FR2337483A1 - Composants a forte puissance de dissipation admissible par transfert de chaleur - Google Patents

Composants a forte puissance de dissipation admissible par transfert de chaleur

Info

Publication number
FR2337483A1
FR2337483A1 FR7540300A FR7540300A FR2337483A1 FR 2337483 A1 FR2337483 A1 FR 2337483A1 FR 7540300 A FR7540300 A FR 7540300A FR 7540300 A FR7540300 A FR 7540300A FR 2337483 A1 FR2337483 A1 FR 2337483A1
Authority
FR
France
Prior art keywords
equipment
condenses
evaporates
heat dissipation
dissipation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7540300A
Other languages
English (en)
French (fr)
Other versions
FR2337483B1 (enrdf_load_stackoverflow
Inventor
Roland Saint-Marcoux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP COMPOSANTS ELECTRON
Original Assignee
EUROP COMPOSANTS ELECTRON
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP COMPOSANTS ELECTRON filed Critical EUROP COMPOSANTS ELECTRON
Priority to FR7540300A priority Critical patent/FR2337483A1/fr
Priority to JP16092176A priority patent/JPS52101461A/ja
Priority to DD19666076A priority patent/DD128992A5/xx
Priority to DE19762659339 priority patent/DE2659339A1/de
Publication of FR2337483A1 publication Critical patent/FR2337483A1/fr
Application granted granted Critical
Publication of FR2337483B1 publication Critical patent/FR2337483B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7540300A 1975-12-31 1975-12-31 Composants a forte puissance de dissipation admissible par transfert de chaleur Granted FR2337483A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7540300A FR2337483A1 (fr) 1975-12-31 1975-12-31 Composants a forte puissance de dissipation admissible par transfert de chaleur
JP16092176A JPS52101461A (en) 1975-12-31 1976-12-27 Heat transmission allowablee loss heavyycurrent element
DD19666076A DD128992A5 (de) 1975-12-31 1976-12-28 Bauteil mit grosser zulaessiger verlustleistung
DE19762659339 DE2659339A1 (de) 1975-12-31 1976-12-29 Bauteil mit grosser zulaessiger verlustleistung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540300A FR2337483A1 (fr) 1975-12-31 1975-12-31 Composants a forte puissance de dissipation admissible par transfert de chaleur

Publications (2)

Publication Number Publication Date
FR2337483A1 true FR2337483A1 (fr) 1977-07-29
FR2337483B1 FR2337483B1 (enrdf_load_stackoverflow) 1980-01-04

Family

ID=9164386

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7540300A Granted FR2337483A1 (fr) 1975-12-31 1975-12-31 Composants a forte puissance de dissipation admissible par transfert de chaleur

Country Status (4)

Country Link
JP (1) JPS52101461A (enrdf_load_stackoverflow)
DD (1) DD128992A5 (enrdf_load_stackoverflow)
DE (1) DE2659339A1 (enrdf_load_stackoverflow)
FR (1) FR2337483A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132085A1 (en) * 2013-03-01 2014-09-04 Iceotope Limited A module for cooling one or more heat generating components

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009006216B4 (de) * 2009-01-27 2018-11-22 Modine Manufacturing Co. Kühlvorrichtung und Herstellungsverfahren
CN115103580B (zh) * 2022-08-01 2025-06-13 超聚变数字技术有限公司 电子设备及计算系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132085A1 (en) * 2013-03-01 2014-09-04 Iceotope Limited A module for cooling one or more heat generating components

Also Published As

Publication number Publication date
JPS52101461A (en) 1977-08-25
DE2659339A1 (de) 1977-07-14
FR2337483B1 (enrdf_load_stackoverflow) 1980-01-04
DD128992A5 (de) 1977-12-21

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Legal Events

Date Code Title Description
ST Notification of lapse