CH604368A5 - - Google Patents

Info

Publication number
CH604368A5
CH604368A5 CH178877A CH178877A CH604368A5 CH 604368 A5 CH604368 A5 CH 604368A5 CH 178877 A CH178877 A CH 178877A CH 178877 A CH178877 A CH 178877A CH 604368 A5 CH604368 A5 CH 604368A5
Authority
CH
Switzerland
Application number
CH178877A
Inventor
Erwin Klein
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH604368A5 publication Critical patent/CH604368A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CH178877A 1976-02-17 1977-02-14 CH604368A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762606156 DE2606156A1 (de) 1976-02-17 1976-02-17 Fluessigkeitsgekuehltes leistungs- halbleiterbauelement

Publications (1)

Publication Number Publication Date
CH604368A5 true CH604368A5 (xx) 1978-09-15

Family

ID=5970024

Family Applications (1)

Application Number Title Priority Date Filing Date
CH178877A CH604368A5 (xx) 1976-02-17 1977-02-14

Country Status (3)

Country Link
CH (1) CH604368A5 (xx)
DE (1) DE2606156A1 (xx)
FR (1) FR2341945A1 (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196535A (en) * 1981-05-28 1982-12-02 Toshiba Corp Semiconductor device for electric power
DE3137407A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung

Also Published As

Publication number Publication date
FR2341945A1 (fr) 1977-09-16
DE2606156A1 (de) 1977-08-18

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Legal Events

Date Code Title Description
PL Patent ceased