FR2313775B1 - - Google Patents

Info

Publication number
FR2313775B1
FR2313775B1 FR7616659A FR7616659A FR2313775B1 FR 2313775 B1 FR2313775 B1 FR 2313775B1 FR 7616659 A FR7616659 A FR 7616659A FR 7616659 A FR7616659 A FR 7616659A FR 2313775 B1 FR2313775 B1 FR 2313775B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7616659A
Other versions
FR2313775A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of FR2313775A1 publication Critical patent/FR2313775A1/fr
Application granted granted Critical
Publication of FR2313775B1 publication Critical patent/FR2313775B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Measuring Leads Or Probes (AREA)
FR7616659A 1975-06-04 1976-06-02 Procede et dispositif d'assemblage et d'essai de circuits integres Granted FR2313775A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/583,739 US3984620A (en) 1975-06-04 1975-06-04 Integrated circuit chip test and assembly package

Publications (2)

Publication Number Publication Date
FR2313775A1 FR2313775A1 (fr) 1976-12-31
FR2313775B1 true FR2313775B1 (fr) 1982-07-02

Family

ID=24334363

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7616659A Granted FR2313775A1 (fr) 1975-06-04 1976-06-02 Procede et dispositif d'assemblage et d'essai de circuits integres

Country Status (7)

Country Link
US (2) US3984620A (fr)
JP (1) JPS5850024B2 (fr)
CA (1) CA1068829A (fr)
DE (1) DE2625383C2 (fr)
FR (1) FR2313775A1 (fr)
GB (1) GB1492015A (fr)
IT (1) IT1074474B (fr)

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FR2412850A1 (fr) * 1977-04-26 1979-07-20 Suwa Seikosha Kk Circuit integre a semi-conducteurs
JPS5474674A (en) * 1977-11-26 1979-06-14 Shinkawa Seisakusho Kk Method of connecting semiconductor
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform
JPS5562732A (en) * 1978-11-06 1980-05-12 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparation of aperture stop
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
CA1115852A (fr) * 1980-01-09 1982-01-05 Jacques R. St. Louis Montage de dispositif au silicium sur substrats de ceramique et boitiers et ensembles contenant ces dispositifs
US4308339A (en) * 1980-02-07 1981-12-29 Westinghouse Electric Corp. Method for manufacturing tape including lead frames
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
US4439754A (en) * 1981-04-03 1984-03-27 Electro-Films, Inc. Apertured electronic circuit package
US4445043A (en) * 1982-01-28 1984-04-24 General Instrument Corporation Method of making an optocoupler
JPS58162045A (ja) * 1982-03-23 1983-09-26 Telmec Co Ltd ウエハ−プロ−ビング用探針ユニツトの構造
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS6189651A (ja) * 1984-10-08 1986-05-07 Fujitsu Ltd 半導体装置
US4685030A (en) * 1985-04-29 1987-08-04 Energy Conversion Devices, Inc. Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits
US4760335A (en) * 1985-07-30 1988-07-26 Westinghouse Electric Corp. Large scale integrated circuit test system
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4701363A (en) * 1986-01-27 1987-10-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
JPS62233774A (ja) * 1986-04-03 1987-10-14 Matsushita Electric Ind Co Ltd 回路基板の検査方法
US4735678A (en) * 1987-04-13 1988-04-05 Olin Corporation Forming a circuit pattern in a metallic tape by electrical discharge machining
US4843695A (en) * 1987-07-16 1989-07-04 Digital Equipment Corporation Method of assembling tab bonded semiconductor chip package
US5323035A (en) * 1992-10-13 1994-06-21 Glenn Leedy Interconnection structure for integrated circuits and method for making same
JPH01290598A (ja) * 1988-05-17 1989-11-22 Res Dev Corp Of Japan 微細マルチプローブの製造方法
US4852788A (en) * 1988-06-16 1989-08-01 American Technology, Inc. Method and apparatus of ultrasonic gang welding
US4998062A (en) * 1988-10-25 1991-03-05 Tokyo Electron Limited Probe device having micro-strip line structure
US5091694A (en) * 1989-01-31 1992-02-25 Tokyo Electron Limited Quartz probe apparatus
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit
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US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
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US5220726A (en) * 1991-06-26 1993-06-22 Xerox Corporation Method for manufacturing an electrically connectable module
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US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
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JP2632136B2 (ja) * 1994-10-17 1997-07-23 日本電子材料株式会社 高温測定用プローブカード
DE19520676A1 (de) * 1995-06-07 1996-12-12 Deutsche Telekom Ag Hybridschaltung und Verfahren zur Herstellung derselben
US6005267A (en) * 1995-09-29 1999-12-21 Itt Corporation MES/MIS FET with split-gate RF input
US5756370A (en) * 1996-02-08 1998-05-26 Micron Technology, Inc. Compliant contact system with alignment structure for testing unpackaged semiconductor dice
JP3123483B2 (ja) 1997-10-28 2001-01-09 日本電気株式会社 プローブカード及びプローブカード形成方法
JP4685240B2 (ja) * 1998-07-08 2011-05-18 カプレス エイピーエス 多探針プローブ
US7304486B2 (en) * 1998-07-08 2007-12-04 Capres A/S Nano-drive for high resolution positioning and for positioning of a multi-point probe
JP2000099678A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd Ｉｃカード及びその製造方法
DE19904138B4 (de) * 1999-02-03 2008-10-16 Deutsche Telekom Ag Verfahren zur Herstellung von Kontakthügeln für die Chipeinbettung in Dünnfilmanordnungen
US7132841B1 (en) * 2000-06-06 2006-11-07 International Business Machines Corporation Carrier for test, burn-in, and first level packaging
US7189378B2 (en) * 2002-02-04 2007-03-13 Kulite Semiconductor Products, Inc. Miniature reaction chamber template structure for fabrication of nanoscale molecular systems and devices
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US7459376B2 (en) * 2005-02-04 2008-12-02 Infineon Technologies Ag Dissociated fabrication of packages and chips of integrated circuits
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US3292241A (en) * 1964-05-20 1966-12-20 Motorola Inc Method for connecting semiconductor devices
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US3381372A (en) * 1966-07-13 1968-05-07 Sperry Rand Corp Method of electrically connecting and hermetically sealing packages for microelectronic circuits
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US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
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US3698075A (en) * 1969-11-05 1972-10-17 Motorola Inc Ultrasonic metallic sheet-frame bonding
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US3709424A (en) * 1971-02-19 1973-01-09 Signetics Corp Integrated circuit bonder
GB1383297A (en) * 1972-02-23 1974-02-12 Plessey Co Ltd Electrical integrated circuit package
JPS5128980B2 (fr) * 1972-12-26 1976-08-23

Also Published As

Publication number Publication date
DE2625383A1 (de) 1976-12-16
IT1074474B (it) 1985-04-20
FR2313775A1 (fr) 1976-12-31
US4096348A (en) 1978-06-20
JPS5850024B2 (ja) 1983-11-08
DE2625383C2 (de) 1985-02-21
US3984620A (en) 1976-10-05
JPS51148358A (en) 1976-12-20
CA1068829A (fr) 1979-12-25
GB1492015A (en) 1977-11-16

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