|
US3700788A
(en)
*
|
1971-01-28 |
1972-10-24 |
Coars Porcelain Co |
Electrical component package
|
|
US3795845A
(en)
*
|
1972-12-26 |
1974-03-05 |
Ibm |
Semiconductor chip having connecting pads arranged in a non-orthogonal array
|
|
US4074342A
(en)
*
|
1974-12-20 |
1978-02-14 |
International Business Machines Corporation |
Electrical package for lsi devices and assembly process therefor
|
|
US3962052A
(en)
*
|
1975-04-14 |
1976-06-08 |
International Business Machines Corporation |
Process for forming apertures in silicon bodies
|
|
US3984620A
(en)
*
|
1975-06-04 |
1976-10-05 |
Raytheon Company |
Integrated circuit chip test and assembly package
|
|
US4126879A
(en)
*
|
1977-09-14 |
1978-11-21 |
Rca Corporation |
Semiconductor device with ballast resistor adapted for a transcalent device
|
|
US4322778A
(en)
*
|
1980-01-25 |
1982-03-30 |
International Business Machines Corp. |
High performance semiconductor package assembly
|
|
JPS609349B2
(ja)
*
|
1980-10-20 |
1985-03-09 |
三菱電機株式会社 |
ダイナミック・ランダム・アクセス半導体メモリ装置
|
|
JPS5843554A
(ja)
*
|
1981-09-08 |
1983-03-14 |
Mitsubishi Electric Corp |
半導体装置
|
|
US4761681A
(en)
*
|
1982-09-08 |
1988-08-02 |
Texas Instruments Incorporated |
Method for fabricating a semiconductor contact and interconnect structure using orientation dependent etching and thermomigration
|
|
JPS5987893A
(ja)
*
|
1982-11-12 |
1984-05-21 |
株式会社日立製作所 |
配線基板とその製造方法およびそれを用いた半導体装置
|
|
GB2136203B
(en)
*
|
1983-03-02 |
1986-10-15 |
Standard Telephones Cables Ltd |
Through-wafer integrated circuit connections
|
|
US5138438A
(en)
*
|
1987-06-24 |
1992-08-11 |
Akita Electronics Co. Ltd. |
Lead connections means for stacked tab packaged IC chips
|
|
US5166097A
(en)
*
|
1990-11-26 |
1992-11-24 |
The Boeing Company |
Silicon wafers containing conductive feedthroughs
|
|
US5614766A
(en)
*
|
1991-09-30 |
1997-03-25 |
Rohm Co., Ltd. |
Semiconductor device with stacked alternate-facing chips
|
|
JP3077316B2
(ja)
*
|
1991-10-30 |
2000-08-14 |
富士電機株式会社 |
集積回路装置
|
|
US5438224A
(en)
*
|
1992-04-23 |
1995-08-01 |
Motorola, Inc. |
Integrated circuit package having a face-to-face IC chip arrangement
|
|
US5625209A
(en)
*
|
1992-08-26 |
1997-04-29 |
Texas Instruments Incorporated |
Silicon based sensor apparatus
|
|
US5411400A
(en)
*
|
1992-09-28 |
1995-05-02 |
Motorola, Inc. |
Interconnect system for a semiconductor chip and a substrate
|
|
US5343071A
(en)
*
|
1993-04-28 |
1994-08-30 |
Raytheon Company |
Semiconductor structures having dual surface via holes
|
|
JPH09506712A
(ja)
*
|
1993-12-13 |
1997-06-30 |
ハネウエル・インコーポレーテッド |
赤外線デバイス用集積シリコン真空マイクロパッケージ
|
|
US5688716A
(en)
|
1994-07-07 |
1997-11-18 |
Tessera, Inc. |
Fan-out semiconductor chip assembly
|
|
US6848173B2
(en)
*
|
1994-07-07 |
2005-02-01 |
Tessera, Inc. |
Microelectric packages having deformed bonded leads and methods therefor
|
|
US6429112B1
(en)
*
|
1994-07-07 |
2002-08-06 |
Tessera, Inc. |
Multi-layer substrates and fabrication processes
|
|
FR2738395B1
(fr)
*
|
1995-08-31 |
1997-10-10 |
Commissariat Energie Atomique |
Dispositif autoporte pour la propagation d'ondes hyperfrequences et procedes de realisation d'un tel dispositif
|
|
US5739067A
(en)
*
|
1995-12-07 |
1998-04-14 |
Advanced Micro Devices, Inc. |
Method for forming active devices on and in exposed surfaces of both sides of a silicon wafer
|
|
US5817530A
(en)
*
|
1996-05-20 |
1998-10-06 |
Micron Technology, Inc. |
Use of conductive lines on the back side of wafers and dice for semiconductor interconnects
|
|
US5815427A
(en)
*
|
1997-04-02 |
1998-09-29 |
Micron Technology, Inc. |
Modular memory circuit and method for forming same
|
|
IL123207A0
(en)
*
|
1998-02-06 |
1998-09-24 |
Shellcase Ltd |
Integrated circuit device
|
|
US6137164A
(en)
*
|
1998-03-16 |
2000-10-24 |
Texas Instruments Incorporated |
Thin stacked integrated circuit device
|
|
US6036872A
(en)
|
1998-03-31 |
2000-03-14 |
Honeywell Inc. |
Method for making a wafer-pair having sealed chambers
|
|
SG82591A1
(en)
*
|
1998-12-17 |
2001-08-21 |
Eriston Technologies Pte Ltd |
Bumpless flip chip assembly with solder via
|
|
US7179740B1
(en)
*
|
1999-05-03 |
2007-02-20 |
United Microelectronics Corporation |
Integrated circuit with improved interconnect structure and process for making same
|
|
US6617681B1
(en)
*
|
1999-06-28 |
2003-09-09 |
Intel Corporation |
Interposer and method of making same
|
|
JP3735526B2
(ja)
*
|
2000-10-04 |
2006-01-18 |
日本電気株式会社 |
半導体装置及びその製造方法
|
|
JP4468609B2
(ja)
*
|
2001-05-21 |
2010-05-26 |
株式会社ルネサステクノロジ |
半導体装置
|
|
US6696320B2
(en)
*
|
2001-09-30 |
2004-02-24 |
Intel Corporation |
Low profile stacked multi-chip package and method of forming same
|
|
US7088074B2
(en)
*
|
2002-01-02 |
2006-08-08 |
International Business Machines Corporation |
System level device for battery and integrated circuit integration
|
|
DE10313047B3
(de)
*
|
2003-03-24 |
2004-08-12 |
Infineon Technologies Ag |
Verfahren zur Herstellung von Chipstapeln
|
|
KR100541393B1
(ko)
*
|
2003-04-26 |
2006-01-10 |
삼성전자주식회사 |
멀티칩 ｂｇａ 패키지
|
|
JP4263953B2
(ja)
*
|
2003-06-23 |
2009-05-13 |
三洋電機株式会社 |
半導体装置及びその製造方法
|
|
US7183653B2
(en)
*
|
2003-12-17 |
2007-02-27 |
Intel Corporation |
Via including multiple electrical paths
|
|
US20060038272A1
(en)
*
|
2004-08-17 |
2006-02-23 |
Texas Instruments Incorporated |
Stacked wafer scale package
|
|
US7276794B2
(en)
*
|
2005-03-02 |
2007-10-02 |
Endevco Corporation |
Junction-isolated vias
|
|
US8203202B2
(en)
*
|
2007-05-18 |
2012-06-19 |
Kabushiki Kaisha Nihon Micronics |
Stacked package and method for forming stacked package
|
|
KR100929464B1
(ko)
*
|
2007-12-21 |
2009-12-02 |
주식회사 동부하이텍 |
반도체칩, 이의 제조 방법 및 반도체칩 적층 패키지
|
|
KR20100023641A
(ko)
*
|
2008-08-22 |
2010-03-04 |
삼성전자주식회사 |
회로 기판을 관통하는 비아 플러그를 포함하는 반도체 칩, 반도체 칩 적층 구조 및 반도체 패키지
|
|
US8115292B2
(en)
*
|
2008-10-23 |
2012-02-14 |
United Test And Assembly Center Ltd. |
Interposer for semiconductor package
|
|
US7939926B2
(en)
*
|
2008-12-12 |
2011-05-10 |
Qualcomm Incorporated |
Via first plus via last technique for IC interconnects
|
|
SG183648A1
(en)
*
|
2011-02-28 |
2012-09-27 |
Agency Science Tech & Res |
A wafer level package and a method of forming the same
|
|
US8580675B2
(en)
|
2011-03-02 |
2013-11-12 |
Texas Instruments Incorporated |
Two-track cross-connect in double-patterned structure using rectangular via
|
|
DE102017107648A1
(de)
*
|
2016-04-08 |
2017-10-12 |
X-Fab Semiconductor Foundries Ag |
Elektrische Durchkontaktierung(en) in einem Halbleitersubstrat und ein zugehöriges Herstellverfahren
|