SE7611989L - Etsningsanordning - Google Patents

Etsningsanordning

Info

Publication number
SE7611989L
SE7611989L SE7611989A SE7611989A SE7611989L SE 7611989 L SE7611989 L SE 7611989L SE 7611989 A SE7611989 A SE 7611989A SE 7611989 A SE7611989 A SE 7611989A SE 7611989 L SE7611989 L SE 7611989L
Authority
SE
Sweden
Prior art keywords
etching device
etching
Prior art date
Application number
SE7611989A
Other languages
English (en)
Inventor
C P Pesek Jr
Original Assignee
Colight Photomechanical Produc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Colight Photomechanical Produc filed Critical Colight Photomechanical Produc
Publication of SE7611989L publication Critical patent/SE7611989L/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
SE7611989A 1976-01-09 1976-10-28 Etsningsanordning SE7611989L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/647,796 US3999564A (en) 1976-01-09 1976-01-09 Continuous etching and etched material recovery system

Publications (1)

Publication Number Publication Date
SE7611989L true SE7611989L (sv) 1977-07-10

Family

ID=24598302

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7611989A SE7611989L (sv) 1976-01-09 1976-10-28 Etsningsanordning

Country Status (7)

Country Link
US (1) US3999564A (sv)
JP (1) JPS5288239A (sv)
DE (1) DE2651675A1 (sv)
FR (1) FR2337770A1 (sv)
GB (1) GB1542704A (sv)
NL (1) NL7700113A (sv)
SE (1) SE7611989L (sv)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2917597A1 (de) * 1979-04-30 1980-11-13 Siemens Ag Verfahren zur regenerierung ammoniakalischer aetzloesungen zum aetzen von metallischem kupfer
DE3324450A1 (de) * 1983-07-07 1985-01-17 ELO-CHEM Ätztechnik GmbH, 7758 Meersburg Ammoniumsulfathaltige aetzloesung sowie verfahren zur regeneration der aetzloesung
DE3422276A1 (de) * 1984-06-15 1985-12-19 Walter Holzer Vorrichtung und arbeitsverfahren zum aetzen von leiterplatten
EP0393270A1 (en) * 1989-04-21 1990-10-24 Ming-Hsing Lee Process for etching copper with ammoniacal etchant solution and reconditioning the used etchant solution
DE3936363A1 (de) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Verfahren zum aetzen von gegenstaenden sowie aetzanlage
US5015322A (en) * 1990-02-23 1991-05-14 Mcdonnell Douglas Corporation Tank arrangement particularly designed for chemical milling operations
US5143102A (en) * 1990-03-12 1992-09-01 Graymills Corporation High pressure parts cleaner and method
JP3142195B2 (ja) * 1993-07-20 2001-03-07 大日本スクリーン製造株式会社 薬液供給装置
US5733441A (en) * 1996-06-27 1998-03-31 United Microelectronics Corporation Pre-wet system for a filter
US6372111B1 (en) 2000-01-18 2002-04-16 David K. Watts Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process
US6362103B1 (en) 2000-01-18 2002-03-26 David K. Watts Method and apparatus for rejuvenating a CMP chemical solution
US6475403B2 (en) * 2000-01-31 2002-11-05 Matsushita Electric Industrial Co., Ltd. Etching method and apparatus
US6503363B2 (en) * 2000-03-03 2003-01-07 Seh America, Inc. System for reducing wafer contamination using freshly, conditioned alkaline etching solution
US20080217296A1 (en) * 2007-03-07 2008-09-11 United Microelectronics Corp. Etching apparatus for semiconductor processing apparatus and method thereof for recycling etchant solutions
CN103721476B (zh) * 2013-12-20 2017-09-29 鞍钢股份有限公司 一种盐酸再生机组含酸废水回收装置及方法
CN114276813B (zh) * 2022-01-30 2023-08-25 广东东方锆业科技股份有限公司 一种碱性蚀刻液的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266502A (en) * 1964-09-14 1966-08-16 Western Technology Inc Chemical milling machine
US3327721A (en) * 1965-05-28 1967-06-27 Keith L Carlson Etching apparatus
US3427198A (en) * 1965-10-22 1969-02-11 Inland Steel Co Method and apparatus for automatic control of pickling system
US3526560A (en) * 1967-02-13 1970-09-01 Chemcut Corp Etchant regeneration apparatus
AT313671B (de) * 1971-03-08 1974-02-25 Hoellmueller Maschbau H Verfahren zum Regenerieren von Ätzlösungen für Kupfer und Kupferlegierungen, Regenerationsanlage zur Durchführung dieses Verfahrens sowie Meß- und Steuereinrichtung für diese Regenerationsanlage
US3933544A (en) * 1971-03-08 1976-01-20 Firma Hans Hollmuller, Maschinenbau Method of etching copper and copper alloys
US3705061A (en) * 1971-03-19 1972-12-05 Southern California Chem Co In Continuous redox process for dissolving copper
CA989283A (en) * 1972-02-09 1976-05-18 Gerald J. Roelants Continuous etching process
DE2237804A1 (de) * 1972-03-07 1973-09-13 Southern California Chem Co Kontinuierliches redox-verfahren und vorrichtung zum loesen von kupfer
FR2175746B1 (sv) * 1972-03-16 1976-04-30 Shipley Co

Also Published As

Publication number Publication date
NL7700113A (nl) 1977-07-12
JPS5288239A (en) 1977-07-23
JPS554836B2 (sv) 1980-02-01
GB1542704A (en) 1979-03-21
DE2651675A1 (de) 1977-07-14
FR2337770A1 (fr) 1977-08-05
US3999564A (en) 1976-12-28

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