FR2282720A1 - Assemblage de supports et de dispositifs semi-conducteurs - Google Patents

Assemblage de supports et de dispositifs semi-conducteurs

Info

Publication number
FR2282720A1
FR2282720A1 FR7521476A FR7521476A FR2282720A1 FR 2282720 A1 FR2282720 A1 FR 2282720A1 FR 7521476 A FR7521476 A FR 7521476A FR 7521476 A FR7521476 A FR 7521476A FR 2282720 A1 FR2282720 A1 FR 2282720A1
Authority
FR
France
Prior art keywords
silicon
substrate
silicon member
bonds
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7521476A
Other languages
English (en)
French (fr)
Other versions
FR2282720B1 (enExample
Inventor
Lawrence V Gregor
Robert G Shepheard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2282720A1 publication Critical patent/FR2282720A1/fr
Application granted granted Critical
Publication of FR2282720B1 publication Critical patent/FR2282720B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7521476A 1974-08-19 1975-07-03 Assemblage de supports et de dispositifs semi-conducteurs Granted FR2282720A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49848774A 1974-08-19 1974-08-19

Publications (2)

Publication Number Publication Date
FR2282720A1 true FR2282720A1 (fr) 1976-03-19
FR2282720B1 FR2282720B1 (enExample) 1977-07-22

Family

ID=23981286

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7521476A Granted FR2282720A1 (fr) 1974-08-19 1975-07-03 Assemblage de supports et de dispositifs semi-conducteurs

Country Status (4)

Country Link
JP (1) JPS5145978A (enExample)
DE (1) DE2536624A1 (enExample)
FR (1) FR2282720A1 (enExample)
GB (1) GB1477544A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2409500A1 (fr) * 1977-11-18 1979-06-15 Philips Nv Transducteur a semiconducteur en boitier

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices
JPS6080264A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体装置
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
KR100232660B1 (ko) * 1995-03-20 1999-12-01 니시무로 타이죠 질화규소 회로기판
EP0766307B1 (en) * 1995-03-20 2007-08-08 Kabushiki Kaisha Toshiba Silicon nitride circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2012333A1 (enExample) * 1968-07-05 1970-03-20 Ibm

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2012333A1 (enExample) * 1968-07-05 1970-03-20 Ibm

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN", VOLUME 10,DECEMBRE 1967 "MONOLITHIC CIRCUIT PACKAGE" R.J.BETZ, PAGE 877) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2409500A1 (fr) * 1977-11-18 1979-06-15 Philips Nv Transducteur a semiconducteur en boitier

Also Published As

Publication number Publication date
GB1477544A (en) 1977-06-22
JPS5145978A (enExample) 1976-04-19
FR2282720B1 (enExample) 1977-07-22
DE2536624A1 (de) 1976-03-04

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Legal Events

Date Code Title Description
ST Notification of lapse