NL7514723A - PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS AND A PRINTED CIRCUIT MADE UNDER APPLICATION OF THIS PROCEDURE. - Google Patents

PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS AND A PRINTED CIRCUIT MADE UNDER APPLICATION OF THIS PROCEDURE.

Info

Publication number
NL7514723A
NL7514723A NL7514723A NL7514723A NL7514723A NL 7514723 A NL7514723 A NL 7514723A NL 7514723 A NL7514723 A NL 7514723A NL 7514723 A NL7514723 A NL 7514723A NL 7514723 A NL7514723 A NL 7514723A
Authority
NL
Netherlands
Prior art keywords
procedure
manufacture
made under
under application
circuit made
Prior art date
Application number
NL7514723A
Other languages
Dutch (nl)
Original Assignee
Vockenhuber Karl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vockenhuber Karl filed Critical Vockenhuber Karl
Publication of NL7514723A publication Critical patent/NL7514723A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
NL7514723A 1974-12-19 1975-12-17 PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS AND A PRINTED CIRCUIT MADE UNDER APPLICATION OF THIS PROCEDURE. NL7514723A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (en) 1974-12-19 1974-12-19 METHOD OF MANUFACTURING PRINTED CIRCUITS

Publications (1)

Publication Number Publication Date
NL7514723A true NL7514723A (en) 1976-06-22

Family

ID=3620430

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7514723A NL7514723A (en) 1974-12-19 1975-12-17 PROCEDURE FOR THE MANUFACTURE OF PRINTED CIRCUITS AND A PRINTED CIRCUIT MADE UNDER APPLICATION OF THIS PROCEDURE.

Country Status (7)

Country Link
AT (1) ATA1017674A (en)
BE (1) BE836866A (en)
DE (1) DE2556826A1 (en)
FR (1) FR2295678A1 (en)
IT (1) IT1068815B (en)
NL (1) NL7514723A (en)
SE (1) SE7514432L (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3663433D1 (en) * 1985-03-14 1989-06-22 Toshiba Kk Printed circuit board and method of manufacturing the same
GB8602330D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
GB2255676B (en) * 1991-05-08 1995-09-27 Fuji Electric Co Ltd Metallic printed board
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
WO2005011345A1 (en) * 2003-07-17 2005-02-03 Ksg Leiterplatten Gmbh Layer assembly for a supporting part, which can be fitted with electronic components, and method for the production thereof
DE10339692A1 (en) * 2003-08-28 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Heat sink with electrically-insulating, thermally-conductive layer on which semiconductor components are mounted, comprises metallic body with surface-oxidation
DE102005002508B4 (en) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Printed circuit board with oxidation layer
DE102004058335A1 (en) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. substratum
WO2007140495A2 (en) * 2006-06-07 2007-12-13 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Method for manufacturing a circuit carrier
DE102011108198A1 (en) * 2011-07-22 2012-03-29 Fela Holding Gmbh Circuit board used for mounting electrical component e.g. LUXEON Rebel LED, has strip guard that is located on anodized coat that is arranged on top face of metal core

Also Published As

Publication number Publication date
IT1068815B (en) 1985-03-21
BE836866A (en) 1976-04-16
ATA1017674A (en) 1976-06-15
SE7514432L (en) 1976-06-21
DE2556826A1 (en) 1976-06-24
FR2295678A1 (en) 1976-07-16

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