FR2311404A1 - Procede destine a constituer des revetements sur des dispositifs semi-conducteurs de circuit integre - Google Patents

Procede destine a constituer des revetements sur des dispositifs semi-conducteurs de circuit integre

Info

Publication number
FR2311404A1
FR2311404A1 FR7614041A FR7614041A FR2311404A1 FR 2311404 A1 FR2311404 A1 FR 2311404A1 FR 7614041 A FR7614041 A FR 7614041A FR 7614041 A FR7614041 A FR 7614041A FR 2311404 A1 FR2311404 A1 FR 2311404A1
Authority
FR
France
Prior art keywords
integrated circuits
semiconductor devices
coatings
constituting
silicon dioxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7614041A
Other languages
English (en)
French (fr)
Other versions
FR2311404B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR Voyix Corp
National Cash Register Co
Original Assignee
NCR Corp
National Cash Register Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR Corp, National Cash Register Co filed Critical NCR Corp
Publication of FR2311404A1 publication Critical patent/FR2311404A1/fr
Application granted granted Critical
Publication of FR2311404B1 publication Critical patent/FR2311404B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H10P14/6334—
    • H10P14/6682—
    • H10P14/69215—
    • H10P95/00—
    • H10W74/131—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07533—
    • H10W72/076—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
FR7614041A 1975-05-12 1976-05-11 Procede destine a constituer des revetements sur des dispositifs semi-conducteurs de circuit integre Granted FR2311404A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/576,517 US4041896A (en) 1975-05-12 1975-05-12 Microelectronic circuit coating system

Publications (2)

Publication Number Publication Date
FR2311404A1 true FR2311404A1 (fr) 1976-12-10
FR2311404B1 FR2311404B1 (enExample) 1979-03-02

Family

ID=24304755

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7614041A Granted FR2311404A1 (fr) 1975-05-12 1976-05-11 Procede destine a constituer des revetements sur des dispositifs semi-conducteurs de circuit integre

Country Status (8)

Country Link
US (1) US4041896A (enExample)
JP (1) JPS51135471A (enExample)
CA (1) CA1059648A (enExample)
DE (1) DE2620707C3 (enExample)
FR (1) FR2311404A1 (enExample)
GB (1) GB1519251A (enExample)
IT (1) IT1060415B (enExample)
NL (1) NL7604980A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401053A (en) * 1981-07-17 1983-08-30 Riley Thomas J Coating fixture

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1518843A (fr) * 1967-02-13 1968-03-29 Radiotechnique Coprim Rtc Dispositif pour le dépôt de couches minces sur des supports semi-conducteurs

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2704992A (en) * 1951-12-28 1955-03-29 Erie Resistor Corp Gas plating apparatus
US2879188A (en) * 1956-03-05 1959-03-24 Westinghouse Electric Corp Processes for making transistors
US3117025A (en) * 1961-08-31 1964-01-07 Space Technology Lab Inc Thin filming apparatus
BE623233A (enExample) * 1961-10-12 1900-01-01
US3207126A (en) * 1961-11-14 1965-09-21 Byron Ernest Mask changer means for vacuum deposition device
US3312572A (en) * 1963-06-07 1967-04-04 Barnes Eng Co Process of preparing thin film semiconductor thermistor bolometers and articles
US3276423A (en) * 1963-10-04 1966-10-04 David P Triller Pattern mask for use in making thin film circuitry
US3465209A (en) * 1966-07-07 1969-09-02 Rca Corp Semiconductor devices and methods of manufacture thereof
US3597834A (en) * 1968-02-14 1971-08-10 Texas Instruments Inc Method in forming electrically continuous circuit through insulating layer
US3621812A (en) * 1969-06-18 1971-11-23 Texas Instruments Inc Epitaxial deposition reactor
US3647533A (en) * 1969-08-08 1972-03-07 Us Navy Substrate bonding bumps for large scale arrays
US3785046A (en) * 1970-03-06 1974-01-15 Hull Corp Thin film coils and method and apparatus for making the same
US3678892A (en) * 1970-05-19 1972-07-25 Western Electric Co Pallet and mask for substrates

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1518843A (fr) * 1967-02-13 1968-03-29 Radiotechnique Coprim Rtc Dispositif pour le dépôt de couches minces sur des supports semi-conducteurs

Also Published As

Publication number Publication date
IT1060415B (it) 1982-08-20
FR2311404B1 (enExample) 1979-03-02
US4041896A (en) 1977-08-16
DE2620707C3 (de) 1979-05-23
DE2620707B2 (de) 1978-09-21
JPS51135471A (en) 1976-11-24
NL7604980A (nl) 1976-11-16
CA1059648A (en) 1979-07-31
DE2620707A1 (de) 1976-11-18
GB1519251A (en) 1978-07-26

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Legal Events

Date Code Title Description
ST Notification of lapse