SE7514432L - WAY TO MAKE CIRCUIT CARDS - Google Patents

WAY TO MAKE CIRCUIT CARDS

Info

Publication number
SE7514432L
SE7514432L SE7514432A SE7514432A SE7514432L SE 7514432 L SE7514432 L SE 7514432L SE 7514432 A SE7514432 A SE 7514432A SE 7514432 A SE7514432 A SE 7514432A SE 7514432 L SE7514432 L SE 7514432L
Authority
SE
Sweden
Prior art keywords
way
circuit cards
make circuit
make
cards
Prior art date
Application number
SE7514432A
Other languages
Swedish (sv)
Inventor
P Blaha
J Drasch
Original Assignee
Vockenhuber Karl
Hauser Raimund
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vockenhuber Karl, Hauser Raimund filed Critical Vockenhuber Karl
Publication of SE7514432L publication Critical patent/SE7514432L/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
SE7514432A 1974-12-19 1975-12-19 WAY TO MAKE CIRCUIT CARDS SE7514432L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (en) 1974-12-19 1974-12-19 METHOD OF MANUFACTURING PRINTED CIRCUITS

Publications (1)

Publication Number Publication Date
SE7514432L true SE7514432L (en) 1976-06-21

Family

ID=3620430

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7514432A SE7514432L (en) 1974-12-19 1975-12-19 WAY TO MAKE CIRCUIT CARDS

Country Status (7)

Country Link
AT (1) ATA1017674A (en)
BE (1) BE836866A (en)
DE (1) DE2556826A1 (en)
FR (1) FR2295678A1 (en)
IT (1) IT1068815B (en)
NL (1) NL7514723A (en)
SE (1) SE7514432L (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3663433D1 (en) * 1985-03-14 1989-06-22 Toshiba Kk Printed circuit board and method of manufacturing the same
GB8602330D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
US5316831A (en) * 1991-05-08 1994-05-31 Fuji Electric Co., Ltd. Metallic printed board
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
DE112004001263D2 (en) * 2003-07-17 2006-03-23 Ksg Leiterplatten Gmbh Layer arrangement for a mountable with electronic components carrier component and method for manufacturing
DE10339692A1 (en) * 2003-08-28 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Heat sink with electrically-insulating, thermally-conductive layer on which semiconductor components are mounted, comprises metallic body with surface-oxidation
DE102005002508B4 (en) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Printed circuit board with oxidation layer
DE102004058335A1 (en) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. substratum
EP2025209B1 (en) * 2006-06-07 2013-03-27 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Method for manufacturing a circuit carrier
DE102011108198A1 (en) * 2011-07-22 2012-03-29 Fela Holding Gmbh Circuit board used for mounting electrical component e.g. LUXEON Rebel LED, has strip guard that is located on anodized coat that is arranged on top face of metal core

Also Published As

Publication number Publication date
ATA1017674A (en) 1976-06-15
DE2556826A1 (en) 1976-06-24
FR2295678A1 (en) 1976-07-16
NL7514723A (en) 1976-06-22
IT1068815B (en) 1985-03-21
BE836866A (en) 1976-04-16

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