NL7505288A - PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT AND PRINTED CIRCUIT MADE IN ACCORDANCE WITH THIS PROCESS. - Google Patents

PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT AND PRINTED CIRCUIT MADE IN ACCORDANCE WITH THIS PROCESS.

Info

Publication number
NL7505288A
NL7505288A NL7505288A NL7505288A NL7505288A NL 7505288 A NL7505288 A NL 7505288A NL 7505288 A NL7505288 A NL 7505288A NL 7505288 A NL7505288 A NL 7505288A NL 7505288 A NL7505288 A NL 7505288A
Authority
NL
Netherlands
Prior art keywords
printed circuit
procedure
accordance
manufacturing
circuit made
Prior art date
Application number
NL7505288A
Other languages
Dutch (nl)
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of NL7505288A publication Critical patent/NL7505288A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
NL7505288A 1974-05-16 1975-05-06 PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT AND PRINTED CIRCUIT MADE IN ACCORDANCE WITH THIS PROCESS. NL7505288A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47034974A 1974-05-16 1974-05-16

Publications (1)

Publication Number Publication Date
NL7505288A true NL7505288A (en) 1975-11-18

Family

ID=23867259

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7505288A NL7505288A (en) 1974-05-16 1975-05-06 PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT AND PRINTED CIRCUIT MADE IN ACCORDANCE WITH THIS PROCESS.

Country Status (7)

Country Link
JP (1) JPS50160774A (en)
CA (1) CA1011002A (en)
DE (1) DE2522006A1 (en)
FR (1) FR2271739B1 (en)
GB (1) GB1476888A (en)
IT (1) IT1035743B (en)
NL (1) NL7505288A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
EP0095256B1 (en) * 1982-05-21 1986-03-26 Hewlett-Packard Company Method of making printed circuits
JP2753746B2 (en) * 1989-11-06 1998-05-20 日本メクトロン株式会社 Flexible circuit board for mounting IC and method of manufacturing the same
US5506059A (en) * 1993-05-14 1996-04-09 Minnesota Mining And Manufacturing Company Metallic films and articles using same
TW512467B (en) * 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
JP3643743B2 (en) * 2000-01-28 2005-04-27 三洋電機株式会社 Mounting board
JP2002337268A (en) * 2001-05-21 2002-11-27 Nitto Denko Corp Metal foil laminate and its manufacturing method
JP2003078244A (en) 2001-06-18 2003-03-14 Nitto Denko Corp Multilayer wiring substrate and method of manufacturing the same

Also Published As

Publication number Publication date
CA1011002A (en) 1977-05-24
JPS50160774A (en) 1975-12-26
DE2522006A1 (en) 1975-11-27
GB1476888A (en) 1977-06-16
FR2271739B1 (en) 1980-08-22
FR2271739A1 (en) 1975-12-12
IT1035743B (en) 1979-10-20

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Legal Events

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BV The patent application has lapsed