DE2659339A1 - Bauteil mit grosser zulaessiger verlustleistung - Google Patents
Bauteil mit grosser zulaessiger verlustleistungInfo
- Publication number
- DE2659339A1 DE2659339A1 DE19762659339 DE2659339A DE2659339A1 DE 2659339 A1 DE2659339 A1 DE 2659339A1 DE 19762659339 DE19762659339 DE 19762659339 DE 2659339 A DE2659339 A DE 2659339A DE 2659339 A1 DE2659339 A1 DE 2659339A1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- heat dissipation
- component according
- medium
- walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003990 capacitor Substances 0.000 claims description 37
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 238000001816 cooling Methods 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000004338 Dichlorodifluoromethane Substances 0.000 claims description 2
- 229910018503 SF6 Inorganic materials 0.000 claims description 2
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical group FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 claims description 2
- 235000019404 dichlorodifluoromethane Nutrition 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical group FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 claims description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 206010035148 Plague Diseases 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7540300A FR2337483A1 (fr) | 1975-12-31 | 1975-12-31 | Composants a forte puissance de dissipation admissible par transfert de chaleur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2659339A1 true DE2659339A1 (de) | 1977-07-14 |
Family
ID=9164386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19762659339 Withdrawn DE2659339A1 (de) | 1975-12-31 | 1976-12-29 | Bauteil mit grosser zulaessiger verlustleistung |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS52101461A (enrdf_load_stackoverflow) |
| DD (1) | DD128992A5 (enrdf_load_stackoverflow) |
| DE (1) | DE2659339A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2337483A1 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009006216A1 (de) * | 2009-01-27 | 2010-07-29 | Modine Manufacturing Co., Racine | Kühlvorrichtung und Herstellungsverfahren |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2511354A (en) * | 2013-03-01 | 2014-09-03 | Iceotope Ltd | A module for cooling one or more heat generating components |
| CN115103580B (zh) * | 2022-08-01 | 2025-06-13 | 超聚变数字技术有限公司 | 电子设备及计算系统 |
-
1975
- 1975-12-31 FR FR7540300A patent/FR2337483A1/fr active Granted
-
1976
- 1976-12-27 JP JP16092176A patent/JPS52101461A/ja active Pending
- 1976-12-28 DD DD19666076A patent/DD128992A5/xx unknown
- 1976-12-29 DE DE19762659339 patent/DE2659339A1/de not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009006216A1 (de) * | 2009-01-27 | 2010-07-29 | Modine Manufacturing Co., Racine | Kühlvorrichtung und Herstellungsverfahren |
| DE102009006216B4 (de) | 2009-01-27 | 2018-11-22 | Modine Manufacturing Co. | Kühlvorrichtung und Herstellungsverfahren |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2337483B1 (enrdf_load_stackoverflow) | 1980-01-04 |
| FR2337483A1 (fr) | 1977-07-29 |
| JPS52101461A (en) | 1977-08-25 |
| DD128992A5 (de) | 1977-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: PRINZ, E., DIPL.-ING. LEISER, G., DIPL.-ING., PAT. |
|
| 8141 | Disposal/no request for examination |