (en) * | 1981-05-13 | 1986-11-18 | Gasti-Verpackungsmaschinen Gmbh | Sterilizing method and apparatus |
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
US4709844A (en) * | 1984-03-06 | 1987-12-01 | Life Technology Research Found. | Pressure welding bonding apparatus |
US4799912A (en) * | 1986-02-12 | 1989-01-24 | Tungsram Reenytarsasag | Method and apparatus for producing discharge tubes for sodium vapor lamps |
US4799911A (en) * | 1987-07-13 | 1989-01-24 | Varo, Inc. | Image intensifier tube with integral CCD digital readout |
US5031818A (en) * | 1989-06-23 | 1991-07-16 | Soltec B.V. | Soldering machine operating with a protective gas and provided with automatically operating lock doors |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
US5145100A (en) * | 1991-01-22 | 1992-09-08 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US5433639A (en) * | 1993-08-18 | 1995-07-18 | Santa Barbara Research Center | Processing of vacuum-sealed dewar assembly |
US5782402A (en) * | 1994-09-14 | 1998-07-21 | Emitec Gesellschaft Fuer Emissionstechnologie Mbh | Method for producing a metal structure and apparatus for metallic joining of sheet-metal layers of a metal structure |
US5799860A (en) * | 1995-08-07 | 1998-09-01 | Applied Materials, Inc. | Preparation and bonding of workpieces to form sputtering targets and other assemblies |
US6183615B1 (en) | 1992-06-26 | 2001-02-06 | Tokyo Electron Limited | Transport system for wafer processing line |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6213704B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6298685B1 (en) | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US20040013501A1 (en) * | 2002-07-17 | 2004-01-22 | Ackeret Michael A. | Wafer load lock and magnetically coupled linear delivery system |
US20040211817A1 (en) * | 2003-04-25 | 2004-10-28 | St Assembly Test Services Ltd. | System for fabricating an integrated circuit package on a printed circuit board |
US6847730B1 (en) | 1998-05-20 | 2005-01-25 | Applied Materials, Inc. | Automated substrate processing system |
RU2747807C1 (ru) * | 2019-07-29 | 2021-05-14 | Рем Термал Системз Гмбх | Электронно-механическая шторка для рабочей камеры для осуществления тепловых процессов при производстве электронных узлов |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206046A (en) * | 1981-06-15 | 1982-12-17 | Hitachi Ltd | Wafer conveying device |
NL8203318A (nl) * | 1982-08-24 | 1984-03-16 | Integrated Automation | Inrichting voor processing van substraten. |
EP0178336B1 (fr) * | 1984-10-16 | 1987-09-09 | International Business Machines Corporation | Dispositif de transport sous vide |
DE3601408C1 (de) * | 1986-01-18 | 1987-03-12 | Sartorius Gmbh | Oberschalige Analysenwaage mit Waegekammerschleuse |
SE9200630L (sv) * | 1992-03-02 | 1993-07-12 | Quartz Proline Handelsbolag C | Foerfarande och anlaeggning foer framstaellning av piezoelektriska resonatorer |
US20030183490A1 (en) * | 2000-05-09 | 2003-10-02 | Friedrich Eschenweck | Longitudinal conveyor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3202406A (en) * | 1960-07-27 | 1965-08-24 | Clevite Corp | Furnace apparatus and conveyor therefor |
US3317106A (en) * | 1963-08-19 | 1967-05-02 | Dix Engineering Co | Solder boat |
US3717119A (en) * | 1971-07-30 | 1973-02-20 | Gen Motors Corp | Vacuum processing machine for aluminizing headlamp reflectors |
US3914836A (en) * | 1974-06-21 | 1975-10-28 | Us Army | Method for processing quartz crystal resonators |
US4030622A (en) * | 1975-05-23 | 1977-06-21 | Pass-Port Systems, Inc. | Wafer transport system |
-
1977
- 1977-09-27 US US05/837,232 patent/US4166563A/en not_active Expired - Lifetime
-
1978
- 1978-09-12 FR FR7827141A patent/FR2403866A1/fr active Granted
- 1978-09-14 CH CH963678A patent/CH626489A5/fr not_active IP Right Cessation
- 1978-09-15 GB GB7837060A patent/GB2007778B/en not_active Expired
- 1978-09-26 DE DE19782841767 patent/DE2841767A1/de not_active Withdrawn
- 1978-09-27 JP JP11903778A patent/JPS5463695A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3202406A (en) * | 1960-07-27 | 1965-08-24 | Clevite Corp | Furnace apparatus and conveyor therefor |
US3317106A (en) * | 1963-08-19 | 1967-05-02 | Dix Engineering Co | Solder boat |
US3717119A (en) * | 1971-07-30 | 1973-02-20 | Gen Motors Corp | Vacuum processing machine for aluminizing headlamp reflectors |
US3914836A (en) * | 1974-06-21 | 1975-10-28 | Us Army | Method for processing quartz crystal resonators |
US4030622A (en) * | 1975-05-23 | 1977-06-21 | Pass-Port Systems, Inc. | Wafer transport system |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392435A (en) * | 1979-08-03 | 1983-07-12 | United Kingdom Atomic Energy Authority | Transport apparatus |
US4622800A (en) * | 1981-05-13 | 1986-11-18 | Gasti-Verpackungsmaschinen Gmbh | Sterilizing method and apparatus |
US4540326A (en) * | 1982-09-17 | 1985-09-10 | Nacom Industries, Inc. | Semiconductor wafer transport system |
US4709844A (en) * | 1984-03-06 | 1987-12-01 | Life Technology Research Found. | Pressure welding bonding apparatus |
US4619573A (en) * | 1984-03-09 | 1986-10-28 | Tegal Corporation | Article transport apparatus |
US4576828A (en) * | 1984-05-17 | 1986-03-18 | Geotel, Inc. | Method and apparatus for plasma spray coating |
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
US4799912A (en) * | 1986-02-12 | 1989-01-24 | Tungsram Reenytarsasag | Method and apparatus for producing discharge tubes for sodium vapor lamps |
US4799911A (en) * | 1987-07-13 | 1989-01-24 | Varo, Inc. | Image intensifier tube with integral CCD digital readout |
US5090609A (en) * | 1989-04-28 | 1992-02-25 | Hitachi, Ltd. | Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
US5031818A (en) * | 1989-06-23 | 1991-07-16 | Soltec B.V. | Soldering machine operating with a protective gas and provided with automatically operating lock doors |
US5145100A (en) * | 1991-01-22 | 1992-09-08 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US6183615B1 (en) | 1992-06-26 | 2001-02-06 | Tokyo Electron Limited | Transport system for wafer processing line |
US5433639A (en) * | 1993-08-18 | 1995-07-18 | Santa Barbara Research Center | Processing of vacuum-sealed dewar assembly |
US5782402A (en) * | 1994-09-14 | 1998-07-21 | Emitec Gesellschaft Fuer Emissionstechnologie Mbh | Method for producing a metal structure and apparatus for metallic joining of sheet-metal layers of a metal structure |
US5799860A (en) * | 1995-08-07 | 1998-09-01 | Applied Materials, Inc. | Preparation and bonding of workpieces to form sputtering targets and other assemblies |
US6847730B1 (en) | 1998-05-20 | 2005-01-25 | Applied Materials, Inc. | Automated substrate processing system |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6471459B2 (en) | 1998-05-20 | 2002-10-29 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6679671B2 (en) * | 1998-05-20 | 2004-01-20 | Applied Materials, Inc. | Substrate transfer shuttle having a magnetic drive |
US6213704B1 (en) | 1998-05-20 | 2001-04-10 | Applied Komatsu Technology, Inc. | Method and apparatus for substrate transfer and processing |
US6746198B2 (en) | 1998-05-20 | 2004-06-08 | Applied Materials, Inc. | Substrate transfer shuttle |
US6298685B1 (en) | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US20050053456A1 (en) * | 2002-07-17 | 2005-03-10 | Ackeret Michael A. | Magnetically coupled linear delivery system transferring wafers between a cassette and a processing reactor |
US20040013501A1 (en) * | 2002-07-17 | 2004-01-22 | Ackeret Michael A. | Wafer load lock and magnetically coupled linear delivery system |
US6935828B2 (en) * | 2002-07-17 | 2005-08-30 | Transfer Engineering And Manufacturing, Inc. | Wafer load lock and magnetically coupled linear delivery system |
US6971832B2 (en) | 2002-07-17 | 2005-12-06 | Transfer Engineering And Manufacturing, Inc. | Magnetically coupled linear delivery system transferring wafers between a cassette and a processing reactor |
US20040211817A1 (en) * | 2003-04-25 | 2004-10-28 | St Assembly Test Services Ltd. | System for fabricating an integrated circuit package on a printed circuit board |
US7306133B2 (en) | 2003-04-25 | 2007-12-11 | St Assembly Test Services Ltd. | System for fabricating an integrated circuit package on a printed circuit board |
RU2747807C1 (ru) * | 2019-07-29 | 2021-05-14 | Рем Термал Системз Гмбх | Электронно-механическая шторка для рабочей камеры для осуществления тепловых процессов при производстве электронных узлов |
Also Published As
Publication number | Publication date |
---|---|
JPS5463695A (en) | 1979-05-22 |
CH626489A5 (fr) | 1981-11-13 |
FR2403866A1 (fr) | 1979-04-20 |
GB2007778A (en) | 1979-05-23 |
GB2007778B (en) | 1982-03-10 |
DE2841767A1 (de) | 1979-04-26 |
FR2403866B1 (fr) | 1982-03-12 |
JPS5724004B2 (fr) | 1982-05-21 |
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