NL7602277A - PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS WITH CONTINUOUS CONTACTS. - Google Patents

PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS WITH CONTINUOUS CONTACTS.

Info

Publication number
NL7602277A
NL7602277A NL7602277A NL7602277A NL7602277A NL 7602277 A NL7602277 A NL 7602277A NL 7602277 A NL7602277 A NL 7602277A NL 7602277 A NL7602277 A NL 7602277A NL 7602277 A NL7602277 A NL 7602277A
Authority
NL
Netherlands
Prior art keywords
procedure
manufacture
printed circuits
continuous contacts
contacts
Prior art date
Application number
NL7602277A
Other languages
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL7602277A publication Critical patent/NL7602277A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
NL7602277A 1975-04-10 1976-03-04 PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS WITH CONTINUOUS CONTACTS. NL7602277A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752515706 DE2515706A1 (en) 1975-04-10 1975-04-10 METHOD OF MANUFACTURING THROUGH-CONTACT PRINTED CIRCUITS

Publications (1)

Publication Number Publication Date
NL7602277A true NL7602277A (en) 1976-10-12

Family

ID=5943524

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7602277A NL7602277A (en) 1975-04-10 1976-03-04 PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS WITH CONTINUOUS CONTACTS.

Country Status (8)

Country Link
JP (1) JPS51122770A (en)
AU (1) AU1179976A (en)
BE (1) BE840598A (en)
DE (1) DE2515706A1 (en)
FR (1) FR2307438A1 (en)
IT (1) IT1059604B (en)
NL (1) NL7602277A (en)
SE (1) SE7601776L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2450030A1 (en) * 1979-02-20 1980-09-19 Fuji Photo Optical Co Ltd Flexible printed circuit board - has component mounting holes internally covered with conductive layer which extends onto circuit board face
DE3121131C2 (en) * 1981-05-27 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Process for the production of circuit boards provided with conductor tracks with metallic vias
DE3371592D1 (en) * 1983-06-01 1987-06-19 Ibm Deutschland Production method of printed circuits with one conductive layer
DE3576900D1 (en) * 1985-12-30 1990-05-03 Ibm Deutschland METHOD FOR PRODUCING PRINTED CIRCUITS.
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
EP0865231A1 (en) * 1997-03-14 1998-09-16 Photo Print Electronic GmbH Method for producing printed circuit boards with through-platings
US6272745B1 (en) 1997-03-14 2001-08-14 Photo Print Electronics Gmbh Methods for the production of printed circuit boards with through-platings

Also Published As

Publication number Publication date
AU1179976A (en) 1977-09-15
FR2307438A1 (en) 1976-11-05
JPS51122770A (en) 1976-10-27
BE840598A (en) 1976-08-02
IT1059604B (en) 1982-06-21
SE7601776L (en) 1976-10-11
DE2515706A1 (en) 1976-10-21

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