FR2385103A1 - Systeme de localisation de defauts et de releve topographique de la surface d'un composant du genre pastille semi-conductrice - Google Patents
Systeme de localisation de defauts et de releve topographique de la surface d'un composant du genre pastille semi-conductriceInfo
- Publication number
- FR2385103A1 FR2385103A1 FR7804189A FR7804189A FR2385103A1 FR 2385103 A1 FR2385103 A1 FR 2385103A1 FR 7804189 A FR7804189 A FR 7804189A FR 7804189 A FR7804189 A FR 7804189A FR 2385103 A1 FR2385103 A1 FR 2385103A1
- Authority
- FR
- France
- Prior art keywords
- pellet
- semi
- component
- pellet type
- topographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B3/00—Measuring instruments characterised by the use of mechanical techniques
- G01B3/02—Rulers with scales or marks for direct reading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Thin Magnetic Films (AREA)
Abstract
Système pour localiser des défauts dans la surface d'une pastille et obtenir un relevé topographique de l'état de la surface. Il comprend une grille 20 disposée sur une surface de la pastille et formant un ensemble de cellules identiques 26 disposées en rangées et colonnes. Chaque cellule comprend des moyens de codage pour identifier dans quelle rangée et quelle colonne elle se trouve. L'examen simultané de la pastille et de la grille permet de localiser défauts et composants fabriqués sur la pastille. Application à la fabrication de dispositifs semi-conducteurs ou de dispositifs contenant des domaines magnétiques.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/780,877 US4134066A (en) | 1977-03-24 | 1977-03-24 | Wafer indexing system using a grid pattern and coding and orientation marks in each grid cell |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2385103A1 true FR2385103A1 (fr) | 1978-10-20 |
FR2385103B1 FR2385103B1 (fr) | 1980-08-29 |
Family
ID=25120973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7804189A Granted FR2385103A1 (fr) | 1977-03-24 | 1978-02-08 | Systeme de localisation de defauts et de releve topographique de la surface d'un composant du genre pastille semi-conductrice |
Country Status (8)
Country | Link |
---|---|
US (1) | US4134066A (fr) |
JP (1) | JPS6030896B2 (fr) |
CA (1) | CA1117653A (fr) |
DE (1) | DE2809359C2 (fr) |
FR (1) | FR2385103A1 (fr) |
GB (1) | GB1591002A (fr) |
IT (1) | IT1113165B (fr) |
NL (1) | NL7802571A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0226893A1 (fr) * | 1985-12-13 | 1987-07-01 | Siemens Aktiengesellschaft | Procédé de haute précision de mesure pour structures bidimensionnelles ainsi que masque de référence pour l'utilisation de ce procédé |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3122984A1 (de) * | 1981-06-10 | 1983-01-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur kennzeichnung von halbleiterchips und kennzeichenbarer helbleiterchip |
US4388386A (en) * | 1982-06-07 | 1983-06-14 | International Business Machines Corporation | Mask set mismatch |
KR900008384B1 (ko) * | 1986-05-20 | 1990-11-17 | 후지쓰 가부시끼가이샤 | 바아 코우드 패턴을 형성시킨 반도체 웨이퍼의 식별방법 및 반도체 장치의 제조방법 |
CH670592A5 (fr) * | 1986-09-22 | 1989-06-30 | Lasarray Holding Ag | |
JP2754609B2 (ja) * | 1988-06-08 | 1998-05-20 | 日本電気株式会社 | 半導体装置の製造方法 |
DE4038723A1 (de) * | 1990-12-05 | 1992-06-11 | Bosch Gmbh Robert | Auf einer platte gemeinsam hergestellte und danach vereinzelte, gleichartige halbleiter-chips mit indizierung |
US5256578A (en) * | 1991-12-23 | 1993-10-26 | Motorola, Inc. | Integral semiconductor wafer map recording |
KR0154158B1 (ko) * | 1994-07-14 | 1998-12-01 | 김주용 | 반도체소자의 공정결함 검사방법 |
JPH10177245A (ja) * | 1996-12-18 | 1998-06-30 | Fujitsu Ltd | レチクル、半導体基板及び半導体チップ |
US6889162B1 (en) * | 2000-03-07 | 2005-05-03 | Koninklijke Philips Electronics N.V. | Wafer target design and method for determining centroid of wafer target |
US7531907B2 (en) * | 2005-04-29 | 2009-05-12 | Hitachi Global Storage Technologies Netherlands B.V. | System and method for forming serial numbers on HDD wafers |
JP4665005B2 (ja) * | 2008-02-27 | 2011-04-06 | シャープ株式会社 | 半導体装置およびその製造方法、電子情報機器 |
KR20110069887A (ko) * | 2008-11-17 | 2011-06-23 | 에프. 호프만-라 로슈 아게 | 인자 vii 유전자의 발현을 저해하기 위한 조성물 및 방법 |
FI128447B (en) * | 2016-04-26 | 2020-05-15 | Teknologian Tutkimuskeskus Vtt Oy | Apparatus associated with analysis of thin film layers and method of making them |
CN114046749B (zh) * | 2021-10-26 | 2022-07-08 | 刘红霞 | 预制混凝土构件点状凹坑结合面粗糙度检测方法及系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2012360A1 (de) * | 1969-03-19 | 1970-10-01 | Arbeitsstelle für Molekularelektronik, χ 8O8O Dresden | Patentwesen, Ost-Berlin WPI38673 Verfahren und Schaltungsanordnung zum Herstellen von Fotoschablonen mit Wiederholsystemen beliebiger Größe, die in einem bezüglich eines Fixpunktes definiert verschobenen Schablonenfeld angeordnet sind |
LU65252A1 (fr) * | 1971-04-28 | 1972-07-14 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1024961A (en) * | 1963-02-21 | 1966-04-06 | Eastman Kodak Co | Improvements relating to a method of preparing an index file from recorded information and index patterns |
DE1948661A1 (de) * | 1968-11-04 | 1970-05-06 | Molekularelektronik | Schaltungsanordnung zur Realisierung bestimmter typischer Prozessschritte beim Herstellen und/oder Pruefen von Halbleiterbauelementen,insbesondere zum automatischen Einordnen beliebiger Fremdstrukturen in ein Rasterschema |
US3607347A (en) * | 1969-08-04 | 1971-09-21 | Sprague Electric Co | Data reduction and storage |
US3645626A (en) * | 1970-06-15 | 1972-02-29 | Ibm | Apparatus for detecting defects by optical scanning |
DE2226149A1 (de) * | 1971-11-02 | 1973-05-10 | Halbleiterwerk Frankfurt Oder | Verfahren zum erkennen der groesse von lage-, winkel- und ueberdeckungsfehlern bei der herstellung und anwendung von schablonen in der halbleitertechnik |
US3742229A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask alignment system |
US3863764A (en) * | 1974-02-28 | 1975-02-04 | Western Electric Co | Methods and apparatus for identifying nonmagnetic articles |
US3998639A (en) * | 1974-11-19 | 1976-12-21 | Bell Telephone Laboratories, Incorporated | Methods for determining feature-size accuracy of circuit patterns |
US3963354A (en) * | 1975-05-05 | 1976-06-15 | Bell Telephone Laboratories, Incorporated | Inspection of masks and wafers by image dissection |
JPS51140199A (en) * | 1975-05-30 | 1976-12-02 | Hitachi Metals Ltd | Crystal working process |
-
1977
- 1977-03-24 US US05/780,877 patent/US4134066A/en not_active Expired - Lifetime
- 1977-12-02 CA CA000292298A patent/CA1117653A/fr not_active Expired
-
1978
- 1978-02-08 FR FR7804189A patent/FR2385103A1/fr active Granted
- 1978-02-08 JP JP53012524A patent/JPS6030896B2/ja not_active Expired
- 1978-02-28 GB GB7888/78A patent/GB1591002A/en not_active Expired
- 1978-03-04 DE DE2809359A patent/DE2809359C2/de not_active Expired
- 1978-03-09 NL NL7802571A patent/NL7802571A/xx not_active Application Discontinuation
- 1978-03-21 IT IT21408/78A patent/IT1113165B/it active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2012360A1 (de) * | 1969-03-19 | 1970-10-01 | Arbeitsstelle für Molekularelektronik, χ 8O8O Dresden | Patentwesen, Ost-Berlin WPI38673 Verfahren und Schaltungsanordnung zum Herstellen von Fotoschablonen mit Wiederholsystemen beliebiger Größe, die in einem bezüglich eines Fixpunktes definiert verschobenen Schablonenfeld angeordnet sind |
LU65252A1 (fr) * | 1971-04-28 | 1972-07-14 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0226893A1 (fr) * | 1985-12-13 | 1987-07-01 | Siemens Aktiengesellschaft | Procédé de haute précision de mesure pour structures bidimensionnelles ainsi que masque de référence pour l'utilisation de ce procédé |
Also Published As
Publication number | Publication date |
---|---|
JPS53118797A (en) | 1978-10-17 |
DE2809359C2 (de) | 1984-01-26 |
FR2385103B1 (fr) | 1980-08-29 |
CA1117653A (fr) | 1982-02-02 |
IT1113165B (it) | 1986-01-20 |
US4134066A (en) | 1979-01-09 |
GB1591002A (en) | 1981-06-10 |
NL7802571A (nl) | 1978-09-26 |
IT7821408A0 (it) | 1978-03-21 |
JPS6030896B2 (ja) | 1985-07-19 |
DE2809359A1 (de) | 1978-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |