BE840598A - METHOD OF MANUFACTURING PRINTED CIRCUITS WITH THROUGH-THROUGH CONNECTIONS - Google Patents

METHOD OF MANUFACTURING PRINTED CIRCUITS WITH THROUGH-THROUGH CONNECTIONS

Info

Publication number
BE840598A
BE840598A BE166027A BE166027A BE840598A BE 840598 A BE840598 A BE 840598A BE 166027 A BE166027 A BE 166027A BE 166027 A BE166027 A BE 166027A BE 840598 A BE840598 A BE 840598A
Authority
BE
Belgium
Prior art keywords
connections
printed circuits
manufacturing printed
manufacturing
circuits
Prior art date
Application number
BE166027A
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE840598A publication Critical patent/BE840598A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
BE166027A 1975-04-10 1976-04-09 METHOD OF MANUFACTURING PRINTED CIRCUITS WITH THROUGH-THROUGH CONNECTIONS BE840598A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752515706 DE2515706A1 (en) 1975-04-10 1975-04-10 METHOD OF MANUFACTURING THROUGH-CONTACT PRINTED CIRCUITS

Publications (1)

Publication Number Publication Date
BE840598A true BE840598A (en) 1976-08-02

Family

ID=5943524

Family Applications (1)

Application Number Title Priority Date Filing Date
BE166027A BE840598A (en) 1975-04-10 1976-04-09 METHOD OF MANUFACTURING PRINTED CIRCUITS WITH THROUGH-THROUGH CONNECTIONS

Country Status (8)

Country Link
JP (1) JPS51122770A (en)
AU (1) AU1179976A (en)
BE (1) BE840598A (en)
DE (1) DE2515706A1 (en)
FR (1) FR2307438A1 (en)
IT (1) IT1059604B (en)
NL (1) NL7602277A (en)
SE (1) SE7601776L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (en) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face
DE3121131C2 (en) * 1981-05-27 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Process for the production of circuit boards provided with conductor tracks with metallic vias
EP0127691B1 (en) * 1983-06-01 1987-05-13 Ibm Deutschland Gmbh Production method of printed circuits with one conductive layer
DE3576900D1 (en) * 1985-12-30 1990-05-03 Ibm Deutschland METHOD FOR PRODUCING PRINTED CIRCUITS.
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Also Published As

Publication number Publication date
JPS51122770A (en) 1976-10-27
NL7602277A (en) 1976-10-12
DE2515706A1 (en) 1976-10-21
AU1179976A (en) 1977-09-15
IT1059604B (en) 1982-06-21
SE7601776L (en) 1976-10-11
FR2307438A1 (en) 1976-11-05

Similar Documents

Publication Publication Date Title
BE878667A (en) INTEGRATED CIRCUIT PRODUCTION PROCESS
BE833858A (en) PRINTED CIRCUIT MANUFACTURING PROCESS AND OBTAINED CIRCUIT
FR2332677A1 (en) PRINTED CIRCUIT BOARD MANUFACTURING PROCESS
BE857659A (en) DRAGEES MANUFACTURING PROCESS
BE842555A (en) FLEXIBLE PRINTED CIRCUIT AND PROCESS FOR ITS MANUFACTURING
BE845154A (en) METHOD OF MANUFACTURING A SEMICONDUCTOR MEMORY
BE838332R (en) PROCESS FOR MANUFACTURING AN AMUSE-GEULE SUCCEDANE
BE877350A (en) CIRCUIT BOARD AND ITS MANUFACTURING PROCESS
FR2316730A1 (en) INTEGRATED LOGIC CIRCUIT AND ITS MANUFACTURING PROCESS
FR2310641A1 (en) METHOD OF MANUFACTURING AN ELECTRICAL CONNECTOR
FR2326779A1 (en) INTEGRATED CIRCUITS MANUFACTURING PROCESS
FR2300105A1 (en) F-PANEL MANUFACTURING PROCESS
BE840598A (en) METHOD OF MANUFACTURING PRINTED CIRCUITS WITH THROUGH-THROUGH CONNECTIONS
FR2315973A1 (en) ANTI-FOAM COMPOSITIONS MANUFACTURING PROCESS
BE867705A (en) COPPER MANUFACTURING PROCESS
FR2339955A1 (en) MANUFACTURING PROCESS OF AN INTEGRATED CIRCUIT
BE836866A (en) PROCESS FOR MANUFACTURING PRINTED CIRCUITS AND PRINTED CIRCUITS MANUFACTURED FOLLOWING THIS PROCESS
JPS52110498A (en) Method of manufacturing thckkfilm circuit
FR2301378A1 (en) ELE MANUFACTURING PROCESS
BE838893A (en) CYCLOHEXANONEXIME MANUFACTURING PROCESS
FR2325657A1 (en) CHLOROPHOSPHITES MANUFACTURING PROCESS
JPS55130197A (en) Method of fabricating printed circuit board
BE857381A (en) METHOD OF MANUFACTURING AN ELONGATED COPPER BODY
FR2346077A1 (en) MANUFACTURING PROCESS OF MOLDED METAL PARTS
FR2352472A1 (en) METHOD OF MANUFACTURING A CONNECTION PANEL, ESPECIALLY OF THE PRINTED CIRCUIT TYPE