FR2307438A1 - Procede de fabrication de circuits imprimes avec connexions traversantes - Google Patents

Procede de fabrication de circuits imprimes avec connexions traversantes

Info

Publication number
FR2307438A1
FR2307438A1 FR7609940A FR7609940A FR2307438A1 FR 2307438 A1 FR2307438 A1 FR 2307438A1 FR 7609940 A FR7609940 A FR 7609940A FR 7609940 A FR7609940 A FR 7609940A FR 2307438 A1 FR2307438 A1 FR 2307438A1
Authority
FR
France
Prior art keywords
sheets
starting
thin layers
holes
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7609940A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2307438A1 publication Critical patent/FR2307438A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7609940A 1975-04-10 1976-04-06 Procede de fabrication de circuits imprimes avec connexions traversantes Withdrawn FR2307438A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752515706 DE2515706A1 (de) 1975-04-10 1975-04-10 Verfahren zur herstellung von durchkontaktierten gedruckten schaltungen

Publications (1)

Publication Number Publication Date
FR2307438A1 true FR2307438A1 (fr) 1976-11-05

Family

ID=5943524

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7609940A Withdrawn FR2307438A1 (fr) 1975-04-10 1976-04-06 Procede de fabrication de circuits imprimes avec connexions traversantes

Country Status (8)

Country Link
JP (1) JPS51122770A (sv)
AU (1) AU1179976A (sv)
BE (1) BE840598A (sv)
DE (1) DE2515706A1 (sv)
FR (1) FR2307438A1 (sv)
IT (1) IT1059604B (sv)
NL (1) NL7602277A (sv)
SE (1) SE7601776L (sv)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (fr) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Plaquette de circuit imprime souple
EP0127691A1 (de) * 1983-06-01 1984-12-12 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen mit einer Leiterzugebene
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (de) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Verfahren zum Herstellen von Leiterplatten mit Durchkontaktierungen
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3121131C2 (de) * 1981-05-27 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten mit metallischen Durchkontaktierungen
DE3576900D1 (de) * 1985-12-30 1990-05-03 Ibm Deutschland Verfahren zum herstellen von gedruckten schaltungen.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (fr) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Plaquette de circuit imprime souple
EP0127691A1 (de) * 1983-06-01 1984-12-12 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen mit einer Leiterzugebene
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (de) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Verfahren zum Herstellen von Leiterplatten mit Durchkontaktierungen
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Also Published As

Publication number Publication date
IT1059604B (it) 1982-06-21
AU1179976A (en) 1977-09-15
BE840598A (fr) 1976-08-02
NL7602277A (nl) 1976-10-12
DE2515706A1 (de) 1976-10-21
JPS51122770A (en) 1976-10-27
SE7601776L (sv) 1976-10-11

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Legal Events

Date Code Title Description
ST Notification of lapse