DE2606156A1 - Fluessigkeitsgekuehltes leistungs- halbleiterbauelement - Google Patents

Fluessigkeitsgekuehltes leistungs- halbleiterbauelement

Info

Publication number
DE2606156A1
DE2606156A1 DE19762606156 DE2606156A DE2606156A1 DE 2606156 A1 DE2606156 A1 DE 2606156A1 DE 19762606156 DE19762606156 DE 19762606156 DE 2606156 A DE2606156 A DE 2606156A DE 2606156 A1 DE2606156 A1 DE 2606156A1
Authority
DE
Germany
Prior art keywords
insulating housing
disk
following
power
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762606156
Other languages
German (de)
English (en)
Inventor
Erwin Klein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Germany
Original Assignee
BBC BROWN BOVERI and CIE
Brown Boveri und Cie AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, Brown Boveri und Cie AG Germany filed Critical BBC BROWN BOVERI and CIE
Priority to DE19762606156 priority Critical patent/DE2606156A1/de
Priority to CH178877A priority patent/CH604368A5/xx
Priority to FR7704452A priority patent/FR2341945A1/fr
Publication of DE2606156A1 publication Critical patent/DE2606156A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19762606156 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement Withdrawn DE2606156A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19762606156 DE2606156A1 (de) 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement
CH178877A CH604368A5 (enExample) 1976-02-17 1977-02-14
FR7704452A FR2341945A1 (fr) 1976-02-17 1977-02-16 Composant a semi-conducteurs de puissance a refroidissement par liquide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762606156 DE2606156A1 (de) 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2606156A1 true DE2606156A1 (de) 1977-08-18

Family

ID=5970024

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762606156 Withdrawn DE2606156A1 (de) 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement

Country Status (3)

Country Link
CH (1) CH604368A5 (enExample)
DE (1) DE2606156A1 (enExample)
FR (1) FR2341945A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196535A (en) * 1981-05-28 1982-12-02 Toshiba Corp Semiconductor device for electric power

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520383A (en) * 1981-09-19 1985-05-28 Bbc Aktiengesellschaft Brown, Boveri & Cie. Power semiconductor component for boiling cooling

Also Published As

Publication number Publication date
FR2341945A1 (fr) 1977-09-16
CH604368A5 (enExample) 1978-09-15

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Legal Events

Date Code Title Description
8162 Independent application
8139 Disposal/non-payment of the annual fee