FR2379910A1 - SEMICONDUCTOR DEVICE AND PROCESS FOR ITS COATING - Google Patents
SEMICONDUCTOR DEVICE AND PROCESS FOR ITS COATINGInfo
- Publication number
- FR2379910A1 FR2379910A1 FR7803222A FR7803222A FR2379910A1 FR 2379910 A1 FR2379910 A1 FR 2379910A1 FR 7803222 A FR7803222 A FR 7803222A FR 7803222 A FR7803222 A FR 7803222A FR 2379910 A1 FR2379910 A1 FR 2379910A1
- Authority
- FR
- France
- Prior art keywords
- cocoon
- semiconductor component
- semiconductor device
- hand
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C45/0408—Injection moulding apparatus using movable moulds or mould halves involving at least a linear movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
- B29C2045/0475—Injection moulding apparatus using movable moulds or mould halves continuously movable moulds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Molding Of Porous Articles (AREA)
Abstract
L'enveloppe de ce dispositif semi-conducteur comportant un composant semi-conducteur et des conducteurs de connexion qui sont raccordés électriquement à des endroits de contact sur le composant semi-conducteur, est formée d'une part par un cocon qui assure la protection contre les influences de l'environnement, ce cocon étant de préférence en résine époxy et entourant le composant semi-conducteur et les liaisons électriques, et d'autre part par une capsule en matière thermoplastique mousseuse qui définit la forme extérieure et qui, par moulage par injection, est élaborée autour du cocon Application à la fabrication de circuits intégrés.The envelope of this semiconductor device comprising a semiconductor component and connection conductors which are electrically connected to contact points on the semiconductor component, is formed on the one hand by a cocoon which provides protection against environmental influences, this cocoon preferably being made of epoxy resin and surrounding the semiconductor component and the electrical connections, and on the other hand by a capsule of foamy thermoplastic material which defines the outer shape and which, by molding by injection, is developed around the cocoon Application to the manufacture of integrated circuits.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7701283A NL7701283A (en) | 1977-02-08 | 1977-02-08 | PROCESS FOR THE MANUFACTURE OF WHOLLY OR PARTLY OF FOAMED THERMOPLASTIC MATERIALS, OBJECTS MANUFACTURED IN ACCORDANCE WITH THIS PROCEDURE AND DEVICE FOR PERFORMING THE PROCEDURE. |
NL7701284A NL7701284A (en) | 1977-02-08 | 1977-02-08 | Encapsulating transistors using epoxide! fluidised bed - producing inner protection which is encapsulated using injected foam thermoplastic inside mould (BE 7.8.78) |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2379910A1 true FR2379910A1 (en) | 1978-09-01 |
FR2379910B1 FR2379910B1 (en) | 1984-05-04 |
Family
ID=26645284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7803222A Granted FR2379910A1 (en) | 1977-02-08 | 1978-02-06 | SEMICONDUCTOR DEVICE AND PROCESS FOR ITS COATING |
Country Status (12)
Country | Link |
---|---|
JP (1) | JPS53112063A (en) |
AR (1) | AR214553A1 (en) |
AT (1) | ATA87478A (en) |
AU (1) | AU513092B2 (en) |
BR (1) | BR7800732A (en) |
CA (1) | CA1093704A (en) |
DE (1) | DE2804956A1 (en) |
ES (1) | ES466679A1 (en) |
FR (1) | FR2379910A1 (en) |
GB (1) | GB1594892A (en) |
IT (1) | IT1092425B (en) |
SE (1) | SE7801325L (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0406634A1 (en) * | 1989-07-05 | 1991-01-09 | Bayer Ag | Process for the preparation of high temperature resistant foams of polyarylensulphides for thermoplastic injection molding processes |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2930760A1 (en) * | 1979-07-28 | 1981-02-12 | Itt Ind Gmbh Deutsche | METHOD FOR COATING SEMICONDUCTOR COMPONENTS BY INJECTION MOLDING |
DE3019239A1 (en) * | 1980-05-20 | 1981-11-26 | SIEMENS AG AAAAA, 1000 Berlin und 8000 München | Semiconductor encapsulation with layers of differing hardness layer fo - has semiconductor embedded in second layer of soft material for protection against external effects and degradation |
US4460537A (en) * | 1982-07-26 | 1984-07-17 | Motorola, Inc. | Slot transfer molding apparatus and methods |
JPS63112923U (en) * | 1987-01-16 | 1988-07-20 | ||
JP2774906B2 (en) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | Thin semiconductor device and method of manufacturing the same |
US6046076A (en) * | 1994-12-29 | 2000-04-04 | Tessera, Inc. | Vacuum dispense method for dispensing an encapsulant and machine therefor |
-
1978
- 1978-02-03 BR BR7800732A patent/BR7800732A/en unknown
- 1978-02-03 IT IT19995/78A patent/IT1092425B/en active
- 1978-02-03 GB GB4418/78A patent/GB1594892A/en not_active Expired
- 1978-02-06 JP JP1158278A patent/JPS53112063A/en active Granted
- 1978-02-06 FR FR7803222A patent/FR2379910A1/en active Granted
- 1978-02-06 DE DE19782804956 patent/DE2804956A1/en not_active Ceased
- 1978-02-06 ES ES466679A patent/ES466679A1/en not_active Expired
- 1978-02-06 SE SE7801325A patent/SE7801325L/en unknown
- 1978-02-06 AU AU33038/78A patent/AU513092B2/en not_active Expired
- 1978-02-06 AR AR270981A patent/AR214553A1/en active
- 1978-02-08 AT AT0087478A patent/ATA87478A/en not_active IP Right Cessation
- 1978-02-08 CA CA296,495A patent/CA1093704A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0406634A1 (en) * | 1989-07-05 | 1991-01-09 | Bayer Ag | Process for the preparation of high temperature resistant foams of polyarylensulphides for thermoplastic injection molding processes |
US5114983A (en) * | 1989-07-05 | 1992-05-19 | Bayer Aktiengesellschaft | Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and moldings obtainable by this process |
US5126380A (en) * | 1989-07-05 | 1992-06-30 | Stahlke Kurt Rainer | Use of polyarylene sulphides for the production of a structural foam resistant to high temperatures, process for the preparation of this foam, and mouldings obtainable by this process |
Also Published As
Publication number | Publication date |
---|---|
JPS5722420B2 (en) | 1982-05-13 |
JPS53112063A (en) | 1978-09-30 |
GB1594892A (en) | 1981-08-05 |
DE2804956A1 (en) | 1978-08-10 |
ES466679A1 (en) | 1979-07-01 |
AU3303878A (en) | 1979-08-16 |
CA1093704A (en) | 1981-01-13 |
IT7819995A0 (en) | 1978-02-03 |
FR2379910B1 (en) | 1984-05-04 |
AU513092B2 (en) | 1980-11-13 |
IT1092425B (en) | 1985-07-12 |
ATA87478A (en) | 1982-07-15 |
SE7801325L (en) | 1978-08-09 |
BR7800732A (en) | 1978-10-10 |
AR214553A1 (en) | 1979-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |