JPS5474674A - Method of connecting semiconductor - Google Patents

Method of connecting semiconductor

Info

Publication number
JPS5474674A
JPS5474674A JP14187977A JP14187977A JPS5474674A JP S5474674 A JPS5474674 A JP S5474674A JP 14187977 A JP14187977 A JP 14187977A JP 14187977 A JP14187977 A JP 14187977A JP S5474674 A JPS5474674 A JP S5474674A
Authority
JP
Japan
Prior art keywords
connecting semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14187977A
Other languages
Japanese (ja)
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP14187977A priority Critical patent/JPS5474674A/en
Publication of JPS5474674A publication Critical patent/JPS5474674A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP14187977A 1977-11-26 1977-11-26 Method of connecting semiconductor Pending JPS5474674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14187977A JPS5474674A (en) 1977-11-26 1977-11-26 Method of connecting semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14187977A JPS5474674A (en) 1977-11-26 1977-11-26 Method of connecting semiconductor

Publications (1)

Publication Number Publication Date
JPS5474674A true JPS5474674A (en) 1979-06-14

Family

ID=15302278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14187977A Pending JPS5474674A (en) 1977-11-26 1977-11-26 Method of connecting semiconductor

Country Status (1)

Country Link
JP (1) JPS5474674A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148358A (en) * 1975-06-04 1976-12-20 Raytheon Co Integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148358A (en) * 1975-06-04 1976-12-20 Raytheon Co Integrated circuit

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