FR2284981A1 - Procede d'obtention d'un circuit integre semiconducteur - Google Patents

Procede d'obtention d'un circuit integre semiconducteur

Info

Publication number
FR2284981A1
FR2284981A1 FR7430623A FR7430623A FR2284981A1 FR 2284981 A1 FR2284981 A1 FR 2284981A1 FR 7430623 A FR7430623 A FR 7430623A FR 7430623 A FR7430623 A FR 7430623A FR 2284981 A1 FR2284981 A1 FR 2284981A1
Authority
FR
France
Prior art keywords
obtaining
semiconductor circuit
integrated semiconductor
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7430623A
Other languages
English (en)
French (fr)
Other versions
FR2284981B1 (xx
Inventor
Jean-Pierre Rioult
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7430623A priority Critical patent/FR2284981A1/fr
Priority to DE2538264A priority patent/DE2538264C3/de
Priority to CA234,787A priority patent/CA1035470A/en
Priority to NL7510427A priority patent/NL7510427A/xx
Priority to GB36624/75A priority patent/GB1518988A/en
Priority to CH1153875A priority patent/CH591163A5/xx
Priority to IT26982/75A priority patent/IT1042339B/it
Priority to JP50107586A priority patent/JPS5744017B2/ja
Priority to AU84610/75A priority patent/AU495942B2/en
Priority to AT692075A priority patent/AT359562B/de
Priority to SE7509970A priority patent/SE415421B/xx
Publication of FR2284981A1 publication Critical patent/FR2284981A1/fr
Application granted granted Critical
Publication of FR2284981B1 publication Critical patent/FR2284981B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Weting (AREA)
FR7430623A 1974-09-10 1974-09-10 Procede d'obtention d'un circuit integre semiconducteur Granted FR2284981A1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR7430623A FR2284981A1 (fr) 1974-09-10 1974-09-10 Procede d'obtention d'un circuit integre semiconducteur
DE2538264A DE2538264C3 (de) 1974-09-10 1975-08-28 Verfahren zur Herstellung einer planaren integrierten Halbleiteranordnung
NL7510427A NL7510427A (nl) 1974-09-10 1975-09-04 Werkwijze voor het vervaardigen van een geintegreerde halfgeleiderschakeling.
CA234,787A CA1035470A (en) 1974-09-10 1975-09-04 Method of manufacturing an integrated semiconductor circuit
CH1153875A CH591163A5 (xx) 1974-09-10 1975-09-05
IT26982/75A IT1042339B (it) 1974-09-10 1975-09-05 Metodo di fabbricazione di un circutto integrato a semiconduttori
GB36624/75A GB1518988A (en) 1974-09-10 1975-09-05 Integrated circuit
JP50107586A JPS5744017B2 (xx) 1974-09-10 1975-09-06
AU84610/75A AU495942B2 (en) 1975-09-08 Method of manufacturing an integrated semiconductor circuit
AT692075A AT359562B (de) 1974-09-10 1975-09-08 Verfahren zur herstellung einer planaren integrierten halbleiterschaltung
SE7509970A SE415421B (sv) 1974-09-10 1975-09-08 Sett att framstella ett elektriskt isolerande skikt pa en integrerad halvledarkrets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7430623A FR2284981A1 (fr) 1974-09-10 1974-09-10 Procede d'obtention d'un circuit integre semiconducteur

Publications (2)

Publication Number Publication Date
FR2284981A1 true FR2284981A1 (fr) 1976-04-09
FR2284981B1 FR2284981B1 (xx) 1978-11-24

Family

ID=9142928

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7430623A Granted FR2284981A1 (fr) 1974-09-10 1974-09-10 Procede d'obtention d'un circuit integre semiconducteur

Country Status (10)

Country Link
JP (1) JPS5744017B2 (xx)
AT (1) AT359562B (xx)
CA (1) CA1035470A (xx)
CH (1) CH591163A5 (xx)
DE (1) DE2538264C3 (xx)
FR (1) FR2284981A1 (xx)
GB (1) GB1518988A (xx)
IT (1) IT1042339B (xx)
NL (1) NL7510427A (xx)
SE (1) SE415421B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2414792A1 (fr) * 1978-01-17 1979-08-10 Hitachi Ltd Methode de formation d'une interconnexion

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535525A1 (fr) * 1982-10-29 1984-05-04 Western Electric Co Procede de fabrication de circuits integres comportant des couches isolantes minces
JPH053192A (ja) * 1991-10-25 1993-01-08 Matsushita Electron Corp 半導体集積回路

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1531852A (fr) * 1966-07-15 1968-07-05 Itt Procédé de masquage de la surface d'un support
FR2116424A1 (xx) * 1970-12-01 1972-07-13 Siemens Ag
FR2162657A1 (xx) * 1971-12-06 1973-07-20 Tektronix Inc
FR2203175A1 (xx) * 1972-10-16 1974-05-10 Matsushita Electric Ind Co Ltd

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
FR1536321A (fr) * 1966-06-30 1968-08-10 Texas Instruments Inc Contacts ohmiques pour des dispositifs à semi-conducteurs
US3474310A (en) * 1967-02-03 1969-10-21 Hitachi Ltd Semiconductor device having a sulfurtreated silicon compound thereon and a method of making the same
US3442012A (en) * 1967-08-03 1969-05-06 Teledyne Inc Method of forming a flip-chip integrated circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1531852A (fr) * 1966-07-15 1968-07-05 Itt Procédé de masquage de la surface d'un support
FR2116424A1 (xx) * 1970-12-01 1972-07-13 Siemens Ag
FR2162657A1 (xx) * 1971-12-06 1973-07-20 Tektronix Inc
FR2203175A1 (xx) * 1972-10-16 1974-05-10 Matsushita Electric Ind Co Ltd

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE "SOLID STATE TECHNOLOGY", VOLUME 13, NO. 2, FEVRIER 1970 "IMPROVED METHOD OF FABRICATING PLANAR GALLIUM ARSENIDE DIODES" PAGE 12) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2414792A1 (fr) * 1978-01-17 1979-08-10 Hitachi Ltd Methode de formation d'une interconnexion

Also Published As

Publication number Publication date
DE2538264A1 (de) 1976-03-18
IT1042339B (it) 1980-01-30
SE415421B (sv) 1980-09-29
DE2538264C3 (de) 1982-01-14
JPS5153491A (xx) 1976-05-11
CH591163A5 (xx) 1977-09-15
GB1518988A (en) 1978-07-26
AT359562B (de) 1980-11-25
FR2284981B1 (xx) 1978-11-24
JPS5744017B2 (xx) 1982-09-18
DE2538264B2 (de) 1981-04-30
NL7510427A (nl) 1976-03-12
CA1035470A (en) 1978-07-25
ATA692075A (de) 1980-04-15
SE7509970L (sv) 1976-03-11
AU8461075A (en) 1977-03-17

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Legal Events

Date Code Title Description
ST Notification of lapse