FR2307438A1 - Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers - Google Patents
Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layersInfo
- Publication number
- FR2307438A1 FR2307438A1 FR7609940A FR7609940A FR2307438A1 FR 2307438 A1 FR2307438 A1 FR 2307438A1 FR 7609940 A FR7609940 A FR 7609940A FR 7609940 A FR7609940 A FR 7609940A FR 2307438 A1 FR2307438 A1 FR 2307438A1
- Authority
- FR
- France
- Prior art keywords
- sheets
- starting
- thin layers
- holes
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1388—Temporary protective conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
In the fabrication of printed circuits with transverse connection by starting with a plate coated on both faces with sheets of Cu forming thin layers and with mechanically strippable protective sheets, then piercing holes to form the transverse connexions before tearing away the protective sheets, (a) a plate is used, the protection sheets of which can resist pre-treatment and metallising baths used to give chemical and electrolytic copper deposition, (b) after piercing the holes, the walls of these are copper plated in such a way that the protection sheets are subsequently torn away, (c) the desired conductor trace and the walls of the holes are reinforced by selective electro-deposition of Cu while making use of protection coatings and (d) the non-reinforced zones of the thin copper sheets are destroyed by etching. Enables thin layers of Cu to be used for the conductors which was not possible by the known techniques.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752515706 DE2515706A1 (en) | 1975-04-10 | 1975-04-10 | METHOD OF MANUFACTURING THROUGH-CONTACT PRINTED CIRCUITS |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2307438A1 true FR2307438A1 (en) | 1976-11-05 |
Family
ID=5943524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7609940A Withdrawn FR2307438A1 (en) | 1975-04-10 | 1976-04-06 | Printed circuits with conducting transverse bores - starting with thin copper sheets as thin layers |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS51122770A (en) |
AU (1) | AU1179976A (en) |
BE (1) | BE840598A (en) |
DE (1) | DE2515706A1 (en) |
FR (1) | FR2307438A1 (en) |
IT (1) | IT1059604B (en) |
NL (1) | NL7602277A (en) |
SE (1) | SE7601776L (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2450030A1 (en) * | 1979-02-20 | 1980-09-19 | Fuji Photo Optical Co Ltd | Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face |
EP0127691A1 (en) * | 1983-06-01 | 1984-12-12 | Ibm Deutschland Gmbh | Production method of printed circuits with one conductive layer |
US4704791A (en) * | 1986-03-05 | 1987-11-10 | International Business Machines Corporation | Process for providing a landless through-hole connection |
EP0865231A1 (en) * | 1997-03-14 | 1998-09-16 | Photo Print Electronic GmbH | Method for producing printed circuit boards with through-platings |
US6272745B1 (en) | 1997-03-14 | 2001-08-14 | Photo Print Electronics Gmbh | Methods for the production of printed circuit boards with through-platings |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3121131C2 (en) * | 1981-05-27 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Process for the production of circuit boards provided with conductor tracks with metallic vias |
EP0227857B1 (en) * | 1985-12-30 | 1990-03-28 | Ibm Deutschland Gmbh | Process for making printed circuits |
-
1975
- 1975-04-10 DE DE19752515706 patent/DE2515706A1/en active Pending
-
1976
- 1976-02-17 SE SE7601776A patent/SE7601776L/en unknown
- 1976-03-04 NL NL7602277A patent/NL7602277A/en unknown
- 1976-03-09 AU AU11799/76A patent/AU1179976A/en not_active Expired
- 1976-04-06 FR FR7609940A patent/FR2307438A1/en not_active Withdrawn
- 1976-04-07 JP JP51039148A patent/JPS51122770A/en active Pending
- 1976-04-07 IT IT22003/76A patent/IT1059604B/en active
- 1976-04-09 BE BE166027A patent/BE840598A/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2450030A1 (en) * | 1979-02-20 | 1980-09-19 | Fuji Photo Optical Co Ltd | Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face |
EP0127691A1 (en) * | 1983-06-01 | 1984-12-12 | Ibm Deutschland Gmbh | Production method of printed circuits with one conductive layer |
US4704791A (en) * | 1986-03-05 | 1987-11-10 | International Business Machines Corporation | Process for providing a landless through-hole connection |
EP0865231A1 (en) * | 1997-03-14 | 1998-09-16 | Photo Print Electronic GmbH | Method for producing printed circuit boards with through-platings |
US6272745B1 (en) | 1997-03-14 | 2001-08-14 | Photo Print Electronics Gmbh | Methods for the production of printed circuit boards with through-platings |
Also Published As
Publication number | Publication date |
---|---|
NL7602277A (en) | 1976-10-12 |
AU1179976A (en) | 1977-09-15 |
IT1059604B (en) | 1982-06-21 |
DE2515706A1 (en) | 1976-10-21 |
BE840598A (en) | 1976-08-02 |
JPS51122770A (en) | 1976-10-27 |
SE7601776L (en) | 1976-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |