FR2341945A1 - Composant a semi-conducteurs de puissance a refroidissement par liquide - Google Patents

Composant a semi-conducteurs de puissance a refroidissement par liquide

Info

Publication number
FR2341945A1
FR2341945A1 FR7704452A FR7704452A FR2341945A1 FR 2341945 A1 FR2341945 A1 FR 2341945A1 FR 7704452 A FR7704452 A FR 7704452A FR 7704452 A FR7704452 A FR 7704452A FR 2341945 A1 FR2341945 A1 FR 2341945A1
Authority
FR
France
Prior art keywords
cooling
insulating case
power semiconductor
elements
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7704452A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2341945A1 publication Critical patent/FR2341945A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7704452A 1976-02-17 1977-02-16 Composant a semi-conducteurs de puissance a refroidissement par liquide Withdrawn FR2341945A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762606156 DE2606156A1 (de) 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement

Publications (1)

Publication Number Publication Date
FR2341945A1 true FR2341945A1 (fr) 1977-09-16

Family

ID=5970024

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7704452A Withdrawn FR2341945A1 (fr) 1976-02-17 1977-02-16 Composant a semi-conducteurs de puissance a refroidissement par liquide

Country Status (3)

Country Link
CH (1) CH604368A5 (enExample)
DE (1) DE2606156A1 (enExample)
FR (1) FR2341945A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067575A3 (en) * 1981-05-28 1984-02-08 Tokyo Shibaura Denki Kabushiki Kaisha Power semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137407A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067575A3 (en) * 1981-05-28 1984-02-08 Tokyo Shibaura Denki Kabushiki Kaisha Power semiconductor device
US4609937A (en) * 1981-05-28 1986-09-02 Tokyo Shibaura Electric Co Power semiconductor device with O-ring seal

Also Published As

Publication number Publication date
CH604368A5 (enExample) 1978-09-15
DE2606156A1 (de) 1977-08-18

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Legal Events

Date Code Title Description
ST Notification of lapse