FR2345814A1 - Dispositifs semiconducteurs et leur fabrication - Google Patents

Dispositifs semiconducteurs et leur fabrication

Info

Publication number
FR2345814A1
FR2345814A1 FR7708682A FR7708682A FR2345814A1 FR 2345814 A1 FR2345814 A1 FR 2345814A1 FR 7708682 A FR7708682 A FR 7708682A FR 7708682 A FR7708682 A FR 7708682A FR 2345814 A1 FR2345814 A1 FR 2345814A1
Authority
FR
France
Prior art keywords
manufacturing
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7708682A
Other languages
English (en)
Other versions
FR2345814B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2345814A1 publication Critical patent/FR2345814A1/fr
Application granted granted Critical
Publication of FR2345814B1 publication Critical patent/FR2345814B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/7606—Transistor-like structures, e.g. hot electron transistor [HET]; metal base transistor [MBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/47—Schottky barrier electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/8618—Diodes with bulk potential barrier, e.g. Camel diodes, Planar Doped Barrier diodes, Graded bandgap diodes
FR7708682A 1976-03-24 1977-03-23 Dispositifs semiconducteurs et leur fabrication Granted FR2345814A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB11835/76A GB1573309A (en) 1976-03-24 1976-03-24 Semiconductor devices and their manufacture

Publications (2)

Publication Number Publication Date
FR2345814A1 true FR2345814A1 (fr) 1977-10-21
FR2345814B1 FR2345814B1 (fr) 1983-07-22

Family

ID=9993593

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7708682A Granted FR2345814A1 (fr) 1976-03-24 1977-03-23 Dispositifs semiconducteurs et leur fabrication

Country Status (6)

Country Link
US (1) US4149174A (fr)
JP (1) JPS5938742B2 (fr)
CA (1) CA1078073A (fr)
DE (1) DE2711562C3 (fr)
FR (1) FR2345814A1 (fr)
GB (1) GB1573309A (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0094129A2 (fr) * 1982-05-10 1983-11-16 Philips Electronics Uk Limited Dispositifs semi-conducteurs comportant des transistors unipolaires à porteurs chauds et procédé de fabrication
EP0099979A2 (fr) * 1982-07-26 1984-02-08 LGZ LANDIS & GYR ZUG AG Détecteur de champ magnétique et son application
EP0106254A2 (fr) * 1982-10-08 1984-04-25 Siemens Aktiengesellschaft Transistor à barrière d'énergie ajustable et son application
EP0216380A2 (fr) * 1985-09-26 1987-04-01 Kabushiki Kaisha Toshiba Dispositif semi-conducteur ayant une électrode à structure de plaque de champ
EP0235248A1 (fr) * 1985-07-12 1987-09-09 Hewlett Packard Co Diode detectrice/melangeuse fonctionnant avec une tension de polarisation zero et son procede de fabrication.
WO2000062346A1 (fr) * 1999-04-08 2000-10-19 Koninklijke Philips Electronics N.V. Diode a effet de claquage et son procede de fabrication
EP2284890A1 (fr) * 2009-07-31 2011-02-16 Infineon Technologies AG Élément de protection contre les décharges électrostatiques et puce de protection contre les décharges électrostatiques et procédé de production correspondant

Families Citing this family (41)

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Publication number Priority date Publication date Assignee Title
JPS5378788A (en) * 1976-12-23 1978-07-12 Hitachi Ltd Temperature-compensation-type constant voltage element
DE2800820A1 (de) * 1978-01-10 1979-09-27 Hermann Dr Ing Mader Halbleiter-diode
US4373166A (en) * 1978-12-20 1983-02-08 Ibm Corporation Schottky Barrier diode with controlled characteristics
US4357178A (en) * 1978-12-20 1982-11-02 Ibm Corporation Schottky barrier diode with controlled characteristics and fabrication method
FR2460040A1 (fr) * 1979-06-22 1981-01-16 Thomson Csf Procede pour realiser une diode schottky a tenue en tension amelioree
GB2056166B (en) * 1979-08-08 1983-09-14 Philips Electronic Associated Hot-electron or hot-hole transistor
US4260431A (en) * 1979-12-21 1981-04-07 Harris Corporation Method of making Schottky barrier diode by ion implantation and impurity diffusion
US4353081A (en) * 1980-01-29 1982-10-05 Bell Telephone Laboratories, Incorporated Graded bandgap rectifying semiconductor devices
JPS56133867A (en) * 1980-03-21 1981-10-20 Semiconductor Res Found Thermoelectric emission transistor
JPS5775464A (en) * 1980-10-28 1982-05-12 Semiconductor Res Found Semiconductor device controlled by tunnel injection
NL8103376A (nl) * 1981-07-16 1983-02-16 Philips Nv Weergeefinrichting.
US4544939A (en) * 1981-08-25 1985-10-01 Rca Corporation Schottky-barrier diode radiant energy detector with extended longer wavelength response
US4449140A (en) * 1981-12-24 1984-05-15 National Research Development Corporation Semi-conductor barrier switching devices
US4829349A (en) * 1983-06-30 1989-05-09 American Telephone And Telegraph Company, At&T Bell Laboratories Transistor having voltage-controlled thermionic emission
GB2151843A (en) * 1983-12-20 1985-07-24 Philips Electronic Associated Semiconductor devices
GB2151844A (en) * 1983-12-20 1985-07-24 Philips Electronic Associated Semiconductor devices
US5214297A (en) * 1984-11-19 1993-05-25 Fujitsu Limited High-speed semiconductor device
DE3708474A1 (de) * 1987-03-16 1988-09-29 Licentia Gmbh Majoritaetstraeger-halbleiterbauelement und verfahren zu seiner herstellung
NL8701497A (nl) * 1987-06-26 1989-01-16 Philips Nv Halfgeleiderinrichting voor het opwekken van electromagnetische straling.
US4847666A (en) * 1987-12-17 1989-07-11 General Motors Corporation Hot electron transistors
JP2731089B2 (ja) * 1991-10-02 1998-03-25 三菱電機株式会社 高速動作半導体装置およびその製造方法
US5258640A (en) * 1992-09-02 1993-11-02 International Business Machines Corporation Gate controlled Schottky barrier diode
US5329151A (en) * 1993-04-09 1994-07-12 At&T Bell Laboratories Semiconductor diode
US7397102B2 (en) * 2005-04-20 2008-07-08 Taurus Micropower, Inc. Junction barrier schottky with low forward drop and improved reverse block voltage
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
FR2832547A1 (fr) * 2001-11-21 2003-05-23 St Microelectronics Sa Procede de realisation d'une diode schottky sur substrat de carbure de silicium
US7057220B2 (en) * 2003-10-09 2006-06-06 Micron Technology, Inc. Ultrashallow photodiode using indium
US7649496B1 (en) * 2004-10-12 2010-01-19 Guy Silver EM rectifying antenna suitable for use in conjunction with a natural breakdown device
US7847315B2 (en) * 2007-03-09 2010-12-07 Diodes Fabtech Inc. High efficiency rectifier
US8212327B2 (en) * 2008-03-06 2012-07-03 Sionyx, Inc. High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
EP2583312A2 (fr) 2010-06-18 2013-04-24 Sionyx, Inc. Dispositifs photosensibles à grande vitesse et procédés associés
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
JP2014525091A (ja) 2011-07-13 2014-09-25 サイオニクス、インク． 生体撮像装置および関連方法
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
JP6466346B2 (ja) 2013-02-15 2019-02-06 サイオニクス、エルエルシー アンチブルーミング特性を有するハイダイナミックレンジｃｍｏｓ画像センサおよび関連づけられた方法
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
WO2014209421A1 (fr) 2013-06-29 2014-12-31 Sionyx, Inc. Régions texturées formées de tranchées peu profondes et procédés associés.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3430113A (en) * 1965-10-04 1969-02-25 Us Air Force Current modulated field effect transistor
US3488527A (en) * 1967-09-05 1970-01-06 Fairchild Camera Instr Co Punch-through,microwave negativeresistance device
US3814993A (en) * 1972-11-15 1974-06-04 Us Navy Tuneable infrared photocathode
FR2266307A1 (fr) * 1974-03-28 1975-10-24 Sony Corp
US3943552A (en) * 1973-06-26 1976-03-09 U.S. Philips Corporation Semiconductor devices

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
US3615929A (en) * 1965-07-08 1971-10-26 Texas Instruments Inc Method of forming epitaxial region of predetermined thickness and article of manufacture
US3458781A (en) * 1966-07-18 1969-07-29 Unitrode Corp High-voltage planar semiconductor devices
US3823352A (en) * 1972-12-13 1974-07-09 Bell Telephone Labor Inc Field effect transistor structures and methods
US3940783A (en) * 1974-02-11 1976-02-24 Signetics Corporation Majority carriers-variable threshold rectifier and/or voltage reference semiconductor structure
US3964084A (en) * 1974-06-12 1976-06-15 Bell Telephone Laboratories, Incorporated Schottky barrier diode contacts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3430113A (en) * 1965-10-04 1969-02-25 Us Air Force Current modulated field effect transistor
US3488527A (en) * 1967-09-05 1970-01-06 Fairchild Camera Instr Co Punch-through,microwave negativeresistance device
US3814993A (en) * 1972-11-15 1974-06-04 Us Navy Tuneable infrared photocathode
US3943552A (en) * 1973-06-26 1976-03-09 U.S. Philips Corporation Semiconductor devices
FR2266307A1 (fr) * 1974-03-28 1975-10-24 Sony Corp

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0094129A2 (fr) * 1982-05-10 1983-11-16 Philips Electronics Uk Limited Dispositifs semi-conducteurs comportant des transistors unipolaires à porteurs chauds et procédé de fabrication
EP0094129A3 (en) * 1982-05-10 1987-01-28 Philips Electronic And Associated Industries Limited Semiconductor devices comprising unipolar hot-carrier transistors and methods of manufacturing the same
EP0099979A2 (fr) * 1982-07-26 1984-02-08 LGZ LANDIS & GYR ZUG AG Détecteur de champ magnétique et son application
EP0099979A3 (en) * 1982-07-26 1984-09-26 Lgz Landis & Gyr Zug Ag Magnetic field sensor
EP0106254A2 (fr) * 1982-10-08 1984-04-25 Siemens Aktiengesellschaft Transistor à barrière d'énergie ajustable et son application
EP0106254A3 (fr) * 1982-10-08 1986-12-10 Siemens Aktiengesellschaft Transistor à barrière d'énergie ajustable et son application
EP0235248A4 (fr) * 1985-07-12 1988-01-21 Hewlett Packard Co Diode detectrice/melangeuse fonctionnant avec une tension de polarisation zero et son procede de fabrication.
EP0235248A1 (fr) * 1985-07-12 1987-09-09 Hewlett Packard Co Diode detectrice/melangeuse fonctionnant avec une tension de polarisation zero et son procede de fabrication.
EP0216380A3 (en) * 1985-09-26 1987-12-09 Kabushiki Kaisha Toshiba Semiconductor device with a field plate electrode structure
EP0216380A2 (fr) * 1985-09-26 1987-04-01 Kabushiki Kaisha Toshiba Dispositif semi-conducteur ayant une électrode à structure de plaque de champ
WO2000062346A1 (fr) * 1999-04-08 2000-10-19 Koninklijke Philips Electronics N.V. Diode a effet de claquage et son procede de fabrication
EP2284890A1 (fr) * 2009-07-31 2011-02-16 Infineon Technologies AG Élément de protection contre les décharges électrostatiques et puce de protection contre les décharges électrostatiques et procédé de production correspondant
US8530968B2 (en) 2009-07-31 2013-09-10 Infineon Technologies Ag Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing the same
US8946823B2 (en) 2009-07-31 2015-02-03 Infineon Technologies Ag Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing the same

Also Published As

Publication number Publication date
JPS589366A (ja) 1983-01-19
DE2711562C3 (de) 1981-08-27
JPS5938742B2 (ja) 1984-09-19
DE2711562B2 (de) 1980-12-18
CA1078073A (fr) 1980-05-20
FR2345814B1 (fr) 1983-07-22
GB1573309A (en) 1980-08-20
DE2711562A1 (de) 1977-09-29
US4149174A (en) 1979-04-10

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Legal Events

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ST Notification of lapse