FR2296854B1 - - Google Patents

Info

Publication number
FR2296854B1
FR2296854B1 FR7533879A FR7533879A FR2296854B1 FR 2296854 B1 FR2296854 B1 FR 2296854B1 FR 7533879 A FR7533879 A FR 7533879A FR 7533879 A FR7533879 A FR 7533879A FR 2296854 B1 FR2296854 B1 FR 2296854B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7533879A
Other versions
FR2296854A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2296854A1 publication Critical patent/FR2296854A1/fr
Application granted granted Critical
Publication of FR2296854B1 publication Critical patent/FR2296854B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
FR7533879A 1974-12-30 1975-10-29 Systeme d'essai electronique et transformateur d'espacement destine a etre utilise dans ce systeme. Granted FR2296854A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/537,514 US4038599A (en) 1974-12-30 1974-12-30 High density wafer contacting and test system

Publications (2)

Publication Number Publication Date
FR2296854A1 FR2296854A1 (fr) 1976-07-30
FR2296854B1 true FR2296854B1 (fr) 1978-05-12

Family

ID=24142962

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7533879A Granted FR2296854A1 (fr) 1974-12-30 1975-10-29 Systeme d'essai electronique et transformateur d'espacement destine a etre utilise dans ce systeme.

Country Status (7)

Country Link
US (1) US4038599A (fr)
JP (1) JPS5423226B2 (fr)
CA (1) CA1041225A (fr)
DE (1) DE2557621C2 (fr)
FR (1) FR2296854A1 (fr)
GB (1) GB1498719A (fr)
IT (1) IT1049489B (fr)

Families Citing this family (152)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4204114A (en) * 1978-02-24 1980-05-20 Gould Inc. Method and apparatus for comparing logic functions by acquiring signals one at a time from circuit nodes
US4357575A (en) * 1980-06-17 1982-11-02 Dit-Mco International Corporation Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies
US4528500A (en) * 1980-11-25 1985-07-09 Lightbody James D Apparatus and method for testing circuit boards
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4406373A (en) * 1981-08-03 1983-09-27 Palomar Systems & Machines, Inc. Means and method for testing and sorting miniature electronic units
JPS58210631A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 電子ビ−ムを用いたｉｃテスタ
DE3223664A1 (de) * 1982-06-24 1983-12-29 Siemens AG, 1000 Berlin und 8000 München Messanordnung fuer duenne schichten und duennschichtbauelemente auf scheibenfoermigen substraten
US4476433A (en) * 1982-09-07 1984-10-09 Logan John K Electronic test fixture
JPS59143340A (ja) * 1983-02-05 1984-08-16 Rohm Co Ltd プロ−ブカ−ド
US4565966A (en) * 1983-03-07 1986-01-21 Kollmorgen Technologies Corporation Method and apparatus for testing of electrical interconnection networks
US4567432A (en) * 1983-06-09 1986-01-28 Texas Instruments Incorporated Apparatus for testing integrated circuits
US4646002A (en) * 1984-05-10 1987-02-24 Regents Of The University Of Minnesota Circuit for high impedance broad band probe
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
US4734046A (en) * 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US4694242A (en) * 1984-10-01 1987-09-15 Motorola Inc. Integrated circuit tester and remote pin electronics therefor
KR930000545B1 (ko) * 1984-10-01 1993-01-25 모토로라 인코포레이티드 집적회로 테스터 및 핀간 인터페이스 제공장치
US4780836A (en) * 1985-08-14 1988-10-25 Kabushiki Kaisha Toshiba Method of testing semiconductor devices using a probe card
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4801869A (en) * 1987-04-27 1989-01-31 International Business Machines Corporation Semiconductor defect monitor for diagnosing processing-induced defects
US4862077A (en) * 1987-04-29 1989-08-29 International Business Machines Corporation Probe card apparatus and method of providing same with reconfigurable probe card circuitry
JPH0429561Y2 (fr) * 1987-08-18 1992-07-17
EP0332560B1 (fr) * 1988-03-11 1994-03-02 International Business Machines Corporation Connecteurs élastomères pour des composants électroniques et pour des tests
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
US5020219A (en) * 1988-05-16 1991-06-04 Leedy Glenn J Method of making a flexible tester surface for testing integrated circuits
US5512397A (en) * 1988-05-16 1996-04-30 Leedy; Glenn J. Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits
US6288561B1 (en) * 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
US5034685A (en) * 1988-05-16 1991-07-23 Leedy Glenn J Test device for testing integrated circuits
DE68917231T2 (de) * 1988-05-18 1994-12-15 Canon Kk Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil.
US5206582A (en) * 1988-05-18 1993-04-27 Hewlett-Packard Company Control system for automated parametric test equipment
DE4012839B4 (de) * 1989-04-26 2004-02-26 Atg Test Systems Gmbh & Co.Kg Verfahren und Prüfvorrichtung zum Prüfen von elektrischen oder elektronischen Prüflingen
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5057772A (en) * 1990-05-29 1991-10-15 Electro Scientific Industries, Inc. Method and system for concurrent electronic component testing and lead verification
US5070297A (en) * 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
US7511520B2 (en) * 1990-08-29 2009-03-31 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5132612A (en) * 1991-03-14 1992-07-21 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for electrostatic discharge (ESD) stress/testing
US5323107A (en) * 1991-04-15 1994-06-21 Hitachi America, Ltd. Active probe card
US5204615A (en) * 1991-10-24 1993-04-20 Interconnect Devices, Inc. Module attachment for printed circuit board test fixtures
JP3135378B2 (ja) * 1992-08-10 2001-02-13 ローム株式会社 半導体試験装置
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5394206A (en) * 1993-06-04 1995-02-28 Eastman Kodak Company Orientation independent, detachable film cartridge, memory module
US5349401A (en) * 1993-06-04 1994-09-20 Eastman Kodak Company Orientation independent, detachable film cartridge, memory module
JPH0720208A (ja) * 1993-07-02 1995-01-24 Mitsubishi Electric Corp 被測定素子のテスト方法及びテストシステム
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
JPH07161426A (ja) * 1993-12-03 1995-06-23 Furukawa Electric Co Ltd:The ベアチップバーンインテスト用ソケット及びその製造方法
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
JP3491700B2 (ja) * 1994-03-18 2004-01-26 富士通株式会社 半導体集積回路装置の試験用キャリア
US5546012A (en) * 1994-04-15 1996-08-13 International Business Machines Corporation Probe card assembly having a ceramic probe card
US5491426A (en) * 1994-06-30 1996-02-13 Vlsi Technology, Inc. Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5600236A (en) * 1994-11-01 1997-02-04 Vlai Technology, Inc. Converter and digital channel selector
JP2876106B2 (ja) * 1995-01-31 1999-03-31 タバイエスペック株式会社 バーンイン用複合体及び複合体使用バーンイン装置
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
JP2811295B2 (ja) * 1995-08-10 1998-10-15 日本電子材料株式会社 垂直型プローブカード
US5597317A (en) * 1995-08-11 1997-01-28 W. L. Gore & Associates, Inc. Surface mating electrical connector
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
EP1468776A3 (fr) * 1996-05-17 2009-11-04 FormFactor, Inc. Fabrication d'éléments d'interconnexion et embouts à substrats sacrificiels
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5757201A (en) * 1996-09-11 1998-05-26 Micron Electronics, Inc. Universal testing device for electronic modules with different configurations and operating parameters
US5898186A (en) 1996-09-13 1999-04-27 Micron Technology, Inc. Reduced terminal testing system
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
EP0860704A3 (fr) * 1997-02-24 2000-01-19 Tokyo Electron Limited Procédé et appareil pour inspecter des circuits intégrés et contacteur incorporé dans l'appareil
US6107816A (en) * 1997-04-30 2000-08-22 Lucent Technologies Inc. Test apparatus for time dependent dielectric breakdown
US6245444B1 (en) 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US6426636B1 (en) 1998-02-11 2002-07-30 International Business Machines Corporation Wafer probe interface arrangement with nonresilient probe elements and support structure
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
JP3553791B2 (ja) * 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
US6130546A (en) * 1998-05-11 2000-10-10 Lsi Logic Corporation Area array (flip chip) probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6404212B1 (en) * 1999-02-18 2002-06-11 St Assembly Test Services Pte Ltd Testing of BGA and other CSP packages using probing techniques
US6419500B1 (en) 1999-03-08 2002-07-16 Kulicke & Soffa Investment, Inc. Probe assembly having floatable buckling beam probes and apparatus for abrading the same
US6255602B1 (en) 1999-03-15 2001-07-03 Wentworth Laboratories, Inc. Multiple layer electrical interface
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP2002082130A (ja) * 2000-09-06 2002-03-22 Hitachi Ltd 半導体素子検査装置及びその製造方法
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6791344B2 (en) * 2000-12-28 2004-09-14 International Business Machines Corporation System for and method of testing a microelectronic device using a dual probe technique
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6998857B2 (en) * 2001-09-20 2006-02-14 Yamaha Corporation Probe unit and its manufacture
US20030150640A1 (en) * 2002-02-14 2003-08-14 Crippen Warren Stuart Silicon space transformer and method of manufacturing same
US6842029B2 (en) 2002-04-11 2005-01-11 Solid State Measurements, Inc. Non-invasive electrical measurement of semiconductor wafers
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2005010052A (ja) * 2003-06-19 2005-01-13 Japan Electronic Materials Corp プローブカード
WO2006017078A2 (fr) 2004-07-07 2006-02-16 Cascade Microtech, Inc. Tete de sondes comportant une sonde a membrane a suspension
TWI351524B (en) * 2003-07-28 2011-11-01 Nextest Systems Corp Apparatus for planarizing a probe card and method
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
US7421258B2 (en) * 2003-10-10 2008-09-02 Rosemount Inc. Compact temperature transmitter with improved lead connections
WO2005065258A2 (fr) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Sonde de tranche a semi-conducteur possedant un circuit actif
US6943573B1 (en) * 2004-03-23 2005-09-13 Texas Instruments Incorporated System and method for site-to-site yield comparison while testing integrated circuit dies
DE102004027886A1 (de) * 2004-05-28 2005-12-22 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US20060066328A1 (en) * 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (fr) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Sonde de signal differentiel active-passive a large bande
US7126361B1 (en) * 2005-08-03 2006-10-24 Qualitau, Inc. Vertical probe card and air cooled probe head system
DE102006054734A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings sowie entsprechendes Verfahren
DE102006054735A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings
DE112007001399T5 (de) 2006-06-09 2009-05-07 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7847568B2 (en) * 2007-08-17 2010-12-07 Advanced Micro Devices, Inc. Multi-site probe
US7888955B2 (en) * 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) * 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
US20090164931A1 (en) * 2007-12-19 2009-06-25 Formfactor, Inc. Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
US8310259B2 (en) 2008-02-01 2012-11-13 International Business Machines Corporation Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) * 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
US8095841B2 (en) * 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
TWI593048B (zh) * 2009-07-21 2017-07-21 尼康股份有限公司 Substrate processing system, substrate holder, substrate holder pair, substrate bonding apparatus, and device manufacturing method
TW201131689A (en) 2009-07-21 2011-09-16 Nikon Corp Substrate holder system, substrate joining apparatus and method for manufacturing a device
TWI428608B (zh) * 2011-09-16 2014-03-01 Mpi Corp 探針測試裝置與其製造方法
US9297846B2 (en) 2012-12-01 2016-03-29 Keysight Technologies, Inc. Continuous broken sense lead detection system
KR101431915B1 (ko) * 2012-12-21 2014-08-26 삼성전기주식회사 예비 공간 변환기 및 이를 이용하여 제조된 공간 변환기, 그리고 상기 공간 변환기를 구비하는 반도체 소자 검사 장치
US9933454B2 (en) * 2014-06-06 2018-04-03 Advantest Corporation Universal test floor system
US9618570B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9638749B2 (en) * 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US9678148B2 (en) 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9618574B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
FR3022638B1 (fr) * 2014-06-24 2016-07-22 Commissariat Energie Atomique Procede de caracterisation d'un dispositif de connexion electrique destine a etre hybride a un dispositif electronique
US11022628B2 (en) * 2019-09-13 2021-06-01 Reid-Ashman Manufacturing, Inc. Probe card support apparatus for automatic test equipment

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3246240A (en) * 1962-05-09 1966-04-12 Ibm System and method for electrical analysis of network interconnections
US3590369A (en) * 1969-02-14 1971-06-29 British Aircraft Corp Ltd Switching means for automatic testing equipment
US3835381A (en) * 1969-02-14 1974-09-10 Tieco Inc Probe card including a multiplicity of probe contacts and methods of making
US3731191A (en) * 1969-12-22 1973-05-01 Ibm Micro-miniature probe assembly
GB1386092A (en) * 1971-04-20 1975-03-05 Plessey Co Ltd Electrical testing apparatus
JPS4840670A (fr) * 1971-09-30 1973-06-14
US3815025A (en) * 1971-10-18 1974-06-04 Ibm Large-scale integrated circuit testing structure
US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes
US3806800A (en) * 1972-12-26 1974-04-23 Ibm Method and apparatus for determining the location of electrically conductive members on a structure
US3849726A (en) * 1974-01-28 1974-11-19 Sperry Rand Corp Universal programmable digital testing interface line
US3963986A (en) * 1975-02-10 1976-06-15 International Business Machines Corporation Programmable interface contactor structure

Also Published As

Publication number Publication date
FR2296854A1 (fr) 1976-07-30
US4038599A (en) 1977-07-26
DE2557621A1 (de) 1976-07-08
IT1049489B (it) 1981-01-20
DE2557621C2 (de) 1986-12-18
JPS5178990A (fr) 1976-07-09
GB1498719A (en) 1978-01-25
CA1041225A (fr) 1978-10-24
JPS5423226B2 (fr) 1979-08-11

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