FR2307438A1 - Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers - Google Patents

Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers

Info

Publication number
FR2307438A1
FR2307438A1 FR7609940A FR7609940A FR2307438A1 FR 2307438 A1 FR2307438 A1 FR 2307438A1 FR 7609940 A FR7609940 A FR 7609940A FR 7609940 A FR7609940 A FR 7609940A FR 2307438 A1 FR2307438 A1 FR 2307438A1
Authority
FR
France
Prior art keywords
sheets
starting
thin layers
holes
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7609940A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2307438A1 publication Critical patent/FR2307438A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377Protective layers
    • H05K2203/1388Temporary protective conductive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/062Etching masks consisting of metals or alloys or metallic inorganic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

In the fabrication of printed circuits with transverse connection by starting with a plate coated on both faces with sheets of Cu forming thin layers and with mechanically strippable protective sheets, then piercing holes to form the transverse connexions before tearing away the protective sheets, (a) a plate is used, the protection sheets of which can resist pre-treatment and metallising baths used to give chemical and electrolytic copper deposition, (b) after piercing the holes, the walls of these are copper plated in such a way that the protection sheets are subsequently torn away, (c) the desired conductor trace and the walls of the holes are reinforced by selective electro-deposition of Cu while making use of protection coatings and (d) the non-reinforced zones of the thin copper sheets are destroyed by etching. Enables thin layers of Cu to be used for the conductors which was not possible by the known techniques.
FR7609940A 1975-04-10 1976-04-06 Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers Withdrawn FR2307438A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752515706 DE2515706A1 (en) 1975-04-10 1975-04-10 METHOD OF MANUFACTURING THROUGH-CONTACT PRINTED CIRCUITS

Publications (1)

Publication Number Publication Date
FR2307438A1 true FR2307438A1 (en) 1976-11-05

Family

ID=5943524

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7609940A Withdrawn FR2307438A1 (en) 1975-04-10 1976-04-06 Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers

Country Status (8)

Country Link
JP (1) JPS51122770A (en)
AU (1) AU1179976A (en)
BE (1) BE840598A (en)
DE (1) DE2515706A1 (en)
FR (1) FR2307438A1 (en)
IT (1) IT1059604B (en)
NL (1) NL7602277A (en)
SE (1) SE7601776L (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (en) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face
EP0127691A1 (en) * 1983-06-01 1984-12-12 Ibm Deutschland Gmbh Production method of printed circuits with one conductive layer
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3121131C2 (en) * 1981-05-27 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Process for the production of circuit boards provided with conductor tracks with metallic vias
EP0227857B1 (en) * 1985-12-30 1990-03-28 Ibm Deutschland Gmbh Process for making printed circuits

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (en) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face
EP0127691A1 (en) * 1983-06-01 1984-12-12 Ibm Deutschland Gmbh Production method of printed circuits with one conductive layer
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Also Published As

Publication number Publication date
NL7602277A (en) 1976-10-12
AU1179976A (en) 1977-09-15
IT1059604B (en) 1982-06-21
DE2515706A1 (en) 1976-10-21
BE840598A (en) 1976-08-02
JPS51122770A (en) 1976-10-27
SE7601776L (en) 1976-10-11

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Legal Events

Date Code Title Description
ST Notification of lapse